CN-121985822-A - Electronic device, manufacturing method thereof and electronic equipment

Abstract

The embodiment of the application provides an electronic device, a manufacturing method thereof and electronic equipment, and aims to improve the heat dissipation capacity of the electronic device. The embodiment of the application provides an electronic device, wherein a first chip and a second chip are arranged in a plastic package in a stacked manner, a heat conducting structure is arranged between the first chip and the second chip, one end of the heat conducting structure is exposed on the surface of the plastic package, so that heat generated by the first chip and the second chip is transferred to the heat conducting structure, one end of the heat conducting structure exposed on the surface of the plastic package is transferred to the outside of the plastic package, and the heat dissipation of the first chip and the second chip in the plastic package in the vertical direction is improved, so that the heat dissipation capacity of the electronic device is improved.

Inventors

• WANG JIAMING
• JIANG SHANGXUAN
• ZHAO NAN
• HAN CHAO
• REN YIWEI

Assignees

• 华为技术有限公司

Dates

Publication Date

20260505

Application Date

20241031

Claims (17)

1. 1. An electronic device, comprising: a plastic package piece; The first chip and the second chip are positioned in the plastic package, and are arranged in a stacked manner; A thermally conductive structure between the first chip and the second chip, one end of the heat conduction structure is exposed on the surface of the plastic package.
2. 2. The electronic device of claim 1, further comprising a first wiring layer between the first chip and the second chip, the first chip and the second chip being connected by the first wiring layer, the thermally conductive structure being between the first wiring layer and the first chip.
3. 3. The electronic device of claim 2, wherein a side of the first chip facing the first wiring layer is provided with a first sub-pad and a second sub-pad, the first sub-pad and the second sub-pad are both connected to the first wiring layer, the first sub-pad and the second sub-pad are disposed at intervals, and the heat conductive structure is located between the first sub-pad and the second sub-pad.
4. 4. The electronic device according to claim 3, wherein the heat conductive structure includes a first heat conductive portion located between the first wiring layer and the first chip, an extending direction of the first heat conductive portion is perpendicular to an arrangement direction of the first sub-pad and the second sub-pad, and one end of the first heat conductive portion in an extending direction thereof is exposed at a surface of the plastic package.
5. 5. The electronic device of claim 3, wherein the thermally conductive structure further comprises a first thermally conductive portion and a second thermally conductive portion, the second thermally conductive portion being connected to an end of the thermally conductive structure, an end of the second thermally conductive portion remote from the first thermally conductive portion being exposed at a surface of the plastic package remote from the second chip.
6. 6. The electronic device according to claim 5, wherein the heat conducting structure further includes a third heat conducting portion, the first heat conducting portion has a first end and a second end in an extending direction thereof, the second heat conducting portion is connected to the first end, the third heat conducting portion is connected to the second end, and an end of the third heat conducting portion away from the first heat conducting portion is exposed at a side surface of the plastic package away from the second chip.
7. 7. The electronic device according to claim 6, wherein an extending direction of the first heat conduction portion is perpendicular to an arrangement direction of the first sub-pad and the second sub-pad, an extending direction of the second heat conduction portion is perpendicular to an extending direction of the first heat conduction portion, and an extending direction of the third heat conduction portion is perpendicular to an extending direction of the first heat conduction portion.
8. 8. The electronic device of claim 1, further comprising a first wiring layer between the first chip and the second chip, the first chip and the second chip being connected by the first wiring layer, the thermally conductive structure being between the first wiring layer and the second chip.
9. 9. The electronic device of any of claims 2-8, further comprising a second wiring layer on a side of the second chip facing away from the first chip, the second chip being connected to the second wiring layer, and a contact structure connecting the second wiring layer and the first wiring layer.
10. 10. The electronic device of claim 9, further comprising an adhesive layer between the second chip and the first wiring layer.
11. 11. A method of manufacturing an electronic device, comprising: Mounting a second chip; Forming a heat conducting structure on the second chip; Mounting a first chip on the thermally conductive structure such that the thermally conductive structure is located between the first chip and the second chip; And carrying out plastic packaging on the first chip, the heat conducting structure and the second chip to form a plastic package part, and exposing one end of the heat conducting structure to the surface of the plastic package part, wherein the first chip and the second chip are both positioned in the plastic package part.
12. 12. The method of manufacturing an electronic device according to claim 11, wherein forming the thermally conductive structure comprises: forming a first heat conduction part, wherein the extending direction of the first heat conduction part is parallel to the plane where the second chip is located, and the first heat conduction part is provided with a first end and a second end in the extending direction; forming a second heat conduction part, connecting the second heat conduction part with the first end, wherein the extending direction of the second heat conduction part is perpendicular to the plane of the second chip; and forming a third heat conduction part, connecting the third heat conduction part with the second end, and enabling the extending direction of the third heat conduction part to be perpendicular to the plane where the second chip is located.
13. 13. The method of manufacturing an electronic device according to claim 11, wherein the mounting the second chip includes: Providing a first substrate; forming a first wiring layer on the first substrate; Forming a contact structure and mounting a second chip on the first wiring layer; and forming a second wiring layer, wherein the formed second wiring layer is connected with the first wiring layer through the contact structure.
14. 14. The method of manufacturing an electronic device according to claim 13, wherein forming a thermally conductive structure on the second chip comprises: forming a second substrate on the second wiring layer, and removing the first substrate; And forming a heat conduction structure on the first wiring layer.
15. 15. The method of manufacturing an electronic device according to claim 11, wherein the mounting the second chip includes: Providing a second substrate; Forming a second wiring layer on the second substrate; Mounting a second chip on the second wiring layer and forming a contact structure; And forming a first wiring layer, wherein the formed first wiring layer is connected with the second wiring layer through the contact structure.
16. 16. The method of claim 15, wherein forming a thermally conductive structure on the second chip comprises forming a thermally conductive structure on the first wiring layer.
17. 17. An electronic device comprising a heat sink and an electronic device according to any of claims 1-10, wherein the heat sink is connected to the thermally conductive structure.

