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CN-121985838-A - T-PAK lead frame and packaging structure

CN121985838ACN 121985838 ACN121985838 ACN 121985838ACN-121985838-A

Abstract

The invention relates to a T-PAK lead frame and a packaging structure, wherein the lead frame comprises a plurality of packaging units, each packaging unit comprises a drain electrode terminal, a source electrode terminal and a grid electrode pin, the source electrode terminal is attached with a first pin parallel to the grid electrode pin, a second pin and a third pin parallel to each other, each pin comprises a fixed section, an inclined section and a free section, the second pin is connected with the grid electrode pin through an internal rib, the grid electrode pin and the inclined section of the first pin are inclined in opposite directions, the second pin and the inclined section of the third pin are inclined in opposite directions, and the second pin and the third pin are inserted between the grid electrode pin and the first pin of the packaging unit of the adjacent row to form opposite insertion and are connected into a whole through a serial connection structure. According to the technical scheme, the number of pins is increased, the information processing capacity of the packaged complex application scene is improved, the functional expansion is increased, the pin gap is reduced by changing the opposite insertion mode, and then the material is reduced.

Inventors

  • ZHU WEIJUN
  • HONG JIANXIN
  • XIN HAIBO
  • Zhai Chongxin
  • JIANG HUANHUI
  • ZHENG WEI

Assignees

  • 宁波德洲精密电子有限公司

Dates

Publication Date
20260505
Application Date
20260130

Claims (10)

  1. 1. The T-PAK lead frame comprises an outer frame (10), a plurality of packaging units (20) which are arranged in rows and columns in the outer frame (10), and external connecting ribs (30) which are connected with the packaging units (20), wherein each packaging unit (20) comprises a drain terminal (20 a), a source terminal (20 b) and a grid pin (20 c), the drain terminal (20 a), the source terminal (20 b) and the grid pins (20 c) are connected to the outer frame (10) or the external connecting ribs (30) in a tandem way through internal connecting ribs (40), and the T-PAK lead frame is characterized in that a first pin (200), a second pin (210) and a third pin (220) are attached to the source terminal (20 b), the first pin (200) is parallel to the grid pin (20 c), and the second pin (210) is parallel to the third pin (220); The grid pin (20 c), the first pin (200), the second pin (210) and the third pin (220) comprise a fixed section (a 1), an inclined section (a 2) and a free section (a 3), the second pin (210) is connected with the grid pin (20 c) through an internal connecting rib (40), the grid pin (20 c) and the inclined section (a 2) of the first pin (200) are inclined in opposite directions, and the second pin (210) and the inclined section (a 2) of the third pin (220) are inclined in opposite directions; The second pins (210) and the third pins (220) of the packaging units (20) are inserted between the grid pins (20 c) and the first pins (200) of the adjacent rows of packaging units (20) to form opposite insertion, and the grid pins (20 c) and the third pins (220) of the adjacent rows and the first pins (200) and the second pins (210) are connected into a whole through a serial structure (50).
  2. 2. The T-PAK lead frame of claim 1, wherein a spacing between an inner edge of the gate lead (20 c) and an inner edge of the first lead (200) is equal to a spacing between an outer edge of the second lead (210) and an outer edge of the third lead (220).
  3. 3. A T-PAK lead frame according to claim 2, wherein the gate lead (20 c) and the first lead (200) are located in a first plane (s 1), the second lead (210) and the third lead (220) are located in a second plane (s 2), wherein the first plane (s 1) exceeds the second plane (s 2) in the height direction.
  4. 4. The T-PAK lead frame according to claim 1, wherein the tandem structure (50) comprises a first avoidance groove (500) formed in the gate pin (20 c) and the first pin (200), a second avoidance groove (510) formed in the second pin (210) and the third pin (220), and vertical connecting ribs (520) with two ends respectively formed in the first avoidance groove (500) and the second avoidance groove (510), wherein the width of the vertical connecting ribs (520) is smaller than that of the first avoidance groove (500) and the second avoidance groove (510), and the vertical connecting ribs (520) connect the gate pin (20 c) and the third pin (220) and connect the first pin (200) and the second pin (210).
  5. 5. The T-PAK lead frame of claim 4, wherein the first press-bending region (520 a) and the second press-bending region (520 b) are respectively provided at both ends of the vertical connecting rib (520), and the thickness of the first press-bending region (520 a) and the second press-bending region (520 b) is smaller than the thickness of the rest of the vertical connecting rib (520).
  6. 6. The T-PAK lead frame according to claim 1, wherein a first opening (a 4) is formed on a side of the gate pin (20 c) close to the third pin (220) which is inserted in a butt-joint manner, a second opening (a 5) is formed on a side of the first pin (200) close to the second pin (210) which is inserted in a butt-joint manner, and shapes of the first opening (a 4) and the second opening (a 5) are respectively matched with shapes of the third pin (220) and a free section (a 3) of the second pin (210).
  7. 7. The T-PAK lead frame according to claim 1, wherein at least one side of the fixed section (a 1) of the gate lead (20 c), the first lead (200), the second lead (210) and the third lead (220) has a thickened portion (a 11), the source terminal (20 b) has a strong-voltage region (b 1), and the strong-voltage region (b 1) has stress dispersion holes (b 2) distributed therein.
  8. 8. The packaging structure comprises the T-PAK lead frame according to any one of claims 1 to 7, and is characterized by further comprising a plastic package shell (600), a copper-clad plate (700), a chip (800) and a bonding wire (900), wherein the copper-clad plate (700) is arranged inside the plastic package shell (600), the chip (800) is welded on the copper-clad plate (700), one end of a grid terminal is connected with the chip (800) through the bonding wire (900), one end of a source terminal (20 b) is welded on the chip (800), one end of a drain terminal (20 a) is welded on the copper-clad plate (700), one end of the grid terminal, one end of the source terminal (20 b) and one end of the drain terminal (20 a) are opposite to the source terminal (20 b), and one ends of the first pin (200), the second pin (210) and the third pin (220) extend to an external space and are bent.
  9. 9. The packaging structure of claim 8, further comprising a carrier (70), wherein the carrier (70) is welded to the copper-clad plate (700), and the chip (800) is embedded in the carrier (70).
  10. 10. The packaging structure according to claim 9, wherein the peripheral wall of the carrier frame (70) has an extension portion (71) extending in a radial direction, the extension portion (71) is spaced from the copper-clad plate (700), and a molding cavity (80) for accommodating the packaging material is formed by surrounding the extension portion (71), the peripheral wall of the carrier frame (70), and the copper-clad plate (700).

