CN-121985821-A - Integrated passive device, manufacturing method thereof and electronic equipment

CN121985821ACN 121985821 ACN121985821 ACN 121985821ACN-121985821-A

Abstract

The integrated passive device comprises a substrate, a heat dissipation column, an insulating layer and at least two heat dissipation layers, wherein the heat dissipation column is arranged in a heat dissipation via hole and is connected with any two adjacent heat dissipation layers. The heat can be conducted forward or backward on the heat dissipation layer between the insulating layer and the substrate, the heat dissipation layer between the adjacent insulating layers, and the heat dissipation layer on one side, far away from the substrate, of the insulating layer or on the second surface of the substrate, of the insulating layer, so that the heat in the integrated passive device is conducted out to the surface of the integrated passive device, the heat on the surface of the integrated passive device can be uniformly diffused to various positions in the integrated passive device, the risk of failure of the insulating layer caused by heat aggregation is reduced, and the influence on the service life of the integrated passive device is reduced. A method for manufacturing the integrated passive device and electronic equipment comprising the integrated passive device are also provided.

Inventors

LI HUIYING
AN QICHANG
WU YIFAN
ZHAO YINGYING
SONG JINGSI

Assignees

北京京东方传感技术有限公司
京东方科技集团股份有限公司

Dates

Publication Date: 20260505
Application Date: 20241031

Claims (15)

1. An integrated passive device, comprising: a substrate having a first surface and a second surface disposed opposite each other; The passive device body comprises an insulating layer, a conductive layer and conductive columns, wherein the insulating layer is arranged between any two adjacent conductive layers, conductive through holes are formed in the insulating layer, heat dissipation through holes are formed in the insulating layer and/or the substrate, the conductive columns are arranged in the conductive through holes, and the conductive columns are connected with any two adjacent conductive layers; At least two heat dissipation layers arranged between the insulating layers and the substrate, between two adjacent insulating layers and at one side of the insulating layer farthest from the substrate away from the substrate or at the second surface of the substrate; and the heat dissipation column is arranged in the heat dissipation via hole and is connected with any two adjacent heat dissipation layers.
2. The integrated passive device of claim 1, wherein the at least two conductive layers comprise a first conductive layer and a second conductive layer, the insulating layer comprises a first insulating layer, the first conductive layer comprises a first conductive portion and a first conductive via, the passive device body further comprises a dielectric layer and a second conductive post, the first conductive plate is disposed on the first surface of the substrate, the dielectric layer is disposed on a side of the first conductive plate away from the substrate, the second conductive plate is disposed on a side of the dielectric layer away from the substrate, the first insulating layer covers the first conductive portion, the second conductive plate, the dielectric layer, the first conductive plate and the first conductive portion, the conductive via comprises a first conductive via and a second conductive via, the first conductive via and the second conductive via are disposed on the first insulating layer, the first conductive post is disposed in the first conductive via and the second conductive post, the second conductive via is disposed in the first conductive post and the second conductive layer, and the conductive via is disposed in the second conductive post.
3. The integrated passive device of claim 2, wherein the passive device body further comprises a third conductive layer and a second insulating layer, the second insulating layer is disposed on a side of the second conductive layer away from the substrate, the third conductive layer is disposed on a side of the second insulating layer away from the substrate, the third conductive layer comprises a second conductive portion and a third conductive portion, the conductive via further comprises a third conductive via and a fourth conductive via, the third conductive via and the fourth conductive via are disposed on the second insulating layer, the conductive post further comprises a third conductive post and a fourth conductive post, the third conductive post is disposed in the third conductive via, the fourth conductive post is disposed in the fourth conductive via, the third conductive post is connected with the second conductive layer and the second conductive portion, respectively, and the fourth conductive post is connected with the second conductive layer and the third conductive portion, respectively.
4. The integrated passive device of claim 3, wherein the passive device body further comprises a third insulating layer, a first conductive pin, and a second conductive pin, the third insulating layer being disposed on a side of the third conductive layer remote from the substrate, the first conductive pin and the second conductive pin being connected to the second conductive layer through the third insulating layer, respectively.
5. The integrated passive device of claim 4, wherein the heat dissipation layer comprises a first heat dissipation layer, a second heat dissipation layer, and a third heat dissipation layer, the first heat dissipation layer is disposed in the same layer as the first conductive layer, the second heat dissipation layer is disposed in the same layer as the second conductive layer, the third heat dissipation layer is disposed in the same layer as the third conductive layer, the heat dissipation via comprises a first heat dissipation via and a second heat dissipation via, the first heat dissipation via penetrates the first insulating layer, the second heat dissipation via penetrates the second insulating layer, a first heat dissipation post is disposed in the first heat dissipation via, a second heat dissipation post is disposed in the second heat dissipation via, the first heat dissipation post is connected with the first heat dissipation layer and the second heat dissipation layer, and the second heat dissipation post is connected with the second heat dissipation layer and the third heat dissipation layer, respectively.
6. The integrated passive device of claim 5, wherein the heat dissipation layer further comprises a fourth heat dissipation layer disposed on the same layer as the first conductive pin, the heat dissipation via further comprises a third heat dissipation via penetrating through the third insulating layer, a third heat dissipation post is disposed in the third heat dissipation via, the third heat dissipation post is connected to the fourth heat dissipation layer respectively, a pin through hole is disposed on the fourth heat dissipation layer, and the first conductive pin and the second conductive pin penetrate through the pin through hole and are disposed at intervals from the pin through hole.
7. The integrated passive device of claim 1, wherein the heat dissipation layer is provided with a plurality of heat dissipation openings, and the plurality of heat dissipation openings are arranged on the surface of the heat dissipation layer in an array.
8. The integrated passive device of claim 1, wherein the heat dissipation layer includes a plurality of heat dissipation units and heat dissipation connection sections that are disposed at intervals, the heat dissipation units include a first heat dissipation section and a second heat dissipation section, the first heat dissipation section is provided in two, the two first heat dissipation sections extend along a first direction and are disposed at intervals along a second direction, the second heat dissipation section extends along the second direction and is respectively connected to one ends of the two first heat dissipation sections, and the heat dissipation connection sections are connected to the other ends of the two adjacent heat dissipation units that are adjacent to each other and are adjacent to the second heat dissipation sections, and the second direction intersects the first direction.
9. The integrated passive device of claim 1, wherein a side of the heat spreader layer remote from the substrate is provided with a plurality of bumps, the bumps having the same or different heights.
10. The integrated passive device of claim 9, wherein a recess is formed between two adjacent protrusions, the protrusions and the recess having a rectangular, arcuate or saw-tooth cross-sectional shape.
11. The integrated passive device of claim 5, further comprising a first heat sink pin and a second heat sink pin, the first heat sink pin and the second heat sink pin being connected to the third heat sink layer through the third insulating layer, respectively.
12. The integrated passive device of claim 11, wherein the first conductive pin or the second conductive pin is configured to input a ground signal, and wherein the first heat sink pin and/or the second heat sink pin is connected to the first conductive pin or the second conductive pin.
13. The integrated passive device of claim 5, further comprising a fourth heat spreader layer disposed on the second side of the substrate, the heat spreader via further comprising a fourth heat spreader via extending through the first and second sides of the substrate, a fourth heat spreader post disposed within the fourth heat spreader via, the fourth heat spreader post being respectively coupled to the first and fourth heat spreader layers.
14. The integrated passive device of claim 5, further comprising an adhesion layer disposed between the substrate and the first heat sink layer and the first conductive layer.
15. An electronic device comprising an integrated passive device as claimed in any one of claims 1 to 14.

