CN-121985824-A - Active radiator for power supply with high-power switch tube module

Abstract

The invention relates to an active radiator for a power supply with a high-power switch tube module, which comprises an aluminum radiator body, an aluminum radiating fin, a semiconductor refrigerating fin and a heating surface, wherein one surface of the aluminum radiating fin is attached to a radiating surface of a switch tube through a heat conducting insulating gasket, the semiconductor refrigerating fin is arranged between the aluminum radiator body and the aluminum radiating fin, the refrigerating surface of the semiconductor refrigerating fin is attached to the aluminum radiating fin through a heat conducting medium, and the heating surface of the semiconductor refrigerating fin is attached to the aluminum radiator body through a heat conducting medium, wherein a local low-temperature area is formed in a switch tube area when the semiconductor refrigerating fin is electrified and works, and the temperature difference between the shell temperature of the switch tube and the average temperature of the radiator is reduced. The high-efficiency heat dissipation scheme is provided for the switch tube, a local low-temperature area is formed in the switch tube area by utilizing the semiconductor active heat dissipation technology, the temperature difference between the shell temperature of the switch tube and the average temperature of the radiator is reduced, the switch tube is used as far as possible, the size of the radiator is reduced, and the power density of the power module is further improved.

Inventors

• ZHANG YANJUN
• HE BI
• DING JIE
• Pei Changquan
• ZHAO HAOKAI

Assignees

• 中国船舶集团有限公司第七〇四研究所

Dates

Publication Date

20260505

Application Date

20260130

Claims (10)

1. 1. The active radiator for the power supply with the high-power switch tube module is characterized by comprising an aluminum radiator body (2), aluminum radiating fins (3), semiconductor refrigerating fins (1) and a semiconductor cooling fin, wherein one surface of each aluminum radiating fin is attached to a radiating surface of a switch tube through a heat conducting insulating gasket, the semiconductor refrigerating fins (1) are arranged between the aluminum radiator body (2) and the aluminum radiating fins (3), a refrigerating surface of each semiconductor refrigerating fin (1) is attached to the aluminum radiating fins (3) through a heat conducting medium, and a heating surface is attached to the aluminum radiator body (2) through a heat conducting medium, wherein a local low-temperature area is formed in a switch tube area when the semiconductor refrigerating fin (1) is electrified and works, and the temperature difference between the shell temperature of the switch tube and the average temperature of the radiator is reduced.
2. 2. Active radiator according to claim 1, characterized in that the aluminum radiator body (2) is provided with a groove (2-1), the semiconductor cooling fin (1) is embedded in the groove (2-1), and the depth of the groove (2-1) is smaller than or equal to the thickness of the semiconductor cooling fin (1).
3. 3. Active radiator according to claim 2, characterized in that the aluminium radiator body (2) is provided with threaded holes (2-2) around the recess (2-1), the aluminium radiator body (2) and the aluminium radiating fins (3) being locked and fixed by means of fasteners, so that the semiconductor cooling fins (1) are in close contact with the aluminium radiating fins (3).
4. 4. Active heat sink according to claim 1, characterized in that the semiconductor cooling fin (1) is made of bismuth telluride material, realizing cold-hot end temperature difference conversion based on the peltier effect.
5. 5. The active radiator according to claim 1, wherein the semiconductor refrigeration sheet (1) is strip-shaped, and has a width of 10-20 mm, a length of 60-100 mm, and a thickness of 2-5 mm, so as to match the concentrated heating area of the switching tube.
6. 6. The active radiator according to claim 1, characterized in that the refrigerating power of the semiconductor refrigerating sheet (1) is 30% -50% of the total sum of the full load losses of the corresponding radiating switch tubes.
7. 7. The active radiator according to claim 1, characterized in that the power supply voltage of the semiconductor refrigeration piece (1) is 12 v-24 v, which is matched with the auxiliary power supply voltage of the module power supply.
8. 8. Active radiator according to claim 1, characterized in that the aluminum cooling fin (3) is elongated and provided with a through hole (3-1) for fixing a switching tube.
9. 9. Active radiator according to any one of claims 1 to 8, characterized in that it further comprises a control unit which controls the power supply of the semiconductor cooling fin (1) according to the operating state of the module power supply, wherein the power supply is switched off when the power supply module is not operating, the ambient temperature is below a set threshold value or the load factor is below a set threshold value, and is switched on in high temperature environments or in heavy load conditions.
10. 10. Active radiator according to claim 9, characterized in that the control unit is integrated in the controller of the module power supply, the power supply line of the semiconductor cooling fin (1) being connected to the auxiliary power supply terminal of the module power supply.

