Search

CN-121985831-A - Multi-channel multi-beam double-sided led-out radio frequency micro-module based on DPC packaging substrate

CN121985831ACN 121985831 ACN121985831 ACN 121985831ACN-121985831-A

Abstract

The invention discloses a multi-channel multi-beam double-sided led-out radio frequency micro module based on a DPC packaging substrate, which comprises a multi-channel multi-beam radio frequency unit, a power management unit and a DPC packaging tube shell, wherein a metal layer is arranged on the side wall of the substrate of the DPC packaging tube shell, an electromagnetic shielding cavity is formed by the metal layer and the grounded metal layers on the upper surface and the lower surface of the DPC packaging tube shell, an electromagnetic band gap structure is integrated on the surface of the upper substrate, and a resistor voltage division network and a power amplifier chip are connected on the lower substrate in an inverted manner through a gold bump array. According to the invention, through the synergistic effect of the metallization of the side wall of the substrate, the electromagnetic band gap structure and the flip-chip connection, the multistage electromagnetic isolation barrier is constructed, the problems of signal leakage and insufficient isolation are solved, and the high-density integration and double-sided extraction functions of the micro-module are realized.

Inventors

  • CAI CHUANTAO
  • GUO SHENG
  • YU HAONAN
  • ZHAO LEI
  • ZHANG JUNZHI

Assignees

  • 中国电子科技集团公司第五十五研究所

Dates

Publication Date
20260505
Application Date
20260402

Claims (10)

  1. 1. A multi-channel multi-beam double-sided leading-out radio frequency micro module based on a DPC packaging substrate comprises a multi-channel multi-beam radio frequency unit, a power management unit and a DPC packaging tube shell, and is characterized in that a metal layer is arranged on the side wall of the substrate of the DPC packaging tube shell, the metal layer on the side wall of the substrate is electrically connected with a grounding metal layer on the upper surface and the lower surface of the DPC packaging tube shell to form an electromagnetic shielding cavity together, an electromagnetic band gap structure for inhibiting signal transmission in the substrate and radiation in space is integrated on the surface of an upper substrate (1) of the DPC packaging tube shell, and a resistor voltage division network (3) and a power amplifier chip (4) are connected on a lower substrate (2) of the DPC packaging tube shell in an inverted mode through a gold bump array.
  2. 2. The radio frequency micro module set according to claim 1, wherein the upper substrate (1) and the lower substrate (2) are respectively integrated with a dam (5) and copper columns (6) below and above the upper substrate and the lower substrate, the upper and lower dams (5) are butted to form an isolation cavity, and the upper and lower copper columns (6) are butted to form a micro coaxial transmission structure for signal transmission of the upper and lower substrates.
  3. 3. The RF micro-module as set forth in claim 1, wherein the electromagnetic bandgap structure is formed of a periodically arranged metal pattern that forms a high impedance surface within a specific operating frequency band.
  4. 4. The radio frequency micro module set according to claim 1, wherein the upper substrate (1) and the lower substrate (2) are internally integrated with a solid copper hole (7) array, and the solid copper hole (7) array is used for realizing signal transmission of upper and lower layers of the substrate and forming an electromagnetic isolation structure.
  5. 5. The radio frequency micro module set according to claim 1, wherein the multi-channel multi-beam radio frequency unit comprises a transmission structure for radio frequency signal input on a lower substrate (2), a heterogeneous amplitude-phase multifunctional chip, a power amplifier chip (4) and a transmission structure for radio frequency signal output on an upper substrate (1), the heterogeneous amplitude-phase multifunctional chip comprises a Si-based multi-beam multifunctional amplitude-phase chip (8) and a first SiC adapter plate (9), and the Si-based multi-beam multifunctional amplitude-phase chip (8) is connected to the first SiC adapter plate (9) through a gold bump array in an inverted mode.
  6. 6. The radio frequency micro module set according to claim 5, wherein the power management unit comprises an isomerism power chip and a resistor voltage division network (3), the isomerism power chip is vertically stacked on the back surface of the isomerism amplitude phase multifunctional chip, and the isomerism power chip comprises a second SiC adapter plate (10), and a Si-based grid voltage stabilizing chip (11), a Si-based low-voltage difference linear voltage stabilizing chip (12) and a Si-based power modulation chip (13) which are connected to the isomerism power chip through a gold bump array back-off.
  7. 7. The radio frequency micro module according to claim 1, wherein BGA solder balls (14) for interconnection with an antenna and interconnection with a PCB are integrated above the upper substrate (1) and below the lower substrate (2), respectively.
  8. 8. The radio frequency micro module set according to claim 2, wherein the upper substrate (1), the lower substrate (2), the dam (5) and the metal layer on the side wall of the substrate form a closed cavity together, so as to realize airtight packaging and totally-enclosed electromagnetic shielding of the micro module set.
  9. 9. The RF micro-module of claim 2, wherein the RF micro-module comprises a multi-stage electromagnetic isolation barrier, wherein the gold bump array inside the chip forms a first-stage isolation barrier, the electromagnetic bandgap structure forms a second-stage isolation barrier, the isolation cavity formed by the dam forms a third-stage isolation barrier, and the closed cavity formed by the substrate sidewall metallization layer forms a fourth-stage isolation barrier.
  10. 10. The radio frequency micro module set according to claim 5, wherein the first SiC patch panel (9) of the heterogeneous multi-functional chip is adhered to the lower substrate (2) through conductive adhesive, and is electrically interconnected with the lower substrate (2) through wire bonding (15).

