Search

CN-121985857-A - Soldering flux groove, chip packaging method and chip

CN121985857ACN 121985857 ACN121985857 ACN 121985857ACN-121985857-A

Abstract

The invention relates to the technical field of chip processing, and discloses a soldering flux groove, a chip packaging method and a chip. The method comprises the steps of providing a chip, arranging a plurality of welding posts on the surface of the chip, acquiring the warping states and the warping degrees of different areas of the chip before pneumatic bubbling, determining preset areas according to the warping states of the chip, confirming operation parameters of a bubbling device according to the warping degrees, determining the warping states through the distances between the areas and a mounting suction nozzle, controlling the mounting suction nozzle to absorb the chip to be soaked in soldering flux of a dipping liquid area until the surfaces of the plurality of welding posts are soaked by the soldering flux, controlling the bubbling device to introduce gas into the preset areas of the dipping liquid area to generate bubbles when the mounting suction nozzle absorbs the chip to ascend or descend, and enabling the soldering flux to float upwards and break when contacting air, so that the soldering flux is spread upwards and attached to the surfaces of the plurality of welding posts. The uniformity of dipping soldering flux among a plurality of welding columns of the chip can be realized.

Inventors

  • XUE XIAOLEI
  • HU QINGHE
  • TANG JIE

Assignees

  • 此芯科技集团有限公司

Dates

Publication Date
20260505
Application Date
20260407

Claims (10)

  1. 1. A method of packaging a chip, comprising: providing a chip, wherein a plurality of welding columns are arranged on the surface of the chip; before pneumatic bubbling is carried out, the warping states and the warping degrees of different areas of a chip are obtained, the preset areas are determined according to the warping states of the chip, and the operation parameters of a bubbling device are confirmed according to the warping degrees; Controlling the mounting suction nozzle to absorb the chip and soaking the chip in the soldering flux in the dipping liquid area until the surfaces of the plurality of welding columns are soaked by the soldering flux; and when the mounting suction nozzle absorbs the chip to dip the soldering flux, controlling the mounting suction nozzle to ascend or descend, and simultaneously controlling the bubbling device to introduce gas into a preset area of the dipping liquid area to generate bubbles, wherein the bubbles drive the soldering flux to float upwards and break when contacting air, so that the soldering flux is upwards diffused and attached to the surfaces of the welding columns.
  2. 2. The method of claim 1, wherein the different regions comprise a central region and an annular rim region circumferentially surrounding the central region, the central region being concentric with the annular rim region.
  3. 3. The method of claim 2, wherein the operating parameters include bubbling time, bubbling air pressure, and frequency; The bubbling time, the bubbling air pressure and the bubbling frequency are in direct proportion to the warpage of the chip.
  4. 4. The method of claim 2, wherein determining the predetermined area according to the warpage state of the chip comprises: The annular edge area and the mounting suction nozzle are provided with a first interval, and the central area and the mounting suction nozzle are provided with a second interval; When the first interval is larger than the second interval, the preset area is correspondingly positioned under the central area, and when the second interval is larger than the first interval, the preset area is correspondingly positioned under the annular edge area.
  5. 5. The method of packaging chips as defined in claim 2, wherein the bubbling device is controlled to introduce gas into a predetermined area when the chip is sucked by the suction nozzle and lowered to a predetermined height in a direction approaching the dipping area.
  6. 6. The method of claim 5, wherein the bubbling device is controlled to inject gas into a predetermined area when the wafer in the annular edge region contacts the flux.
  7. 7. The method of any one of claims 1-6, wherein the gas is nitrogen.
  8. 8. A flux bath with open cells for use in a flip-chip apparatus, comprising: The tank body comprises a liquid dipping area for containing soldering flux, wherein a plurality of bubble holes are formed in the bottom of the liquid dipping area; The bubbling device is communicated with the plurality of bubbling holes and is used for performing pneumatic bubbling in the tank body so as to generate bubbles in the soldering flux; the controller is connected with the bubbling device and is configured to acquire the warping states and the warping degrees of different areas of the chip before pneumatic bubbling, determine the preset area according to the warping states of the chip to be processed and confirm the operation parameters of the bubbling device according to the warping degrees; During the process that the mounting suction nozzle adsorbs a chip to be treated to dip soldering flux, controlling the bubbling device to introduce gas into bubbling holes in a preset area to generate bubbles, and driving the soldering flux to float upwards and break when contacting air by the bubbles so as to enable the soldering flux to diffuse upwards; And the sensor group is electrically connected with the controller and used for determining the relative position of the chip and the liquid dipping area.
  9. 9. A fluxing agent tank as defined in claim 8 wherein the different regions comprise a central region and an annular edge region circumferentially surrounding the central region, the central region being concentric with the annular edge region.
  10. 10. A chip, characterized in that it is packaged by the chip packaging method according to any one of claims 1 to 7, or Chip packaging using the flux bath of any one of claims 8-9.

