Search

CN-121985789-A - Full-automatic wafer edge inspection and wafer back cleaning inspection machine

CN121985789ACN 121985789 ACN121985789 ACN 121985789ACN-121985789-A

Abstract

The invention relates to the technical field of wafer inspection, in particular to a full-automatic wafer edge inspection and wafer back cleaning inspection machine, which comprises a frame, a loading mechanism, a conveying mechanical arm, an appearance detection mechanism and a cleaning inspection mechanism, wherein the loading mechanism is fixedly arranged on the outer side of the frame, the conveying mechanical arm, the appearance detection mechanism and the cleaning inspection mechanism are fixedly arranged in the frame, the loading mechanism is positioned in front of the conveying mechanical arm, the appearance detection mechanism and the cleaning inspection mechanism are parallelly positioned behind the conveying mechanical arm, the loading mechanism comprises a loading station and a discharging station, the conveying mechanical arm sequentially transfers wafers from the loading station to the appearance detection mechanism, the cleaning inspection mechanism and the discharging station, the detection and cleaning efficiency is remarkably improved, the labor cost is reduced, secondary damage and pollution risks caused by improper manual operation are avoided, and reliable equipment is provided for improving the processing quality and the yield of the wafers.

Inventors

  • QI XIAOFENG
  • ZHOU PENGCHENG
  • MIAO HAIFEI

Assignees

  • 争丰半导体科技(苏州)有限公司

Dates

Publication Date
20260505
Application Date
20260205

Claims (10)

