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CN-121985852-A - Bonding pad of die and electronic device with die

CN121985852ACN 121985852 ACN121985852 ACN 121985852ACN-121985852-A

Abstract

The invention discloses a bonding pad of a die and an electronic device with the die. The electronic device comprises a carrier plate, a first die and a second die. The first die is disposed on the carrier and includes a first bonding pad and a second bonding pad. The second die is disposed on the carrier and includes a third bonding pad and a fourth bonding pad. The first bonding pad is directly connected with the third bonding pad through a first bonding wire, and the second bonding pad is directly connected with the fourth bonding pad through a second bonding wire. The first bonding pad is provided with a concave space, and the second bonding pad is arranged in the concave space.

Inventors

  • Xuan Nairen

Assignees

  • 瑞昱半导体股份有限公司

Dates

Publication Date
20260505
Application Date
20250724
Priority Date
20241029

Claims (10)

  1. 1. A bond pad implemented on a die, comprising: a first section; a second section connecting the first section, and A third section connected to the first section; The first section, the second section and the third section define a concave space, and the concave space is used for arranging a signal bonding pad.
  2. 2. The bonding pad of claim 1, wherein the signal bonding pad is configured to transmit a single-ended signal.
  3. 3. The bonding pad of claim 1, wherein the recessed space is a first recessed space, the signal bonding pad is a first signal bonding pad, the bonding pad further comprising: A fourth section connected to the first section; the first section, the third section and the fourth section define a second concave space, and the second concave space is used for arranging a second signal bonding pad and a third signal bonding pad.
  4. 4. The bonding pad of claim 3, wherein the first signal bonding pad is configured to transmit a single-ended signal and the second and third signal bonding pads are configured to transmit a differential signal.
  5. 5. The bonding pad of claim 1, wherein the width of the first section is W1, the width of the second section is W2, the width of the third section is W3, and the width of the recessed space is substantially equal to W1-W2-W3.
  6. 6. The bonding pad of claim 1, wherein the height of the second section is H2, the height of the third section is H3, and the height of the recessed space is substantially equal to H2 or H3.
  7. 7. The bond pad of claim 6, wherein H2 is substantially equal to H3.
  8. 8. The bonding pad of claim 1, wherein the die comprises a metal layer structure comprising a metal layer connected to a reference voltage, and wherein the second section and the third section are both connected to the metal layer.
  9. 9. The bonding pad of claim 1, wherein the die comprises a metal layer structure comprising a metal layer connected to a reference voltage, and only one of the second section and the third section is directly connected to the metal layer.
  10. 10. An electronic device, comprising: A carrier plate; a first die disposed on the carrier and including a first bonding pad and a second bonding pad, and A second die disposed on the carrier and including a third bonding pad and a fourth bonding pad; Wherein the first bonding pad is directly connected with the third bonding pad through a first bonding wire, and the second bonding pad is directly connected with the fourth bonding pad through a second bonding wire; the first bonding pad is provided with a concave space, and the second bonding pad is arranged in the concave space.

Description

Bonding pad of die and electronic device with die Technical Field The present invention relates to electronic devices, and more particularly, to a die and a bonding pad thereof. Background Fig. 1 shows a schematic diagram of a conventional die (die) and a wire between dies (die-to-die). Fig. 1 is a top view. The electronic device 100 includes a carrier (carrier) 105, a die 110, and a die 120. The die 110 and the die 120 are disposed on the carrier 105. Signals are transmitted between the die 110 and the die 120 through contact fingers 101-103. The contact fingers 101-103 are formed on the surface of the carrier 105. Bonding pads 111-113 are located on the surface of die 110, and bonding pads 121-123 are located on the surface of die 120. The bonding pad 111 and the bonding pad 121 are connected by the contact finger 101. Bond pad 112 and bond pad 122 are connected by contact finger 102. The bonding pad 113 and the bonding pad 123 are connected by the contact finger 103. In general, the contact finger 102 is used for transmitting signals (e.g., single-ended signals or differential signals), and the contact finger 101 and the contact finger 103 are connected to a reference voltage (e.g., ground). Disclosure of Invention In view of the shortcomings of the prior art, an object of the present invention is to provide a bonding pad of a die and an electronic device having the die, so as to improve the shortcomings of the prior art. One embodiment of the present invention provides a bond pad. The bonding pad is implemented on a die and includes a first section, a second section and a third section. The second section is connected with the first section. The third section is connected with the first section. The first section, the second section and the third section define a concave space, and the concave space is used for arranging a signal bonding pad. Another embodiment of the invention provides an electronic device. The electronic device comprises a carrier plate, a first die and a second die. The first die is disposed on the carrier and includes a first bonding pad and a second bonding pad. The second die is disposed on the carrier and includes a third bonding pad and a fourth bonding pad. The first bonding pad is directly connected with the third bonding pad through a first bonding wire, and the second bonding pad is directly connected with the fourth bonding pad through a second bonding wire. The first bonding pad is provided with a concave space, and the second bonding pad is arranged in the concave space. The technical means embodied by the embodiment of the invention can improve at least one of the defects of the prior art, so that the invention is beneficial to miniaturization and cost reduction of the electronic device compared with the prior art. The features, implementation and effects of the present invention will be described in detail below with reference to the accompanying drawings. Drawings FIG. 1 is a schematic diagram of a conventional die-to-die connection; FIG. 2A is a top view of one embodiment of an electronic device of the present invention; FIG. 2B is a side view of one embodiment of an electronic device of the present invention; FIG. 3 shows details of one embodiment of the bond pad of the present invention; FIG. 4 is a cross-sectional view of one embodiment of a die of the present invention; FIG. 5 is a cross-sectional view of another embodiment of the die of the present invention, and Fig. 6 shows a detail of another embodiment of the bond pad of the present invention. Reference numerals illustrate: 100. 200 electronic devices 101, 102, 103 contact fingers 540, 620, 630 concave space A-a' cross section 201, 202, 203 bonding wire 110, 120, 210, 220 die 105. 205 Carrier plates H1, H2, H3, ht height W1, W2, W3 width 410 Substrates 420, 520 metal layer structures 432, 434, 436 inter-links GND reference voltages 421, 422 metal layer 310. 320, 330, 612, 614, 616, 618: Segments 111. 112, 113, 121, 122, 123, 212, 214, 222, 224, 610, 622, 632, 634: Bond pads Detailed Description Technical terms used in the following description refer to conventional terms in the art, and as the description of the present invention, some terms are described or defined, and the explanation of the some terms is based on the description or definition of the present invention. The present disclosure includes a bonding pad of a die and an electronic device having the die. Since the die and some of the components included in the electronic device of the present invention may be known components alone, the details of the known components will be omitted from the following description without affecting the full disclosure and applicability of the device invention. Referring to fig. 2A and 2B, fig. 2A is a top view and fig. 2B is a side view of an embodiment of an electronic device according to the present invention. The electronic device 200 includes a carrier 205, a die 210, and a die 220. The die 210 and the die 220