Description

Electronic device, manufacturing method thereof and electronic equipment Technical Field The embodiment of the application relates to the technical field of semiconductors, in particular to an electronic device, a manufacturing method thereof and electronic equipment. Background Fan-Out Package on Package, FOPOP technology can package chips of different specifications in layers to form an electronic device, but the heat dissipation capability of two or more chips after packaging in layers is reduced. Disclosure of Invention The embodiment of the application provides an electronic device, a manufacturing method thereof and electronic equipment, and aims to improve the heat dissipation capacity of the electronic device. In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme: In one aspect, an embodiment of the present application provides an electronic device, where the electronic device includes a plastic package, a first chip, a second chip, and a heat conductive structure, the first chip and the second chip are both located in the plastic package, the first chip and the second chip are stacked, the heat conductive structure is located between the first chip and the second chip, and one end of the heat conductive structure is exposed on a surface of the plastic package. The embodiment of the application provides an electronic device, wherein a first chip and a second chip are arranged in a plastic package in a stacked manner, a heat conducting structure is arranged between the first chip and the second chip, one end of the heat conducting structure is exposed on the surface of the plastic package, so that heat generated by the first chip and the second chip is transferred to the heat conducting structure, one end of the heat conducting structure exposed on the surface of the plastic package is transferred to the outside of the plastic package, and the heat dissipation of the first chip and the second chip in the plastic package in the vertical direction is improved, so that the heat dissipation capacity of the electronic device is improved. In some embodiments, the electronic device further includes a first wiring layer between the first chip and the second chip, the first chip and the second chip being connected by the first wiring layer, the thermally conductive structure being between the first wiring layer and the first chip. Through the arrangement, heat generated by the first chip can be transferred to the heat conducting structure and is transferred to the outside of the plastic package through one end of the surface of the plastic package exposed by the heat conducting structure so as to realize heat dissipation of the first chip in the plastic package, heat generated by the second chip can be indirectly transferred to the heat conducting structure through the first wiring layer and is also transferred to the outside of the plastic package through one end of the surface of the plastic package exposed by the heat conducting structure so as to realize heat dissipation of the second chip in the plastic package, and heat dissipation of the first chip and the second chip can both improve heat dissipation capacity of an electronic device. In some embodiments, a side of the first chip facing the first wiring layer is provided with a first sub-pad and a second sub-pad, both of which are connected with the first wiring layer, the first sub-pad and the second sub-pad are arranged at intervals, and the heat conducting structure is located between the first sub-pad and the second sub-pad. Through the arrangement, the heat conduction structure, the first sub-bonding pad and the second sub-bonding pad are arranged at intervals, so that the first chip and the first wiring layer can be connected through the first sub-bonding pad and the second sub-bonding pad, and meanwhile, the heat conduction structure between the first chip and the first wiring layer is prevented from being in contact with the first sub-bonding pad or the second sub-bonding pad, and electric leakage of the first chip caused by the heat conduction structure is avoided. In some embodiments, the heat conducting structure includes a first heat conducting portion, the first heat conducting portion is located between the first wiring layer and the first chip, an extending direction of the first heat conducting portion is perpendicular to an arrangement direction of the first sub-pad and the second sub-pad, and one end of the first heat conducting portion in the extending direction is exposed on a surface of the plastic package. By the arrangement, one end of the first heat conduction part in the extending direction is exposed on the surface of the plastic package, and heat dissipation of the first chip and the second chip can be achieved under the shortest distance. In some embodiments, the heat conducting structure further includes a first heat conducting portion and a second heat conduc