CN-121985847-A - Package, stacked package structure and packaging method

Abstract

A package body comprises a first component, a frame and a frame, wherein the first component is positioned on the assembly surface of a substrate and is electrically connected with a first connecting terminal, the frame is positioned on the assembly surface of the side part of the first component and comprises a conductive pad and a pin which is in corresponding relation with the conductive pad, the conductive pad and the corresponding pin are integrally formed, the conductive pad is positioned on one side of the pin away from the substrate, the pin is electrically connected with a second connecting terminal, and compared with the scheme that an interconnection structure (such as an interconnection column) is formed on the substrate first and then a rewiring layer is formed on the top of the interconnection structure, the frame is adopted to replace the interconnection structure and the rewiring layer, and the conductive pad and the pin can be correspondingly formed simultaneously in the same manufacturing step due to the integral forming of the conductive pad and the pin, so that the process steps are simplified, and the overall packaging cost is reduced.

Inventors

• ZHANG JIANGHUA
• YANG XIANFANG
• GU JIONGJIONG
• LI PENG
• CHENG BIN

Assignees

• 长电科技(江阴)有限公司

Dates

Publication Date

20260505

Application Date

20260211

Claims (20)

1. 1. A kind of package body, in which the package body, characterized by comprising the following steps: A substrate including at least one mounting surface, the mounting surface of the substrate having exposed first and second connection terminals; a first component which is positioned on the assembly surface of the substrate and is electrically connected with the first connection terminal; The frame is located on the assembly surface of the side portion of the first component, the frame comprises a conductive bonding pad and pins corresponding to the conductive bonding pad, the conductive bonding pad and the corresponding pins are integrally formed, the conductive bonding pad is located on one side, away from the substrate, of the pins, and the pins are electrically connected with the second connecting terminals.
2. 2. The package of claim 1, wherein the pins are located on a single side of the corresponding conductive pads; or the pins are positioned on two opposite sides of the corresponding conductive bonding pads.
3. 3. The package of claim 2, wherein the first component comprises a first chip; When the pins are located on one side of the corresponding conductive pads, the frame further comprises first heat dissipation pads which are arranged at intervals with the conductive pads, the top surfaces of the first heat dissipation pads are flush with the top surfaces of the conductive pads, and the first heat dissipation pads are located on the surface, facing away from the substrate, of the first chip and are in heat conduction connection with the first chip.
4. 4. The package of any one of claims 1-3, further comprising a molding layer covering the mounting surface and covering the first component and the frame, the molding layer exposing a surface of the conductive pad facing away from the substrate.
5. 5. The package of claim 4 wherein the frame further comprises a wing structure located on a perimeter side of the conductive pad and integrally formed with the conductive pad, a top surface of the wing structure being lower than a top surface of the conductive pad; the plastic layer also coats the flank structure.
6. 6. The package of claim 5, wherein the sidewall of the wing structure has a shape comprising a zigzag shape or a scalloped shape.
7. 7. A package as claimed in any one of claims 1 to 3, wherein the pins comprise one or more of the following types: the outer folding pin comprises a horizontal part and a connecting part positioned between the horizontal part and the conductive bonding pad, the top surface of the horizontal part is lower than the top surface of the conductive bonding pad, and the horizontal part extends along the direction away from the conductive bonding pad; the direct plug pin extends along the direction perpendicular to the assembly surface; The inner folding pin comprises a horizontal part and a connecting part positioned between the horizontal part and the conductive bonding pad, the top surface of the horizontal part is lower than the top surface of the conductive bonding pad, and the horizontal part extends along the direction facing the bottom of the conductive bonding pad.
8. 8. The package of claim 1, wherein the first component comprises one or both of a first chip and a first passive element.
9. 9. The package of claim 3 or 8, wherein when the first component comprises a first chip, the first component comprises a power chip.
10. 10. The package of claim 1, wherein the conductive pad has a thickness of 0.1 to 0.4mm.
11. 11. The package of claim 1, wherein the material of the frame comprises copper, copper alloy, or iron-nickel alloy.
12. 12. A stacked package structure, comprising: The package according to any one of claims 1-11; And the second component is positioned on the packaging body and faces the conductive bonding pad, and the second component is electrically connected with the conductive bonding pad.
13. 13. The package on package structure of claim 12, wherein the second component includes a third connection terminal at least on a surface of the second component facing the package body, the third connection terminal being positioned to correspond to the position of the conductive pad, and the third connection terminal being connected to the conductive pad.
14. 14. The package on package structure of claim 12, wherein the first component comprises a first chip, and wherein when the leads are located on a single side of the corresponding conductive pads, the frame further comprises a first heat dissipation pad spaced apart from the conductive pads, the top surface of the first heat dissipation pad being flush with the top surface of the conductive pad, the first heat dissipation pad being located on a side of the first chip facing away from the substrate and in thermally conductive connection with the first chip; The stacked package structure further comprises a second heat dissipation pad, wherein the second heat dissipation pad is positioned on the surface, facing the package body, of the second component, the position of the second heat dissipation pad corresponds to that of the first heat dissipation pad, and the second heat dissipation pad is in heat conduction connection with the first heat dissipation pad.
15. 15. The stacked package structure of claim 12, wherein the second component comprises one or both of a second chip and a second passive component.
16. 16. The package on package structure of claim 15, wherein when the second component comprises a second passive component, the second component comprises an inductance.
17. 17. A method of packaging, comprising: providing a substrate comprising at least one mounting surface having exposed first and second connection terminals; providing a first component and a frame, wherein the frame comprises a conductive bonding pad and pins which are in corresponding relation with the conductive bonding pad, the conductive bonding pad and the corresponding pins are integrally formed, and the conductive bonding pad is positioned on one side of the pins away from the substrate; the first component and the frame are arranged on the assembling surface of the substrate, the frame is positioned on the side part of the first component, the first component is electrically connected with the first connecting terminal, and the pins of the frame are electrically connected with the second connecting terminal.
18. 18. The packaging method of claim 17, wherein in the step of providing the frame, the leads are located on a single side of the corresponding conductive pads; or in the step of providing the frame, the pins are located on opposite sides of the corresponding conductive pads.
19. 19. The packaging method of claim 18, wherein in the step of providing the frame, when the number of the conductive pads is plural and the pins are located on a single side of the corresponding conductive pads, the frame further comprises a connection rib, the connection rib connects adjacent conductive pads, a top surface of the connection rib is higher than a top surface of the conductive pad, and the connection rib and the conductive pads are integrally formed; the packaging method further comprises the step of removing the connecting ribs to separate the conductive bonding pads.
20. 20. The packaging method of claim 18, wherein in the step of providing the first component, the first component comprises a first chip; In the step of providing the frame, the frame further comprises a first heat dissipation pad arranged at intervals with the conductive pad and a connecting rib for connecting the first heat dissipation pad and the conductive pad, the top surface of the first heat dissipation pad is flush with the top surface of the conductive pad, the top surface of the first heat dissipation pad is lower than the top surface of the connecting rib, and the first heat dissipation pad, the connecting rib and the conductive pad are integrally formed; In the step of arranging the first component and the frame on the assembly surface of the substrate, the first heat dissipation pad is positioned on the surface of the first chip facing away from the substrate and is in heat conduction connection with the first chip; the packaging method further comprises the step of removing the connecting ribs to separate the conductive bonding pads and the first heat dissipation bonding pads.