Description

T-PAK lead frame and packaging structure Technical Field The invention relates to the technical field of semiconductor packaging, in particular to a T-PAK lead frame and a packaging structure. Background The T-PAK lead frame is a key metal structural member in the T-PAK package, is used as a supporting and electric connection carrier of the package structure, not only bears the basic functions of chip mechanical fixing and circuit interconnection, but also provides a high-efficiency heat dissipation path and low parasitic parameters, thereby ensuring the reliability and performance of the package module under the working conditions of high current and high temperature, and being the key of the T-PAK package to realize high power density and high thermal management capability. The T-PAK lead frame is composed of an integrally formed peripheral support frame and a plurality of packaging units which are internally and regularly arranged according to rows and columns, each packaging unit is integrated with a drain electrode terminal, a source electrode terminal and a grid electrode pin, one ends of the drain electrode terminal, the source electrode terminal and the grid electrode pin are covered in a plastic package shell after packaging, the other ends of the drain electrode terminal, the source electrode terminal and the grid electrode pin are exposed in an external space, the T-PAK lead frame is subjected to bending treatment, the T-PAK lead frame is packaged to form the T-PAK packaging module shown in FIG. 11, and the packaging module is provided with two grid electrode pins, however, due to the limited number of pins, the information processing capability of the packaging module under a complex application scene is restricted, and the function expansion of the module is affected. In addition, the T-PAK lead frame adopts an external connection rib structure to isolate and connect adjacent packaging units in series, more particularly drain terminals, source terminals and grid pins of each packaging unit are connected to an outer frame or external connection ribs through internal connection ribs, and the redundant design of a large number of connection ribs causes the problems that firstly, excessive layout space is occupied, the whole size of the frame is overlarge, secondly, the area occupation ratio of the packaging units in the lead frame is reduced, and the external connection ribs and the internal connection ribs are required to be removed through punching by a rib cutting process during packaging, so that the material of the lead frame is wasted. At present, a staggered pin layout is generally adopted as a general layout manner, and in order to intuitively display the staggered pin layout, a staggered triode lead frame version with the bulletin number of CN202120899U is taken as an example, the lead frame is formed by oppositely arranging a pair of identical upper lead frames and lower lead frames (the upper lead frames and the lower lead frames are equivalent to packaging units) and transversely and repeatedly extending through connecting ribs, each of the upper lead frames and the lower lead frames comprises a die patch middle welding pin and a pair of side welding pins, the middle lead of the upper lead frame extends into a gap between the middle lead and a side lead (the middle lead and the side lead are equivalent to pins) of the lower lead frame, a pair of side leads of the upper lead frame extend into a gap between the side lead and the middle lead of the lower lead frame respectively, and the widths of the side lead, the middle lead and the side lead and the middle lead of the lower lead frame are equivalent to each other. The staggered pin layout design mainly aims at linear pins, the pins adopt an alternate and alternate arrangement mode, the pins of the packaging units of the T-PAK lead frame are of a nonlinear structure, and inclined sections with specific angles exist in the middle of the pins, so that the spacing between the adjacent pins is in non-equidistant distribution, if the alternate and alternate arrangement layout is adopted, the redundant gaps between the pins are difficult to compress, the miniaturization of the lead frame is limited, the material consumption is increased, and the symmetrical and alternate layout which is conventionally applicable to the linear pins is difficult to be directly applied. Disclosure of Invention Aiming at the situation, in order to overcome the problem that the packaging unit of the existing T-PAK lead frame is limited by the number of pins, the information processing capability under the complex application scene is restricted, the functional expansion of a module is influenced, meanwhile, the pins are of a nonlinear structure, the spacing between adjacent pins is distributed in non-equidistant mode, if the traditional alternate layout is used, the lead frame is excessively large in size, and the problem of material consumption increase is caused