  1. 1. Full-automatic wafer edge inspection and clean inspection machine in back of body, including frame (1), loading mechanism (2), transport arm (3), outward appearance detection mechanism (4) and clean inspection mechanism (5), loading mechanism (2) are fixed to be established the outside of frame (1), transport arm (3), outward appearance detection mechanism (4) and clean inspection mechanism (5) are fixed to be established inside frame (1), loading mechanism (2) are located the place ahead of transport arm (3), outward appearance detection mechanism (4) and clean inspection mechanism (5) are located side by side the rear of transport arm (3), loading mechanism (2) are including material loading station (201) and unloading station (202), transport arm (3) are with the wafer follow material loading station (201) shifts gradually to outward appearance detection mechanism (4), clean inspection mechanism (5) and unloading station (202).
  2. 2. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 1, wherein the appearance detection mechanism (4) comprises an appearance detection substrate (41), a positioning mechanism (6) and an appearance detection camera assembly (42), the positioning mechanism (6) comprises a positioning sliding seat (61), a rotating table (62) and an electric lifting table (63), the appearance detection substrate (41) is fixedly arranged on the frame (1), the appearance detection camera assembly (42) is fixedly arranged on the appearance detection substrate (41), the positioning sliding seat (61) is slidably arranged on the appearance detection substrate (41), the rotating table (62) is rotatably arranged on the positioning sliding seat (61), a motor end of the electric lifting table (63) is fixedly arranged on the positioning sliding seat (61), a lifting end of the electric lifting table (63) penetrates through the center of the rotating table (62), the appearance detection camera assembly (42) is arranged above the positioning mechanism (6), a positioning plate (69) is fixedly arranged on the electric lifting table (63), and a plurality of positioning plates (69) are arranged on the positioning plate (69).
  3. 3. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 2, wherein the positioning mechanism (6) further comprises an X-axis electric push rod (64) and a Y-axis electric push rod (65), the positioning sliding seat (61) comprises an X-axis moving plate (66), a Y-axis moving plate (67) and a supporting frame (68), the X-axis moving plate (66) is slidably arranged on the appearance detection substrate (41), the Y-axis moving plate (67) is slidably arranged on the X-axis moving plate (66), a motor end of the X-axis electric push rod (64) is fixedly arranged on the appearance detection substrate (41), a push rod end of the X-axis electric push rod (64) is fixedly connected with the X-axis moving plate (66), a motor end of the Y-axis electric push rod (65) is fixedly arranged on the X-axis moving plate (66), a push rod end of the Y-axis electric push rod (65) is fixedly connected with the Y-axis moving plate (67), and the supporting frame (68) is fixedly arranged on the Y-axis moving plate (62) and the top of the rotating table (68).
  4. 4. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 1, wherein the cleaning inspection mechanism (5) comprises a cleaning inspection substrate (51), a cleaning table (52), a cleaning mechanism (7), a static eliminating mechanism (8) and a cleaning inspection camera assembly (53), the cleaning inspection substrate (51) is fixedly arranged on the frame (1), the cleaning table (52) is fixedly arranged on the cleaning inspection substrate (51), the cleaning mechanism (7) and the static eliminating mechanism (8) are slidingly arranged on the cleaning inspection substrate (51), the cleaning inspection camera assembly (53) is slidingly connected with the static eliminating mechanism (8), and the static eliminating mechanism (8) and the cleaning inspection camera assembly (53) are arranged above the cleaning table (52).
  5. 5. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 4, wherein the cleaning table (52) comprises a cleaning fixing seat (54) and an adsorption table (55), the cleaning fixing seat (54) is fixedly arranged on the cleaning inspection substrate (51), the adsorption table (55) is fixedly arranged on the cleaning fixing seat (54), and an annular array of cleaning suction cups (56) are arranged on the adsorption table (55).
  6. 6. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 4, wherein the cleaning mechanism (7) comprises a cleaning sliding seat (71), a cleaning mounting arm (72), a sweeping component (73) and a dust collecting component (74), the cleaning sliding seat (71) is slidably arranged on the cleaning inspection substrate (51), the cleaning mounting arm (72) is fixedly arranged on the cleaning sliding seat (71), the sweeping component (73) and the dust collecting component (74) are fixedly arranged on the cleaning mounting arm (72), and the dust collecting component (74) is located on the back side of the sweeping component (73).
  7. 7. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 6, wherein the blowing component (73) is a blowing air knife (75), an air inlet interface (76) is arranged on the blowing air knife (75), an air curtain outlet (751) is arranged at the bottom of the blowing air knife (75), the blowing air knife (75) is obliquely arranged, the air curtain outlet (751) points to the rear, the dust collecting component (74) comprises a dust collecting box (77) and an air suction interface (78), the dust collecting box (77) is fixedly arranged on the cleaning mounting arm (72), the air suction interface (78) is fixedly arranged at the top of the dust collecting box (77), and a suction slit (771) extending along the length direction of the dust collecting box (77) is formed at the bottom of the dust collecting box.
  8. 8. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 4, wherein the static electricity removing mechanism (8) comprises a static electricity removing sliding seat (81) and a static electricity removing assembly (82), the static electricity removing sliding seat (81) is slidably arranged on the cleaning inspection substrate (51), the static electricity removing assembly (82) is fixedly arranged on the static electricity removing sliding seat (81), the static electricity removing assembly (82) is an ion rod, and the cleaning inspection camera assembly (53) is slidably arranged on the static electricity removing sliding seat (81).
  9. 9. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 1, wherein the transporting mechanical arm (3) comprises a transporting substrate (31), a power base (32), a first mechanical arm (33), a second mechanical arm (34), a mechanical arm fixing seat (35) and a U-shaped mechanical arm (36), the transporting substrate (31) is fixedly arranged on the frame (1), the power base (32) is slidably arranged on the transporting substrate (31), one end of the first mechanical arm (33) is rotatably arranged at the top of the power base (32), the other end of the first mechanical arm (33) is rotatably connected with one end of the second mechanical arm (34), the other end of the second mechanical arm (34) is rotatably arranged at the bottom of the mechanical arm fixing seat (35), the U-shaped mechanical arm (36) is rotatably arranged at one side of the mechanical arm fixing seat (35), and a plurality of transporting sucking discs (37) are arranged on the U-shaped mechanical arm (36) in an array manner.
  10. 10. The full-automatic wafer edge inspection and wafer back cleaning inspection machine according to claim 1, wherein the loading station (201) and the unloading station (202) comprise a loading base (21), a fixed back plate (22), a loading platform (23), a positioning column (24), a clamping hook (25), a feeding component (26), an anti-slip sensor (27) and an open box component (28), the fixed back plate (22) is fixedly arranged on the frame (1), the loading base (21) is fixedly arranged on the outer side of the fixed back plate (22), the loading platform (23) is slidably arranged on the loading base (21), at least three positioning columns (24) are fixedly arranged on the loading platform (23), one side of each positioning column (24) is provided with a positioning sensor (29), the clamping hook (25) is rotatably arranged on the loading platform (23), the feeding component (26) is fixedly arranged on the outer side of the loading platform (23), and the anti-slip sensor (27) is fixedly arranged on the back plate (22) and is fixedly arranged on the open box component (28).

