CN-121985782-A - Chip pickup device

CN121985782ACN 121985782 ACN121985782 ACN 121985782ACN-121985782-A

Abstract

The invention discloses a chip pickup device, which belongs to the technical field of chip packaging and manufacturing, wherein a mounting frame is provided with a first mounting plate, a rotation adjusting assembly comprises a rotation driving piece and an adapter, a rotation shaft of the rotation driving piece vertically penetrates through the first mounting plate, the adapter is connected with the rotation shaft, a balance buffer assembly comprises a second mounting plate, a third mounting plate, a guide unit and a first elastic piece, the third mounting plate is arranged between the second mounting plate and a horizontal part, the first elastic piece is abutted against the second mounting plate and the third mounting plate, the guide unit is arranged between the second mounting plate and the third mounting plate, and a pickup head assembly is arranged on the third mounting plate. The chip picking device provided by the invention can prevent the gravity of the picking head assembly from acting on the chip in the chip picking process, so that the acting force born by the chip in the picking process is reduced, the chip is synchronously lifted by vacuum adsorption while the ejector pin lifts up the film, and the lifting force on the chip in the ejector pin lifting process can be reduced.

Inventors

XU ZHOULONG
JIN ZUFEI
WANG JUN
LI TONG
YU BO
SUN WEIWEI

Assignees

武汉芯力科技术有限公司

Dates

Publication Date: 20260505
Application Date: 20251231

Claims (10)

1. A chip pickup apparatus for picking up a chip on a film, comprising: the vertical driving assembly comprises a moving end capable of vertically reciprocating; The mounting frame is arranged on the moving end and is provided with a first mounting plate; The rotary adjusting assembly comprises a rotary driving piece and an adapter piece, wherein the rotary driving piece is fixedly arranged on the top end surface of the first mounting plate, and a rotating shaft of the rotary driving piece vertically penetrates through the first mounting plate; The balance buffer assembly comprises a second mounting plate, a third mounting plate, a guide unit, a first elastic piece and a second elastic piece which extend vertically; the second mounting plate is arranged on the vertical part, the third mounting plate is arranged between the second mounting plate and the horizontal part, at least one first elastic piece is arranged on two lateral sides of the third mounting plate, and two ends of the first elastic piece are respectively abutted against the second mounting plate and the third mounting plate; two ends of the second elastic piece are respectively abutted against the third mounting plate and the horizontal part; the guide unit extends vertically and is arranged between the second mounting plate and the third mounting plate and used for guiding the third mounting plate to reciprocate vertically; the pick-up head assembly is fixedly arranged on the third mounting plate, the other end of the pick-up head assembly is provided with an adsorption end, and the adsorption end is positioned below the second mounting plate; When the elastic force generated by compression of each first elastic piece is equal to the sum of the gravity of the pickup head assembly, the third mounting plate and the second elastic piece, the second elastic piece is in a natural state.
2. The chip pickup apparatus according to claim 1, wherein the guide unit includes a guide rail extending in a vertical direction and a slider provided on the guide rail in a vertically sliding manner, the guide rail being fixedly mounted on the vertical portion, the slider being fixedly connected to the third mounting plate for providing a guide when the third mounting plate reciprocates in a vertical direction.
3. The chip pickup apparatus according to claim 1, wherein the second mounting plate includes a plurality of support plates, at least one of the support plates is provided on both lateral sides of the pickup head assembly, and at least one first elastic member is provided between the support plate and the third mounting plate.
4. The chip pick-up device according to claim 3, wherein the first elastic member is a first spring, the guide unit further comprises a guide hole and a fixed shaft, the guide hole vertically penetrates through the plate body of the third mounting plate, one end of the fixed shaft is fixedly mounted on the support plate, the other end of the fixed shaft vertically extends through the guide hole and is in sliding fit with the guide hole, and the first spring is coaxially sleeved on the fixed shaft.
5. The chip pickup apparatus according to any one of claims 1 to 4, wherein the mounting frame further comprises a connection plate, a vertical plate, and a plurality of reinforcing support plates; The connecting plate and the first mounting plate are respectively arranged on two sides of the vertical plate to form a mounting bracket with a Z-shaped structure, and at least one reinforcing support plate is arranged between the vertical plate and the connecting plate and between the vertical plate and the first mounting plate respectively.
6. The chip pickup apparatus according to any one of claims 1 to 4, further comprising a rotation limit assembly including a detection plate and two limit sensors; one end of the detection plate is fixedly arranged on the side wall surface of the vertical part, which is away from the horizontal part, and the other end of the detection plate is provided with a triggering part extending vertically; The two limit sensors are arranged on two sides of the trigger part, the top ends of the limit sensors are fixedly arranged on the bottom end face of the first mounting plate, and the bottom ends of the limit sensors are provided with induction grooves for stopping the rotation of the rotation driving part when the trigger part rotates along with the adapter part into the induction grooves.
7. The chip pickup apparatus according to any one of claims 1 to 4, wherein one end of the horizontal portion facing away from the vertical portion has a flange fixedly connected with the rotation shaft of the rotation driving member.
8. The chip pickup apparatus according to any one of claims 1 to 4, further comprising a displacement detection assembly including a displacement sensor and a motion bar; the displacement sensor is fixedly arranged on the first mounting plate, one end of the motion rod is fixedly connected with the third mounting plate, and the other end of the motion rod is in sliding fit with the displacement sensor and is used for detecting the relative motion of the motion rod relative to the displacement sensor.
9. The chip pickup apparatus according to any one of claims 1 to 4, wherein the pickup head assembly includes an adsorption chamber and a vacuum joint; The adsorption cavity is fixedly arranged on the bottom end face of the third mounting plate, and the other end of the adsorption cavity is provided with an adsorption end for adsorbing the chip; the vacuum connector is communicated with the adsorption cavity and used for connecting vacuum equipment.
10. The chip pickup apparatus according to any one of claims 1 to 4, wherein the mounting frame further comprises at least one baffle extending in a vertical direction, and a top of the baffle is fixedly mounted on both lateral sides of the first mounting plate.

