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CN-121985841-A - Integrated circuit IDIP L lead wire support for optical mouse

CN121985841ACN 121985841 ACN121985841 ACN 121985841ACN-121985841-A

Abstract

The invention discloses an integrated circuit IDIP L lead support of an optical mouse, which relates to the technical field of lead supports, and relates to an integrated circuit IDIP L lead support of an optical mouse, comprising a support body, a pressing assembly and a driving assembly, wherein a chip seat for positioning and placing a chip is arranged on the support body, the pressing assembly is arranged on the support body and is used for pressing and pushing the chip after the chip is placed on the chip seat, the driving assembly is arranged on the support body and is used for driving and adjusting the use state of the pressing assembly, and the pressing assembly and the driving assembly are respectively positioned on the front side and the rear side of the support body. When the integrated circuit IDIPL lead frame of the optical mouse is used, the pressing assembly, the driving assembly and the pushing assembly are mutually matched, the lower end of the transmission plate on the pressing plate is pushed to be pressed against the chip, and the chip is fully attached after being mounted on the frame body through the pressing of the front side against the chip and the pressing of the rear side against the chip seat, so that gaps are avoided between the chip and the chip seat in the processes of placement and subsequent packaging, and the stable use of the subsequent lead frame is ensured.

Inventors

  • JIANG YIPING
  • WANG DONGHUA

Assignees

  • 深圳市正宇兴电子有限公司

Dates

Publication Date
20260505
Application Date
20260403

Claims (10)

  1. 1. An optical mouse integrated circuit IDIP L lead frame comprising: the chip positioning device comprises a frame body (101), wherein a chip seat (102) for positioning and placing chips is arranged on the frame body (101); Characterized by further comprising: The pressing assembly is arranged on the frame body (101) and is used for pressing and pushing the chip after the chip is placed on the chip seat (102); The driving assembly is arranged on the frame body (101) and used for driving and adjusting the use state of the pressing assembly, and the pressing assembly and the driving assembly are respectively positioned at the front side and the rear side of the frame body (101); and a pushing component which is arranged on the frame body (101) and is used for pushing the back of the chip seat (102).
  2. 2. The optical mouse integrated circuit IDIP L lead frame of claim 1, wherein two groups of pressing assemblies are arranged and symmetrically arranged on two sides of the chip holder (102), each pressing assembly comprises a mounting shaft (201) which is rotatably connected to the frame body (101), a pressing plate (202) is connected to the mounting shafts (201) through sliding assemblies, a transmission assembly for pushing against the chip is arranged on the pressing plate (202), and an elastic assembly for pushing the pressing plate (202) elastically is arranged on the mounting shafts (201).
  3. 3. The optical mouse integrated circuit IDIP L lead frame according to claim 2, wherein the sliding component comprises a spline shaft (301) fixed at one end of the mounting shaft (201), the spline shaft (301) is concentrically arranged with the mounting shaft (201), a spline hole (302) is formed in the pressing plate (202), and the pressing plate (202) is slidably connected to the spline shaft (301) through the spline hole (302).
  4. 4. The optical mouse integrated circuit IDIP L lead frame according to claim 3, wherein the elastic component comprises a baffle plate (401) fixed on one end of the spline shaft (301) away from the mounting shaft (201), the baffle plate (401) is concentrically arranged with the mounting shaft (201), a spring (402) is sleeved on the outer side of the spline shaft (301), and two ends of the spring (402) are respectively propped against the baffle plate (401) and the pressing plate (202).
  5. 5. The optical mouse integrated circuit IDIP L lead frame according to claim 4, wherein the transmission component comprises a transmission plate (501) fixed at the bottom of the pressing plate (202), and an inclined plane (502) for pushing against the upper end of the chip is formed on the transmission plate (501).
  6. 6. The optical mouse integrated circuit IDIP L lead frame as set forth in claim 2, wherein the driving assembly comprises a mounting frame (601) fixed on the rear side of the frame body (101), one end of the mounting shaft (201) penetrates through the inside of the mounting frame (601) from the frame body (101) and is fixed with a gear (602), two groups of racks (603) are symmetrically arranged in the mounting frame (601), the two groups of racks (603) are respectively meshed with the gears (602) on the two groups of mounting shafts (201), and a moving assembly for assisting pushing the racks (603) and a guiding assembly for guiding in the moving process are arranged between the mounting frame (601) and the racks (603).
  7. 7. The optical mouse integrated circuit IDIP L lead frame according to claim 6, wherein the moving assembly comprises a strip-shaped plate (801) arranged in the mounting frame (601), two groups of inclined grooves (802) are formed in the strip-shaped plate (801), transmission pins (803) are respectively connected to the two groups of inclined grooves (802) in a sliding mode, and the two groups of transmission pins (803) are respectively fixed with the two groups of racks (603).
  8. 8. The optical mouse integrated circuit IDIP L lead frame according to claim 6, wherein the guide assembly includes two sets of guide holes (701) formed in the rack (603), the two sets of guide holes (701) are symmetrically formed in the rack (603), a guide rod (702) is slidably connected to the guide holes (701), and one end of the guide rod (702) is fixed inside the mounting frame (601).
  9. 9. The optical mouse integrated circuit IDIP L lead frame of claim 8, wherein the pushing assembly comprises a template plate (901) arranged in the mounting frame (601), a plurality of groups of pushing pins (902) for pushing the back of the chip seat (102) against each other are fixed on the template plate (901), a plurality of groups of pushing pins (902) are uniformly distributed, the template plate (801) is detachably mounted on the template plate (901) in a bolt mode, and a linkage assembly for linkage of the template plate (901) is arranged on the mounting frame (601).
  10. 10. The optical mouse integrated circuit IDIP L lead frame according to claim 9, wherein the linkage assembly comprises a threaded pipe (1002) rotatably connected to the mounting frame (601), a threaded rod (1001) is connected to the threaded pipe (1002) in a threaded engagement manner, one end of the threaded rod (1001) is fixed to the tooling plate (901), a driving pin (1003) for driving the threaded pipe (1002) is fixed to one end of the threaded pipe (1002), two sets of sleeves (1004) are fixed to the inside of the mounting frame (601), the two sets of sleeves (1004) are symmetrically arranged on two sides of the threaded pipe (1002), sliding rods (1005) are connected to the sleeves (1004) in a sliding manner, and one end of each sliding rod (1005) is fixed to the tooling plate (901).