Description

Active radiator for power supply with high-power switch tube module Technical Field The invention relates to the technical field of heat dissipation, in particular to an active radiator for a power supply with a high-power switch tube module. Background With the development of semiconductor technology and the update of semiconductor components, power supply products gradually develop towards standardization, modularization and high power density. The power supply module is gradually lifted to 30kW from 10kW, and a new challenge is presented to the heat dissipation of the switching tube. The existing power supply module is usually forced air cooling heat dissipation, and the temperature of the switch tube shell is higher than the average temperature of the heat radiator by more than 20 ℃ due to the existence of an insulating heat conducting gasket and a heat conducting resistance of an aluminum heat radiator, so that the use of the power of the switch tube is limited. When the temperature of the switch tube shell is higher, the loss of the switch tube is increased, and the efficiency of the power supply module is not improved. In order to safely use the switching tube, the size of the radiator needs to be increased, and the power density of the power supply module is limited. Disclosure of Invention Aiming at the problems, an active radiator for a power supply with a high-power switch tube module is provided, an efficient radiating scheme is provided for the switch tube, a semiconductor active radiating technology is utilized to form a local low-temperature area in a switch tube area, the temperature difference between the shell temperature of the switch tube and the average temperature of the radiator is reduced, the switch tube is used as far as possible, the size of the radiator is reduced, and the power density of the power supply module is further improved. The technical scheme of the invention is that the active radiator for the power supply with the high-power switch tube module comprises: An aluminum radiator body; one surface of the aluminum radiating fin is attached to the radiating surface of the switch tube through a heat conducting insulating gasket; The semiconductor refrigerating sheet is arranged between the aluminum radiator body and the aluminum radiating sheet, the refrigerating surface of the semiconductor refrigerating sheet is attached to the aluminum radiating sheet through a heat conducting medium, and the heating surface is attached to the aluminum radiator body through a heat conducting medium; when the semiconductor refrigerating sheet is electrified to work, a local low-temperature area is formed in the switch tube area, and the temperature difference between the shell temperature of the switch tube and the average temperature of the radiator is reduced. Preferably, the aluminum radiator body is provided with a groove, the semiconductor refrigerating sheet is embedded into the groove, and the depth of the groove is smaller than or equal to the thickness of the semiconductor refrigerating sheet. Preferably, the aluminum radiator body is provided with threaded holes around the grooves, and the aluminum radiator body and the aluminum radiating fins are locked and fixed through fasteners, so that the semiconductor refrigerating fins and the aluminum radiating fins are tightly attached. Preferably, the semiconductor refrigeration sheet is made of bismuth telluride material, and cold and hot end temperature difference conversion is realized based on the Peltier effect. Preferably, the semiconductor refrigeration piece is long, the width of the semiconductor refrigeration piece is 10-20 mm, the length of the semiconductor refrigeration piece is 60-100 mm, and the thickness of the semiconductor refrigeration piece is 2-5 mm so as to be matched with the concentrated heating area of the switch tube. Preferably, the refrigerating power of the semiconductor refrigerating sheet is 30% -50% of the total full load loss of the corresponding heat dissipation switching tube. Preferably, the power supply voltage of the semiconductor refrigeration sheet is 12V-24V, and is matched with the auxiliary power supply voltage of the module power supply. Preferably, the aluminum radiating fin is in a strip shape, and a through hole for fixing the switch tube is formed in the aluminum radiating fin. Preferably, the active radiator further comprises a control unit, and the control unit controls the power supply of the semiconductor refrigeration sheet according to the working state of the module power supply, wherein the power supply is cut off when the power supply module does not work, the ambient temperature is lower than a set threshold value or the load rate is lower than the set threshold value, and the power supply is switched on under the high-temperature environment or the heavy-load working condition. Preferably, the control unit is integrated in a controller of the module power supply, and a power l