Description

Multi-channel multi-beam double-sided led-out radio frequency micro-module based on DPC packaging substrate Technical Field The invention relates to a microwave millimeter wave micro system, in particular to a multi-channel multi-beam double-sided led-out radio frequency micro module based on a DPC packaging substrate. Background The satellite communication is taken as a key component of a modern communication network, and has an irreplaceable effect in the fields of realizing 6G integration of the world, the Internet of things and the like. Traditional ground communication is limited by geographical environment, and satellite communication system cooperates with ground station through inter-satellite link, so as to realize high-efficiency coverage of dead zone such as ocean and desert. In recent years, the rise of low-orbit satellite constellation further promotes the development of high-throughput and low-delay satellite communication, wherein a phased array antenna system is used as a key satellite load and is an essential core for guaranteeing satellite communication. As satellite communication progresses to low orbit constellations and high flux directions, phased array antenna systems serve as core on-board loads, and strict requirements are placed on integration density, signal isolation and electromagnetic compatibility of front-end modules. The invention patent with the publication number of CN118943136B discloses a high-reliability high-power three-dimensional isomerism integrated radio frequency antenna integrated microsystem, which adopts a DPC substrate and copper-based three-dimensional structure to realize vertical transmission and airtight packaging of radio frequency signals, and realizes a stacking structure of 2.5D multiplied by 2 through a two-stage SiC adapter plate. However, the scheme still has the defects in electromagnetic shielding that firstly, the side wall of the DPC substrate lacks metal coverage due to the limitation of a plane processing technology, the DPC substrate becomes a weak link of electromagnetic shielding, high-frequency signals are easy to couple and leak from the side wall of the substrate, secondly, chips on the substrate are mainly connected by virtue of wire bonding, long leads are easy to become radiation antennas at high frequency, the more the leads are, the more the crosstalk among channels is serious, and the substrate surface is difficult to inhibit the propagation of a substrate parasitic mode from a radiation field layer. The defects are particularly prominent in multi-channel and high-density integrated scenes, and the application of the defects in occasions with extremely high requirements on isolation, such as phased array antenna array surfaces, is limited. Disclosure of Invention The invention aims to provide a multi-channel multi-beam double-sided led-out radio frequency micro module based on a DPC packaging substrate, which has high integration density and excellent electromagnetic shielding performance. The technical scheme is that the multi-channel multi-beam double-sided led-out radio frequency micro module based on the DPC packaging substrate comprises a multi-channel multi-beam radio frequency unit, a power management unit and a DPC packaging tube shell, wherein a metal layer is arranged on the side wall of the substrate of the DPC packaging tube shell, the metal layer on the side wall of the substrate is electrically connected with a grounding metal layer on the upper surface and the lower surface of the DPC packaging tube shell to form an electromagnetic shielding cavity together, an electromagnetic band gap structure for inhibiting signal transmission in the substrate and radiation in space is integrated on the surface of the upper substrate of the DPC packaging tube shell, and a resistor voltage division network and a power amplifier chip are connected on the lower substrate of the DPC packaging tube shell in an inverted mode through a gold bump array. The metal layer is arranged on the side wall of the substrate of the DPC packaging tube shell, and is reliably and electrically connected with the grounding metal layers on the upper surface and the lower surface of the DPC packaging tube shell to form a complete Faraday cage structure, namely a totally-enclosed electromagnetic shielding cavity. The structure solves the problem that the prior DPC package has weak electromagnetic shielding caused by no metal coverage on the side wall, effectively blocks the path of coupling leakage of high-frequency signals from the side wall of the substrate, completely constrains the internal electromagnetic signals in the cavity, and realizes broadband suppression of electromagnetic interference to the external environment and effective constraint on internal strong signal leakage. Through integrating electromagnetic band gap structure on the upper substrate surface, parasitic transmission paths of space electromagnetic waves between dielectric layers ca