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CN-121985793-A - Fine mask and manufacturing method thereof

CN121985793ACN 121985793 ACN121985793 ACN 121985793ACN-121985793-A

Abstract

The invention discloses a fine mask plate and a manufacturing method thereof, belonging to the technical field of manufacturing of display panels, wherein the manufacturing method comprises the steps of forming a mask plate main body with an array pixel opening and a patterned conductive layer on the mask plate main body on one side of a supporting substrate; and finally, forming a grounded electrostatic shielding layer on the back surface of the support substrate and the inner wall of the opening. The mask plate comprises a supporting substrate with an opening, a mask plate main body arranged on the supporting substrate, a conductive layer which is patterned on the mask plate main body and has an opening larger than the pixel opening, and an electrostatic shielding layer which covers the back surface of the supporting substrate and the inner wall of the opening. According to the invention, the manufacturing cost and the process complexity of the fine mask plate with the electrostatic shielding function are obviously reduced by optimizing the process flow and the three-dimensional shielding structure, the interference of the electrostatic adsorption electric field on the evaporation material is effectively shielded, and the evaporation precision and the yield are improved.

Inventors

  • LIU CHENGYUAN

Assignees

  • 安徽熙泰智能科技有限公司

Dates

Publication Date
20260505
Application Date
20260127

Claims (10)

  1. 1. The manufacturing method of the fine mask plate is characterized by being used for evaporating a light-emitting unit and comprising the following steps of: Manufacturing a mask main body (2) on one side of a support substrate (1), wherein the mask main body (2) is provided with first opening areas which are arranged in an array manner and rib areas (16) which are arranged between the adjacent first opening areas, the first opening areas correspond to display areas of a display panel, and pixel openings (5) which are arranged in an array manner are arranged in the first opening areas; manufacturing a conductive layer (4) on one side of the mask plate main body (2) far away from the support substrate (1); Patterning a side of the support substrate (1) away from the mask body (2) so that the support substrate (1) exposes the mask body (2) in the first opening region through a plurality of second openings (3); An electrostatic shielding layer (6) is produced on the side of the mask plate body (2) remote from the conductive layer (4) such that the electrostatic shielding layer (6) covers the sides and the bottom of the mask plate body (2) and the second opening (3).
  2. 2. The manufacturing method according to claim 1, wherein manufacturing the reticle body (2) on one side of the support substrate (1) comprises: Forming a polyimide precursor layer on one side of a support substrate (1); Performing heat treatment on the polyimide precursor layer at a set temperature to completely solidify the polyimide precursor layer, thereby obtaining an initial mask main body; And patterning the initial mask body under the mask of the first mask to obtain a mask body (2).
  3. 3. Manufacturing method according to claim 1, characterized in that the manufacturing of the conductive layer (4) on the side of the mask blank body (2) remote from the support substrate (1) comprises: Manufacturing an initial conductive layer on one side of the mask plate main body (2) far away from the support substrate (1); Patterning the initial conductive layer under the mask of a second mask plate to obtain a conductive layer (4), wherein the conductive layer (4) corresponding to the first opening area is provided with conductive layer openings (9) which are arranged in an array, the conductive layer openings (9) are larger than the pixel openings (5), and the conductive layer (4) corresponding to the rib area is provided with first evaporation alignment holes (10).
  4. 4. The method of manufacturing according to claim 1, characterized in that after the conductive layer (4) is manufactured on the side of the reticle body (2) remote from the support substrate (1), the method of manufacturing further comprises, before patterning the side of the support substrate (1) remote from the reticle body (2): a UV film (14) is produced on the side of the conductive layer (4) remote from the support substrate (1).
  5. 5. The method of manufacturing according to claim 4, wherein the material of the support substrate (1) is silicon, and patterning the side of the support substrate (1) remote from the reticle body (2) comprises: manufacturing a photoresist mask on one side of the support substrate (1) far from the mask body (2); Patterning the support substrate under the photoresist mask, so that the support substrate (1) exposes the mask body (2) in the first opening area, and so that the side part of the support substrate (1) is provided with a second evaporation alignment hole (11).
  6. 6. The manufacturing method according to claim 5, characterized in that after patterning the side of the support substrate (1) remote from the reticle main body (2), the manufacturing method further comprises, before manufacturing the electrostatic shielding layer (6) on the side of the reticle main body (2) remote from the conductive layer (4): And (3) sticking polyimide adhesive tape to at least one side wall of the support substrate (1) and the second evaporation alignment hole (11).
  7. 7. The method of manufacturing according to claim 4, wherein the material of the support substrate is one or more of stainless steel, invar, glass, or polymer; before manufacturing the reticle body (2) on one side of the support substrate (1), the manufacturing method further comprises: processing the support substrate (1) so that the support substrate is provided with initial openings (13) which are arranged in an array, wherein the initial openings (13) are used for corresponding to a display area of a display panel, and the support substrate (1) is provided with third evaporation alignment holes (12); And filling the initial opening (13) and the third evaporation alignment hole (12), wherein the material of the filler is different from that of the supporting substrate (1).
  8. 8. The method of claim 7, wherein the filler is selected from one or more of lead, tin, aluminum, hot melt wax, and hot melt adhesive.
  9. 9. The method of manufacturing according to claim 8, wherein patterning a side of the support substrate (1) remote from the reticle body (2) comprises: And removing the filler from the support substrate (1) by adopting a chemical dissolution, heating melting or solvent dissolution mode.
  10. 10. A fine reticle, characterized in that it is made by the method of any one of claims 1 to 9, comprising: A supporting substrate (1) having a plurality of second openings (3) arranged in an array, each of the second openings (3) corresponding to a display area of a display panel; The mask plate main body (2) is arranged on the first surface of the supporting substrate (1), the mask plate main body (2) is provided with first opening areas which are arranged in an array manner, rib areas (16) which are arranged between the adjacent first opening areas, the first opening areas correspond to display areas of the display panel, and pixel openings (5) which are arranged in an array manner are arranged in the first opening areas; the conducting layer (4) is arranged on the mask plate main body (2) in a patterning way, conducting layer openings (9) are formed in the vertical projection position of each pixel opening (5), and the size of each conducting layer opening (9) is larger than that of each pixel opening (5); an electrostatic shielding layer (6) configured to be grounded and to cover the second surface and the side surfaces of the support substrate (1) and the mask layout main body (2).

