CN-121985846-A - Power module

Abstract

The invention discloses a power module. The power module includes a substrate, a chip mounted on the substrate and having a signal pad, and a lead part electrically connected to the chip. The lead portion includes a signal lead disposed apart from the substrate and a connection lead connecting the signal lead and the signal pad.

Inventors

• DU HANZHEN
• YANG ZHENMING
• Pu Shengyuan

Assignees

• 现代自动车株式会社
• 起亚株式会社

Dates

Publication Date

20260505

Application Date

20250530

Priority Date

20241030

Claims (20)

1. 1. A power module, comprising: A substrate; a chip disposed on the substrate and having a signal pad, and A lead portion electrically connected to the chip, Wherein the lead portion includes: a signal lead arranged to be spaced apart from the substrate, and And a connection lead connecting the signal lead and the signal pad.
2. 2. The power module of claim 1 wherein the connection lead has a first end connected to a signal pad and a second end connected to a signal lead, the connection lead has an upper surface and a lower surface, at least a portion of the upper surface of the connection lead between the first end and the second end is provided as a planar surface, and at least a portion of the lower surface of the connection lead between the first end and the second end is provided as a planar surface.
3. 3. The power module of claim 2, wherein a portion of the connection leads overlap the substrate in a vertical direction.
4. 4. A power module according to claim 3, wherein the portion of the connection lead overlapping the substrate is provided as a flat surface.
5. 5. The power module of claim 1 wherein the connection leads comprise: A first connection portion having a first end connected to the signal lead; A second connection part having a first end connected to the signal pad, and And a third connecting portion connecting the second end of the first connecting portion and the second end of the second connecting portion.
6. 6. The power module of claim 5 wherein the third connection has an upper surface and a lower surface, and at least a portion of the upper surface of the third connection is configured as a flat plate.
7. 7. The power module of claim 6 wherein at least a portion of a lower surface of the third connection portion is configured as a flat plate.
8. 8. The power module of claim 5 wherein the substrate comprises a lower substrate and an upper substrate disposed on top of the lower substrate.
9. 9. The power module of claim 8 wherein at least a portion of the third connection is disposed between the lower substrate and the upper substrate.
10. 10. The power module according to claim 9, wherein an upper surface of a portion of the third connection portion disposed between the lower substrate and the upper substrate is disposed as a flat plate, and a lower surface of a portion of the third connection portion disposed between the lower substrate and the upper substrate is disposed as a flat plate.
11. 11. The power module of claim 5, wherein the substrate comprises a lower substrate and an upper substrate, and the third connection portion is disposed in parallel with at least one of the lower substrate or the upper substrate.
12. 12. The power module of claim 11, wherein the third connection portion is bent at least once in a direction parallel to at least one of the lower substrate or the upper substrate.
13. 13. The power module according to claim 5, wherein the first connection portion and the second connection portion are connected obliquely at both ends of the third connection portion.
14. 14. The power module of claim 1 wherein the connection leads comprise: a first connection part having upper and lower surfaces connected to the first end of the signal lead and having a flat shape, and And a second connection portion having a bent end bent downward at a second end of the first connection portion, the bent end being connected to the signal pad.
15. 15. The power module of claim 1, further comprising a molding disposed around the substrate and the die, Wherein the signal leads have first ends spaced apart from the substrate within the mold portion and second ends exposed to the exterior of the mold portion, The connection lead connects at least one of the first end or the second end of the signal lead to the signal pad.
16. 16. The power module of claim 15 wherein the substrate comprises: A lower substrate at least partially exposed to a lower surface of the molding part, and An upper substrate disposed above the lower substrate and at least partially exposed to an upper surface of the molding part.
17. 17. A power module, comprising: A substrate including a lower substrate and an upper substrate disposed above the lower substrate; A chip mounted on the substrate and having a signal pad; A molding part disposed around the substrate and the chip, and A lead part having a first end electrically connected to the signal pad inside the molding part and a second end exposed to the outside of the molding part, Wherein a portion of the lead portion disposed between the lower substrate and the upper substrate has upper and lower surfaces of a flat shape.
18. 18. The power module of claim 17 wherein the lead portion includes a signal lead for transmitting a control signal.
19. 19. The power module of claim 18 wherein the signal leads comprise: A first portion having a first end connected to the signal pad inside the molding portion, and A second portion having a first end connected to a second end of the first portion and a second end exposed to an outside of the mold, wherein a width-direction length of the first portion is set shorter than a width-direction length of the second portion.
20. 20. The power module of claim 19 wherein the first portion is configured to bend at least once in a direction parallel to the substrate.