Description

Package, stacked package structure and packaging method Technical Field The embodiment of the invention relates to the field of semiconductor manufacturing, in particular to a packaging body, a stacked packaging structure and a packaging method. Background The pursuit of performance and speed of electronic devices has driven continual innovation in packaging technology, and with the demand for miniaturization and thinness of electronic devices, surface mount technology (Surface Mounted Technology, SMT) has gradually replaced conventional in-line packaging. When soldering electronic components to a printed circuit board (Printed Circuit Board, PCB) using surface mount technology, a stereoscopic packaging approach is required in some cases due to the limited PCB area. Some components such as inductors can be soldered with copper columns on the bonding pads of the PCB, then the copper columns are fixed in a plastic package mode, a rewiring layer is formed on the copper columns, and finally the soldering feet of the electronic components are soldered on the rewiring layer. However, the above-mentioned three-dimensional packaging method increases packaging cost. Disclosure of Invention The embodiment of the invention solves the problem of providing a packaging body, a stacked packaging structure and a packaging method, which are beneficial to reducing the overall packaging cost. In order to solve the problems, the embodiment of the invention provides a package body, which comprises a substrate, a first component and a frame, wherein the substrate comprises at least one assembling surface, the assembling surface of the substrate is provided with a first connecting terminal and a second connecting terminal which are exposed, the first component is positioned on the assembling surface of the substrate and is electrically connected with the first connecting terminal, the frame is positioned on the assembling surface of the side part of the first component, the frame comprises a conductive bonding pad and a pin which is in corresponding relation with the conductive bonding pad, the conductive bonding pad and the corresponding pin are integrally formed, the conductive bonding pad is positioned on one side of the pin away from the substrate, and the pin is electrically connected with the second connecting terminal. Correspondingly, the embodiment of the invention also provides a stacked package structure, which comprises the package body according to any embodiment of the invention, and a second component which is positioned on the package body and faces the third bonding pad, wherein the second component is electrically connected with the third bonding pad. Correspondingly, the embodiment of the invention also provides a packaging method, which comprises the steps of providing a substrate, wherein the substrate comprises at least one assembling surface, the assembling surface of the substrate is provided with a first connecting terminal and a second connecting terminal which are exposed, providing a first component and a frame, the frame comprises a conductive bonding pad and a pin which is in corresponding relation with the conductive bonding pad, the conductive bonding pad and the corresponding pin are integrally formed, the conductive bonding pad is positioned at one side of the pin away from the substrate, the first component and the frame are arranged on the assembling surface of the substrate, the frame is positioned at the side part of the first component, the first component is electrically connected with the first connecting terminal, and the pin of the frame is electrically connected with the second connecting terminal. Compared with the prior art, the technical scheme of the embodiment of the invention has the following advantages: The embodiment of the invention provides a package body, which comprises a substrate, a first component, a frame and a frame, wherein the substrate comprises at least one assembly surface, the assembly surface of the substrate is provided with a first connecting terminal and a second connecting terminal which are exposed, the first component is positioned on the assembly surface of the substrate and is electrically connected with the first connecting terminal, the frame is positioned on the assembly surface of the side part of the first component, the frame comprises a conductive bonding pad and a pin which is in corresponding relation with the conductive bonding pad, the conductive bonding pad and the corresponding pin are integrally formed, the conductive bonding pad is positioned on one side of the pin away from the substrate, the pin is electrically connected with the second connecting terminal, and compared with the scheme that an interconnection structure (such as an interconnection column) is formed on the substrate firstly, and then a rewiring layer is formed on the top of the interconnection structure, the frame is adopted to replace the interconnection structure and the