Description

Fine mask and manufacturing method thereof Technical Field The invention belongs to the technical field of manufacturing of display panels, and particularly relates to a fine mask and a manufacturing method thereof. Background In the manufacturing process of display panels, particularly high-resolution OLED display panels, it is generally required to precisely deposit an organic light emitting material in a specific pixel region of a substrate through a vacuum thermal evaporation process using a fine metal mask plate. Conventional reticles are typically made of low coefficient of thermal expansion materials and are attached to the substrate by external magnetic attraction. However, the magnetic adsorption method is prone to problems such as uneven adsorption and sagging of the template, which affects the vapor deposition accuracy. In order to solve this problem, an electrostatic adsorption type mask plate has been proposed in the prior art, in which a conductive layer is provided on the surface of the mask plate, and electrostatic is applied to cause the mask plate to be tightly adsorbed on a conductive substrate. However, the scheme introduces a new problem that an electric field generated by the electrostatic adsorption conductive layer can interfere with the moving track of the gas-phase organic material, so that the material is adsorbed on the side wall of the opening of the mask plate or a non-opening area. Disclosure of Invention The invention aims to solve the problems in the prior art and provides a fine mask and a manufacturing method thereof. The invention discloses a manufacturing method of a fine mask plate, which is used for evaporating a light-emitting unit and comprises the following steps: Manufacturing a mask plate main body on one side of a support substrate, wherein the mask plate main body is provided with first opening areas which are arranged in an array manner and rib areas which are arranged between the adjacent first opening areas, the first opening areas correspond to display areas of a display panel, and pixel openings which are arranged in an array manner are arranged in the first opening areas; Manufacturing a conductive layer on one side of the mask plate main body far away from the support substrate; patterning one side of the support substrate away from the mask body so that the support substrate exposes the mask body in the first opening region through a plurality of second openings; And manufacturing an electrostatic shielding layer on one side of the mask plate main body away from the conductive layer, so that the electrostatic shielding layer covers the mask plate main body and the side parts and the bottom parts of the second opening. In the above method, manufacturing a reticle body on one side of a support substrate includes: Forming a polyimide precursor layer on one side of a support substrate; Performing heat treatment on the polyimide precursor layer at a set temperature to completely solidify the polyimide precursor layer, thereby obtaining an initial mask main body; and patterning the initial mask body under the mask of the first mask to obtain a mask body. In the above method, manufacturing a conductive layer on a side of the mask blank body away from the support substrate, including: manufacturing an initial conductive layer on one side of the mask plate main body away from the support substrate; And patterning the initial conductive layer under the mask of the second mask plate to obtain a conductive layer, wherein the conductive layer corresponding to the first opening area is provided with conductive layer openings which are arranged in an array, the conductive layer openings are larger than the pixel openings, and the conductive layer corresponding to the rib area is provided with first evaporation alignment holes. In the above method, after the conductive layer is manufactured on the side of the mask blank main body away from the support substrate, and before patterning the side of the support substrate away from the mask blank main body, the manufacturing method further includes: a UV film is fabricated on the side of the conductive layer remote from the support substrate. In the above method, the material of the support substrate is silicon, and patterning the side of the support substrate away from the mask body includes: Manufacturing a photoresist mask on one side of the support substrate away from the mask body; And patterning the support substrate under the photoresist mask, so that the support substrate exposes the mask body in the first opening area, and the side part of the support substrate is provided with a second evaporation alignment hole. In the above method, after patterning the side of the support substrate away from the mask blank body, before manufacturing the electrostatic shielding layer on the side of the mask blank body away from the conductive layer, the manufacturing method further includes: and aligning Kong Niantie the polyimide