Description

Chip pickup device Technical Field The invention belongs to the technical field of chip packaging and manufacturing, and particularly relates to a chip pick-up device. Background In the current chip Bonding technology (Bonding) in the semiconductor manufacturing process, the chip is first picked up from the carrier film, and then two smooth and clean chips are attached together by a physical or chemical method to assist the semiconductor manufacturing process or to form heterogeneous or heterogeneous wafer forming circuit connection with specific functions. In recent years, flexible film chips have a great deal of application requirements in various fields of manufacturing industry, education, medical treatment, information and the like, however, the use of conventional peeling and picking techniques can easily cause bending and chipping of ultrathin chips, which makes the peeling and picking techniques of flexible film chips extremely challenging. How to quickly and effectively realize the chip pickup with large area and thin thickness is one of the difficulties to be solved in the current semiconductor packaging field. In the chip stripping method in the prior art, a mode that the ejector pin directly ascends is generally adopted to jack up the film, so that the chip adhered to the film ascends, and then the edge of the chip is separated from the film, because the ejector pin is a metal piece with certain hardness and rigidity, the jacking speed and the jacking force of the ejector pin in the ascending process cannot be accurately controlled, and thus the ejector pin is extremely easy to cause cracking, deformation and brittle fracture of the flexible film chip when the chip is jacked up, and particularly, potential safety hazards exist when the flexible film chip with larger or thinner thickness is jacked up. Disclosure of Invention In order to overcome one or more of the defects or improvement requirements in the prior art, the invention provides a chip pickup device, which can prevent the gravity of a pickup head assembly from acting on a chip in the process of picking up the chip so as to reduce acting force born by the chip in the process of picking up the chip, and can also adsorb the chip in vacuum and synchronously lift up the chip while a thimble lifts up a film so as to reduce the lifting force to the chip in the process of lifting up the thimble, thereby avoiding the problems of cracking, deformation and brittle fracture of the chip in the process of picking up the chip in the bonding process, and is particularly suitable for picking up the flexible film chip. In order to achieve the above object, the present invention provides a chip pickup apparatus for picking up a chip on a film, comprising: the vertical driving assembly comprises a moving end capable of vertically reciprocating; The mounting frame is arranged on the moving end and is provided with a first mounting plate; The rotary adjusting assembly comprises a rotary driving piece and an adapter piece, wherein the rotary driving piece is fixedly arranged on the top end surface of the first mounting plate, and a rotating shaft of the rotary driving piece vertically penetrates through the first mounting plate; The balance buffer assembly comprises a second mounting plate, a third mounting plate, a guide unit, a first elastic piece and a second elastic piece which extend vertically; the second mounting plate is arranged on the vertical part, the third mounting plate is arranged between the second mounting plate and the horizontal part, at least one first elastic piece is arranged on two lateral sides of the third mounting plate, and two ends of the first elastic piece are respectively abutted against the second mounting plate and the third mounting plate; two ends of the second elastic piece are respectively abutted against the third mounting plate and the horizontal part; the guide unit extends vertically and is arranged between the second mounting plate and the third mounting plate and used for guiding the third mounting plate to reciprocate vertically; the pick-up head assembly is fixedly arranged on the third mounting plate, the other end of the pick-up head assembly is provided with an adsorption end, and the adsorption end is positioned below the second mounting plate; When the elastic force generated by compression of each first elastic piece is equal to the sum of the gravity of the pickup head assembly, the third mounting plate and the second elastic piece, the second elastic piece is in a natural state. The guide unit comprises a guide rail extending along the vertical direction and a sliding block arranged on the guide rail in a vertical sliding manner, wherein the guide rail is fixedly arranged on the vertical part, and the sliding block is fixedly connected with the third mounting plate and is used for providing guide when the third mounting plate reciprocates along the vertical direction. As a further preferred aspect of the p