Description

Integrated passive device, manufacturing method thereof and electronic equipment Technical Field The invention relates to the technical field of passive devices, in particular to an integrated passive device, a manufacturing method thereof and electronic equipment. Background Integrated passive devices generate a significant amount of heat during operation. After the device generates heat, the heat can be quickly conducted along the conductive layer, and more heat can be gathered at the interface between the conductive layer and the insulating layer. The heat build-up may risk exceeding the upper temperature resistance of the insulating layer, leading to failure of the insulating layer, affecting the operating life of the integrated passive device. It should be noted that the information of the present invention in the above background section is only for enhancing the understanding of the background of the present invention and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art. Disclosure of Invention The invention aims to overcome the defects of the prior art and provides an integrated passive device, a manufacturing method thereof and electronic equipment. According to one aspect of the invention, an integrated passive device is provided, the integrated passive device comprises a substrate, a passive device body, at least two heat dissipation layers and a heat dissipation column, the substrate is provided with a first surface and a second surface which are oppositely arranged, the passive device body comprises an insulating layer, a conductive layer and a conductive column, the insulating layer is arranged between any two adjacent conductive layers, a conductive via hole is arranged on the insulating layer, the insulating layer and/or the substrate is provided with the heat dissipation via hole, the conductive column is arranged in the conductive via hole, the conductive column is connected with any two adjacent conductive layers, at least two heat dissipation layers are arranged between the insulating layer and the substrate, the adjacent two insulating layers are connected with one side of the insulating layer farthest from the substrate or the second surface of the substrate, and the heat dissipation column is arranged in the heat dissipation via hole and is connected with any two adjacent heat dissipation layers. In one embodiment of the invention, the at least two conductive layers comprise a first conductive layer and a second conductive layer, the insulating layer comprises a first insulating layer, the first conductive layer comprises a first conductive portion and a first conductive plate, the passive device body further comprises a dielectric layer and a second conductive plate, the first conductive plate is arranged on the first surface of the substrate, the dielectric layer is arranged on one side, far away from the substrate, of the first conductive plate, the second conductive plate is arranged on one side, far away from the substrate, of the dielectric layer, the first insulating layer covers the first conductive portion, the second conductive plate, the dielectric layer, the first conductive plate and the first conductive portion, the conductive via comprises a first conductive via and a second conductive via, the conductive post comprises a first conductive post and a second conductive post, the first conductive via and the second conductive via are arranged on the first insulating layer, the first conductive post is arranged in the first conductive via, the second conductive post is arranged in the second conductive via, the second conductive layer is connected with the first conductive portion through the first conductive post, and the second conductive layer is connected with the second conductive plate through the second conductive post. In one embodiment of the present invention, the passive device body further includes a third conductive layer and a second insulating layer, the second insulating layer is disposed on a side of the second conductive layer away from the substrate, the third conductive layer is disposed on a side of the second insulating layer away from the substrate, the third conductive layer includes a second conductive portion and a third conductive portion, the conductive via further includes a third conductive via and a fourth conductive via, the third conductive via and the fourth conductive via are disposed on the second insulating layer, the conductive column further includes a third conductive column and a fourth conductive column, the third conductive via is disposed therein with a third conductive column, the fourth conductive via is disposed therein with a fourth conductive column, the third conductive column is connected with the second conductive layer and the second conductive portion, respectively, and the fourth conductive column is connected with the second conductive layer and t