Description

Soldering flux groove, chip packaging method and chip Technical Field The invention relates to the technical field of chip assembly processing, in particular to a soldering flux groove, a chip packaging method and a chip. Background In the Flip Chip Ball grid array package (Flip Chip Ball GRID ARRAY, FCBGA) Chip Flip operation process, the Chip needs to be adsorbed, so that soldering flux is dipped on a soldering post, and the subsequent Chip and a substrate are soldered. When the chip has no warpage or small warpage, the vertical dipping operation can meet the working requirement. However, with the development and wide application of the AI technology, the chips subjected to the advanced packaging process integrate a plurality of chips inside, and are protected by plastic packaging materials, so that the thermal expansion coefficients of different materials are difficult to match, and the whole chip is warped to different degrees, so that the chip cannot be dipped with soldering flux uniformly, and the problem of cold joint exists after the chip is pasted, thereby influencing the welding quality and reliability of the product. Disclosure of Invention Based on the above, the present invention aims to provide a soldering flux groove, a chip packaging method and a chip. To achieve the above object, in a first aspect, the present invention provides a chip packaging method, including: providing a chip, wherein a plurality of welding columns are arranged on the surface of the chip; controlling the mounting suction nozzle to absorb the chips to be soaked in the soldering flux in the dipping liquid area until the surfaces of the plurality of welding columns are soaked by the soldering flux; Before pneumatic bubbling, acquiring the warping states and the warping degrees of different areas of the chip, determining preset areas according to the warping states of the chip, and determining operation parameters of a bubbling device according to the warping degrees; wherein, during the adsorption chip of the mounting suction nozzle dips in the scaling powder, the lifting or descending of the mounting suction nozzle is controlled, and at the same time, the bubbling device is controlled to introduce gas into the preset area of the dipping liquid area to generate bubbles, and the bubbles drive the scaling powder to float upwards and break when contacting with air, so that the scaling powder is upwards diffused and attached to the surfaces of a plurality of welding columns. In some embodiments, the method includes the different regions including a central region and an annular rim region circumferentially surrounding the central region, the central region being concentric with the annular rim region. In some embodiments, the operating parameters include bubbling time, bubbling air pressure, and frequency; The bubbling time, bubbling air pressure and bubbling frequency are all proportional to the warpage of the chip. In some embodiments, determining the preset area according to the warp state of the chip includes: The annular edge area and the mounting suction nozzle have a first interval, and the central area and the mounting suction nozzle have a second interval; when the first interval is larger than the second interval, the preset area is correspondingly positioned under the central area, and when the second interval is larger than the first interval, the preset area is correspondingly positioned under the annular edge area. In some embodiments, when the suction nozzle of the mounting apparatus descends to a specified height along a direction close to the dipping area, the bubbling device is controlled to introduce gas into the preset area. In some embodiments, the bubbling device is controlled to inject gas into the predetermined area when the wafer in the annular edge region contacts the flux. In some embodiments, the gas is nitrogen. In a second aspect, the present application provides a solder flux bath with a bulging cell for a flip-chip apparatus, comprising: the tank body comprises a liquid dipping area for containing soldering flux, wherein a plurality of bubble holes are formed in the bottom of the liquid dipping area; the bubbling device is communicated with the plurality of bubbling holes and is used for performing pneumatic bubbling in the tank body so as to generate bubbles in the soldering flux; The controller is connected with the bubbling device and is configured to acquire the warping states and the warping degrees of different areas of the chip before pneumatic bubbling, determine a preset area according to the warping states of the chip to be processed and confirm the operation parameters of the bubbling device according to the warping degrees; During the process that the mounting suction nozzle adsorbs a chip to be treated to dip soldering flux, controlling the bubbling device to introduce gas into bubbling holes in a preset area to generate bubbles, and driving the soldering flux to float upwards by t