CN-121985820-A - Radio frequency front end module

CN121985820ACN 121985820 ACN121985820 ACN 121985820ACN-121985820-A

Abstract

The invention discloses a radio frequency front-end module, which relates to the technical field of radio frequency front-ends and is used for realizing efficient heat dissipation of a power amplifier chip and ensuring the reliability of the radio frequency front-end module. The radio frequency front end module comprises a substrate, a plurality of chips and a heat dissipation heat sink, wherein the substrate comprises a first surface and a second surface which are opposite in the thickness direction, a first through hole penetrating through the first surface and the second surface is formed in the substrate, the chips are sequentially stacked on the first surface of the substrate and are connected with each other in a conductive mode, the chips adjacent to the first surface are connected to the substrate in a conductive mode, one of the chips is a power amplifier chip, the heat dissipation heat sink is arranged on one side of the second surface of the substrate, and the heat dissipation heat sink is provided with a protruding portion, and at least penetrates through the first through hole and extends to be in contact with the power amplifier chip.

Inventors

LI YEYE
CHEN CHUAN
LI JUN
FU RONG

Assignees

中国科学院微电子研究所

Dates

Publication Date: 20260505
Application Date: 20260204

Claims (10)

1. A radio frequency front end module, comprising: the substrate comprises a first surface and a second surface which are opposite in the thickness direction, and a first through hole penetrating through the first surface and the second surface is formed in the substrate; The chips are sequentially stacked on the first surface of the substrate, are connected with each other in a conductive mode, are adjacent to the first surface and are connected with the substrate in a conductive mode, and one of the chips is a power amplifier chip; The heat dissipation heat sink is arranged on one side of the second surface of the substrate and is provided with a protruding portion, and the protruding portion at least penetrates through the first through hole and extends to be in contact with the power amplifier chip.
2. The rf front-end module of claim 1, wherein the power amplifier chip has opposite upper and lower surfaces, the lower surface being adjacent to the substrate, the lower surface of the power amplifier chip being blind-drilled, and the end of the protrusion adjacent to the power amplifier chip being located within the blind-drilled.
3. The radio frequency front end module of claim 2, wherein an end of the protrusion proximate to the power amplifier chip is soldered to the power amplifier chip.
4. The rf front-end module of claim 2, wherein the upper surface of the power amplifier chip has a hot spot region, and the blind hole corresponds to a position of the hot spot region.
5. The rf front-end module of claim 4, the boundary of the hot spot area being located within a projected area of the blind via on the hot spot area or the boundary of the hot spot area coinciding with the boundary of the projected area.
6. The rf front-end module of claim 1, wherein a cooling medium channel is formed in the protruding portion, the rf front-end module further comprises a first pipeline and a second pipeline, the first pipeline and the second pipeline are disposed in the heat sink and are both communicated with the cooling medium channel, the first pipeline is used for introducing the cooling medium into the cooling medium channel, and the second pipeline is used for discharging the cooling medium.
7. The rf front-end module of claim 6, wherein an inlet manifold and an outlet manifold are further provided in the heat sink, the inlet manifold is in communication with the first conduit, the outlet manifold is in communication with the second conduit, the cooling medium channels are plural, the cooling medium channels extend along the extending direction of the protrusion, and the cooling medium channels have two ends respectively in communication with the inlet manifold and the outlet manifold.
8. The rf front-end module of claim 6, wherein the cooling medium channel is a continuous bent channel, and two ends of the cooling medium channel are respectively connected to the first pipeline and the second pipeline.
9. The radio frequency front end module according to claim 1, wherein the plurality of chips comprises an antenna chip, a power amplifier chip and a signal processing chip which are sequentially arranged from top to bottom, the antenna chip, the power amplifier chip and the signal processing chip are connected with each other through micro bumps or solder balls, a second through hole is formed in the signal processing chip along the direction from the first surface to the second surface, and the protruding portion sequentially penetrates through the first through hole and the second through hole.
10. The radio frequency front end module of claim 1, wherein the heat sink material comprises a copper alloy or silicon carbide.

Description

Radio frequency front end module Technical Field The invention relates to the technical field of radio frequency front ends, in particular to a radio frequency front end module. Background With the rapid development of 5G communication, millimeter wave communication and high frequency and high speed application, the radio frequency communication system evolves towards high integration, miniaturization and high power consumption, and the heating problem of the power amplifier chip in the radio frequency front-end module is increasingly prominent. In the prior art, bump solder balls, a substrate metal layer or an external radiator are generally introduced in the three-dimensional integrated package to transfer heat, and although the method can reduce the overall temperature rise to a certain extent, the heat dissipation path is mainly concentrated on the outer side of a chip or the substrate layer, and is difficult to directly act on a power amplifier chip. With the continuous increase of power of the power amplifier chip, the prior art cannot realize efficient heat dissipation of the power amplifier chip. Disclosure of Invention The invention aims to provide a radio frequency front-end module which is used for realizing efficient heat dissipation of a power amplifier chip so as to ensure the reliability of the radio frequency front-end module. In order to achieve the above object, the present invention provides the following technical solutions: A radio frequency front end module comprising: the substrate comprises a first surface and a second surface which are opposite in the thickness direction, and a first through hole penetrating through the first surface and the second surface is formed in the substrate; The chips are sequentially stacked on the first surface of the substrate, are connected with each other in a conductive mode, are adjacent to the first surface and are connected with the substrate in a conductive mode, and one of the chips is a power amplifier chip; The heat dissipation heat sink is arranged on one side of the second surface of the substrate and is provided with a protruding portion, and the protruding portion at least penetrates through the first through hole and extends to be in contact with the power amplifier chip. Optionally, in the radio frequency front end module, the power amplifier chip has an upper surface and a lower surface opposite to each other, the lower surface is close to the substrate, a blind hole is formed in the lower surface of the power amplifier chip, and one end of the protrusion close to the power amplifier chip is located in the blind hole. Optionally, in the radio frequency front end module, an end of the protruding portion, which is close to the power amplifier chip, is welded to the power amplifier chip. Optionally, in the radio frequency front end module, the upper surface of the power amplifier chip has a hot spot area, and the blind hole corresponds to the hot spot area. Optionally, in the radio frequency front end module, a boundary of the hot spot area is located in a projection area of the blind hole on the hot spot area, or the boundary of the hot spot area coincides with the boundary of the projection area. Optionally, in the above-mentioned radio frequency front end module, the cooling working medium channel is set up in the bulge, and the radio frequency front end module still includes first pipeline and second pipeline, and first pipeline and second pipeline set up in the heat sink that dispels the heat and all communicate with the cooling working medium channel, and first pipeline is used for letting in cooling working medium to cooling working medium channel, and the second pipeline is used for discharging cooling working medium. Optionally, in the radio frequency front end module, an inlet manifold and an outlet manifold are further formed in the heat dissipation heat sink, the inlet manifold is communicated with the first pipeline, the outlet manifold is communicated with the second pipeline, the number of cooling working medium channels is multiple, the cooling working medium channels extend along the extending direction of the protruding portion, and the cooling working medium channels are respectively communicated with two ends of the inlet manifold and two ends of the outlet manifold. Optionally, in the radio frequency front end module, the cooling working medium channel is a continuous bending channel, and two ends of the cooling working medium channel are respectively communicated with the first pipeline and the second pipeline. Optionally, in the radio frequency front end module, the plurality of chips include an antenna chip, a power amplifier chip and a signal processing chip that are sequentially set from top to bottom, the antenna chip, the power amplifier chip and the signal processing chip are connected with each other through micro bumps or solder balls, a second through hole is formed in the signal processing chip along the dir