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CN-121985859-A - Leveling mechanism and semiconductor device

CN121985859ACN 121985859 ACN121985859 ACN 121985859ACN-121985859-A

Abstract

The application discloses a leveling mechanism and semiconductor equipment. The leveling mechanism comprises a first connecting piece, an active leveling unit and a passive leveling unit, wherein the first connecting piece comprises a first transverse plate, a second transverse plate and a web plate, a through hole is formed in the first transverse plate, the second connecting piece is arranged on the opening side of the first connecting piece and comprises a first mounting surface, a second mounting surface and a connecting arm, the second mounting surface is connected with a piece to be leveled, an adjusting rod penetrates through the through hole of the first transverse plate, the end part of the adjusting rod is adjustably abutted to the first mounting surface, and an elastic piece is arranged between the first transverse plate and the first mounting surface in a pre-pressing state. In the application, the workpiece to be leveled is precisely adjusted to a horizontal state by the active leveling unit before operation, so that the operation precision and quality are ensured, and in the operation process, the flexible self-adaptive adjustment is realized by the elastic piece of the passive leveling unit, so that the local contact stress is solved, the substrate and the like are prevented from being damaged due to overload, namely, the active pose calibration and the passive self-adaptive buffering are simultaneously realized by using a single leveling mechanism.

Inventors

  • Request for anonymity
  • Request for anonymity
  • Request for anonymity

Assignees

  • 智慧星空(上海)工程技术有限公司

Dates

Publication Date
20260505
Application Date
20260408

Claims (12)

  1. 1. A leveling mechanism, comprising: the first connecting piece comprises a first transverse plate, a second transverse plate and a web plate, wherein the first transverse plate and the second transverse plate are arranged in parallel, and the web plate is used for connecting the first transverse plate and the second transverse plate; The second connecting piece is arranged on the opening side of the first connecting piece and comprises a first mounting surface and a second mounting surface which are arranged in parallel and a connecting arm for connecting the first mounting surface and the second mounting surface, the second mounting surface is connected with the piece to be leveled, and the first mounting surface and the first transverse plate are arranged in parallel and opposite; The active leveling unit comprises at least one adjusting rod which is respectively in one-to-one correspondence with the through holes on the first transverse plate, and the end parts of the active leveling unit penetrate through the through holes on the first transverse plate and are adjustably abutted against the first mounting surface; The passive leveling unit comprises an elastic piece, wherein the elastic piece is arranged between the first transverse plate and the first mounting surface in a pre-pressing state, and two ends of the elastic piece are respectively abutted with the first transverse plate and the first mounting surface.
  2. 2. The leveling mechanism of claim 1, wherein, The adjusting rod comprises a first adjusting rod and a second adjusting rod; The elastic piece is arranged between the first adjusting rod and the second adjusting rod.
  3. 3. The leveling mechanism of claim 1, wherein, The active leveling unit further comprises a locking piece; the locking piece is sleeved on the periphery of the adjusting rod and used for fixing the position of the adjusting rod.
  4. 4. The leveling mechanism of claim 1, wherein, The elastic piece is any one of a spring, an elastic rubber block or an elastic sheet.
  5. 5. The leveling mechanism of claim 1, wherein, The leveling mechanism further comprises a guiding unit; the guide unit comprises an elastic reed, one end of the elastic reed is connected with the first mounting surface, and the other end of the elastic reed is connected with the second transverse plate.
  6. 6. The leveling mechanism of claim 1, wherein, The first transverse plate, the second transverse plate and the web plate of the first connecting piece are of an integrated structure; The first mounting surface, the second mounting surface and the connecting arm of the second connecting piece are of an integrated structure.
  7. 7. The leveling mechanism of claim 1, wherein, The first connecting piece is of a C-shaped structure; The second connecting piece is of a Z-shaped structure.
  8. 8. A semiconductor device, characterized by comprising: The leveling mechanism of any one of claims 1 to 7; the to-be-leveled piece is fixedly connected to the second mounting surface of the leveling mechanism so as to actively level and passively level the to-be-leveled piece through the leveling mechanism; The electric press is connected with the member to be leveled and used for driving the member to be leveled to move and providing pressure for the member to be leveled; the supporting frame is connected with the leveling mechanism through the corrugated pipe assembly and the connecting rod.
  9. 9. The semiconductor device according to claim 8, wherein, The connecting rod comprises a first section and a second section along the axial direction; the corrugated pipe assembly is coaxially sleeved on the periphery of the second section; the corrugated pipe assembly comprises a first connecting end, a second connecting end and a corrugated pipe, wherein the first connecting end is connected with the supporting frame, and the second connecting end is fixedly connected with a cavity for accommodating the piece to be leveled.
  10. 10. The semiconductor device according to claim 8, wherein, The leveling mechanism comprises three leveling mechanisms which are distributed at intervals of 120 degrees along the circumferential direction; The connecting rods and the corrugated pipe assemblies are three, the three connecting rods are connected with the three leveling mechanisms in one-to-one correspondence, and the three corrugated pipe assemblies are respectively and coaxially sleeved on the peripheries of the three connecting rods.
  11. 11. The semiconductor device according to claim 8, wherein, The support frame is provided with a mounting hole, and the mounting hole is configured to allow the electric press to pass through, so that the output end of the electric press extends to the lower part of the support frame and is connected with the piece to be leveled.
  12. 12. The semiconductor device according to claim 8, wherein, The device also comprises a linear guide rail and a sliding block which is slidably arranged on the linear guide rail; The sliding block is fixedly connected with the support frame and is used for enabling the support frame, the corrugated pipe assembly connected with the support frame, the connecting rod and the member to be leveled to linearly move along the linear guide rail.