Description

Integrated circuit IDIP L lead wire support for optical mouse Technical Field The invention relates to the technical field of lead brackets, in particular to an optical mouse integrated circuit IDIP L lead bracket. Background An optical mouse integrated circuit IDIP L lead support is a metal lead frame (LEAD FRAME) specially designed for a 16-pin dual in-line (DIP) optical mouse chip, is a core carrier of chip packaging, and is used for bearing the chip and realizing electric connection and heat dissipation. In the process of using the optical mouse integrated circuit IDIP L lead frame, the chip is positioned on the chip seat, after the chip is placed, the chip and the lead frame are connected and fixed in a packaging mode, and in the process of placing the chip, due to the fact that the chip is lack of extrusion on the frame after the chip is placed, a gap is usually formed between the chip and the chip seat of the lead frame due to the fact that the chip is not placed in place, and the use of the subsequent lead frame is affected, and therefore, the optical mouse integrated circuit IDIP L lead frame is proposed. Disclosure of Invention The present invention is directed to an optical mouse integrated circuit IDIP L lead frame to solve the above-mentioned problems. In order to achieve the above purpose, the invention provides the following technical scheme that the integrated circuit IDIP L lead bracket of the optical mouse comprises a bracket body, wherein a chip seat for positioning and placing a chip is arranged on the bracket body, and the bracket further comprises: The pressing assembly is arranged on the frame body and used for pressing and pushing the chip after the chip is placed on the chip seat; the driving assembly is arranged on the frame body and used for driving and adjusting the use state of the pressing assembly, and the pressing assembly and the driving assembly are respectively positioned at the front side and the rear side of the frame body; and the pushing component is arranged on the frame body and used for pushing the back of the chip seat. Preferably, the pressing assembly is provided with two groups, and two groups of pressing assemblies are symmetrically arranged on two sides of the chip seat, the pressing assembly comprises a mounting shaft which is rotationally connected to the frame body, a pressing plate is connected to the mounting shaft through a sliding assembly, a transmission assembly which is used for pushing against the chip to transmit is arranged on the pressing plate, and an elastic assembly which is used for pushing the pressing plate elastically is arranged on the mounting shaft. Preferably, the sliding assembly comprises a spline shaft fixed at one end of the installation shaft, the spline shaft and the installation shaft are concentrically arranged, a spline hole is formed in the pressing plate, and the pressing plate is slidably connected onto the spline shaft through the spline hole. Preferably, the elastic component comprises a baffle plate fixed on one end of the spline shaft, which is far away from the installation shaft, the baffle plate and the installation shaft are concentrically arranged, a spring is sleeved on the outer side of the spline shaft, and two ends of the spring are respectively propped against the baffle plate and the pressing plate. Preferably, the transmission assembly comprises a transmission plate fixed at the bottom of the pressing plate, and an inclined plane for propping against the upper end of the chip to transmit is formed on the transmission plate. Preferably, the drive assembly comprises a mounting frame fixed on the rear side of the frame body, one end of the mounting shaft penetrates through the mounting frame body from the frame body and is fixedly provided with gears, two groups of racks are symmetrically arranged in the mounting frame and are respectively meshed with the gears on the two groups of mounting shafts, and a moving assembly for assisting in pushing the racks and a guiding assembly for guiding in the moving process are arranged between the mounting frame and the racks. Preferably, the moving assembly comprises a strip-shaped plate arranged in the mounting frame, two groups of inclined grooves are formed in the strip-shaped plate, driving pins are respectively connected to the two groups of inclined grooves in a sliding mode, and the two groups of driving pins are respectively fixed with the two groups of racks. Preferably, the guide assembly comprises two groups of guide holes arranged on the rack, the two groups of guide holes are symmetrically arranged on the rack, the guide holes are connected with guide rods in a sliding manner, and one ends of the guide rods are fixed in the installation frame. Preferably, the pushing assembly comprises a template plate arranged inside the mounting frame, a plurality of groups of pushing pins for pushing the back of the chip seat against are fixed on the template plate, the pus