Description

Full-automatic wafer edge inspection and wafer back cleaning inspection machine Technical Field The invention relates to the technical field of wafer inspection, in particular to a full-automatic wafer edge inspection and wafer back cleaning inspection machine. Background In semiconductor manufacturing and packaging testing processes, wafer integrity and cleanliness are one of the key factors affecting the quality of subsequent processes and the final chip yield. If the edge of the wafer has the defects of micro gaps, cracks and the like, the wafer is easy to expand in the conveying and processing processes, so that the wafer is cracked or broken, not only is the material lost and the expensive equipment more likely to be polluted and damaged, but also the back of the wafer has the problems of poor focusing, unstable film adhesion and the like in the subsequent processes of photoetching, film deposition and the like if the back of the wafer has the pollutants of particles, stains and the like. Currently, inspection of wafer edge defects and backside cleaning in the industry is mostly still dependent on manual operations. The typical operation flow is that an operator takes out wafers one by one from a standard material box, uses a dust-free cloth or a special wiping tool to wipe and clean the back of the wafers manually, and then uses a magnifying glass to judge whether the edge of the wafers has defects such as gaps or cracks through naked eyes. The operation mode has obvious defects that firstly, the whole process is completely dependent on manpower, the automation degree is low, the efficiency is low, the labor cost is high, the manpower is wasted, secondly, the risk of introducing artificial damage and pollution is generated, the surface of the wafer is extremely easily scratched, collided with or polluted by the edge or brought into the product due to improper operation in the process of manually taking, carrying and wiping the wafer, thirdly, the consistency of a detection result and the cleaning quality is poor, the manual cleaning force, the path and the frequency are dependent on the experience of an operator, the cleaning effect cannot be quantified and uniformly controlled, the quality fluctuation among products is large, meanwhile, the manual visual inspection is easily influenced by factors such as fatigue, subjective judgment difference and the like, and the risk of missing detection and misjudgment is higher for the edge crack or notch of the micron level. Therefore, a need exists for a fully automated wafer edge inspection and wafer back cleaning inspection machine that addresses the above-described issues. Disclosure of Invention The invention aims to solve the problems in the background technology and provides a full-automatic wafer edge inspection and wafer back cleaning inspection machine. The technical aim of the invention is realized by the following technical scheme: Full-automatic wafer edge inspection and clean inspection machine of brilliant back of body, including frame, loading mechanism, transport arm, outward appearance detection mechanism and clean inspection mechanism, loading mechanism is fixed to be established the outside of frame, transport arm, outward appearance detection mechanism and clean inspection mechanism are fixed to be established inside the frame, loading mechanism is located transport arm's the place ahead, outward appearance detection mechanism and clean inspection mechanism are located side by side transport arm's rear, loading mechanism includes material loading station and unloading station, transport arm will the wafer certainly material loading station shifts gradually to outward appearance detection mechanism, clean inspection mechanism and unloading station. Preferably, the appearance detection mechanism comprises an appearance detection substrate, a positioning mechanism and an appearance detection camera assembly, the positioning mechanism comprises a positioning sliding seat, a rotary table and an electric lifting table, the appearance detection substrate is fixedly arranged on the rack, the appearance detection camera assembly is fixedly arranged on the appearance detection substrate, the positioning sliding seat is slidably arranged on the appearance detection substrate, the rotary table is rotatably arranged on the positioning sliding seat, the motor end of the electric lifting table is fixedly arranged on the positioning sliding seat, the lifting end of the electric lifting table passes through the center of the rotary table, the appearance detection camera assembly is positioned above the positioning mechanism, a positioning plate is fixedly arranged on the electric lifting table, and a plurality of positioning adsorption holes are formed in an array on the positioning plate; the positioning plate is lifted along with the electric lifting platform, receives the wafer from the conveying mechanical arm, then descends until the wafer is contacted