Description

Power module Cross Reference to Related Applications The present application claims the benefit of priority from korean patent application No. 10-2024-0150582 filed on the korean intellectual property office on the date 10 and 30 of 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present invention relates to a power module. Background Recently, as the attention to the environment increases, environmentally friendly vehicles equipped with an electric motor as a power source are increasing. Environmentally friendly vehicles are also referred to as electric vehicles, and representative examples include Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs). Inverters are used as components of power control that greatly affect the performance and efficiency of these vehicles. An inverter is a device that converts Direct Current (DC) power into Alternating Current (AC) power, and may drive a motor by receiving power from a high-voltage battery. The inverter includes a power module as a core component. The power module processes high voltage and current to perform power conversion. In some power modules, wire bonding (wire bonding method) is used as a method of connecting the signal leads to the semiconductor chip. However, in the case of wire bonding methods, it may be difficult to miniaturize the power module because its use (e.g., need) ensures the height of the wire bond. In addition, in connecting the signal leads and the semiconductor chip using the wire bonding method, if the semiconductor chip is disposed within the substrate, an electrode pattern is used (e.g., required) in order to form a signal loop, and the electrode pattern may have a problem of complicating a current loop and degrading electrical characteristics of the power module. Accordingly, research into miniaturization and improved electrical characteristics of the power module structure may be useful. Disclosure of Invention An aspect of the present invention is to provide a power module useful in miniaturization and having improved electrical characteristics. According to an aspect of the present invention, a power module includes a substrate, a chip mounted on the substrate and having a signal pad, and a lead part electrically connected to the chip. The lead portion includes a signal lead disposed apart from the substrate and a connection lead connecting the signal lead and the signal pad. The connection lead may have one end connected to the signal pad and the other end connected to the signal lead, and upper and lower surfaces of at least a portion of the connection lead between the one end and the other end may be provided as flat surfaces. The portion of the connection lead overlapping the substrate in the vertical direction may be provided as a flat surface. The connection lead may include a first connection portion having one end connected to the signal lead, a second connection portion having one end connected to the signal pad, and a third connection portion connecting the other end of the first connection portion and the other end of the second connection portion. At least a portion of the upper and lower surfaces of the third connection part may be provided as a flat plate. The substrate may include a lower substrate and an upper substrate disposed on top of the lower substrate, and at least a portion of the third connection portion may be disposed between the lower substrate and the upper substrate. The upper and lower surfaces of the portion of the third connection portion disposed between the lower and upper substrates may be disposed as flat plates. The third connection part may be disposed parallel to at least one of the lower substrate or the upper substrate. The third connection part may be bent at least once in a direction parallel to at least one of the lower substrate or the upper substrate. The first connection portion and the second connection portion may be connected at both ends of the third connection portion in an inclined manner. The connection lead may include a first connection portion having an upper surface and a lower surface connected to one end of the signal lead and having a flat shape, and a second connection portion having a bent end bent downward at the other end of the first connection portion, the bent end being connected to the signal pad. The power module may further include a molding portion disposed to surround the substrate and the chip. The signal lead may have one end spaced apart from the substrate within the mold portion and the other end exposed to the outside of the mold portion, and the connection lead may connect one end of the signal lead to the signal pad. The substrate may include a lower substrate at least partially exposed to a lower surface of the mold portion, and an upper substrate disposed above the lower substrate and at least partially exposed to an upper surface of the mold portion. According to an aspect of the prese