Description

Leveling mechanism and semiconductor device Technical Field The application relates to the technical field of semiconductor equipment, in particular to a leveling mechanism and semiconductor equipment. Background In existing semiconductor devices (e.g., bonding devices), high precision leveling of the substrate is critical to bond quality. However, the current equipment has the common problems that on one hand, active leveling before bonding and dynamic leveling in the bonding process are difficult to realize simultaneously through a single device, and on the other hand, real-time leveling cannot be usually carried out in the bonding process, so that the upper substrate and the lower substrate are in partial first contact. The non-uniform contact is extremely easy to cause stress concentration under the condition of high-pressure bonding, so that the upper and lower substrates or the upper and lower pressure plates are damaged, and the bonding yield is seriously affected. Therefore, a novel leveling mechanism is needed to complete high-precision active leveling before bonding, respond in real time and maintain even pressure distribution in the bonding process, so that local contact is effectively avoided, and bonding precision and reliability are improved. Disclosure of Invention The embodiment of the application provides a leveling mechanism and semiconductor equipment. According to the application, the stroke of the adjusting rod is adjusted through the active leveling unit, so that the stress point pose of the first mounting surface can be changed, and the second mounting surface and the upper pressing plate are driven to move through the connecting arm, so that the upper pressing plate is in a horizontal state before bonding, and high-precision bonding is realized. In the passive leveling process, a precompressed elastic piece is arranged between a first transverse plate and a first mounting surface, when an upper pressure plate moves downwards and contacts with a lower pressure plate, if partial preceding contact occurs, an upward reaction force generated by the upward reaction force pushes a second connecting piece to lift upwards, and the precompressed potential energy of the elastic piece is released. In order to achieve the above object, according to a first aspect of the present application, there is provided a leveling mechanism comprising: the first connecting piece comprises a first transverse plate and a second transverse plate which are arranged in parallel, and a web plate for connecting the first transverse plate and the second transverse plate, and a through hole is formed in the first transverse plate; the second connecting piece is arranged on the opening side of the first connecting piece and comprises a first mounting surface and a second mounting surface which are arranged in parallel and a connecting arm for connecting the first mounting surface and the second mounting surface, the second mounting surface is connected with the piece to be leveled, and the first mounting surface and the first transverse plate are arranged in parallel and opposite; The active leveling unit comprises at least one adjusting rod which is respectively in one-to-one correspondence with the through holes on the first transverse plate, and the end parts of the active leveling unit penetrate through the through holes on the first transverse plate and are adjustably abutted against the first mounting surface; The passive leveling unit comprises an elastic piece, wherein the elastic piece is arranged between the first transverse plate and the first mounting surface in a pre-pressing state, and two ends of the elastic piece are respectively abutted with the first transverse plate and the first mounting surface. Further, the adjusting rod comprises a first adjusting rod and a second adjusting rod; The elastic piece is arranged between the first adjusting rod and the second adjusting rod. Further, the active leveling unit further comprises a locking piece; the locking piece is sleeved on the periphery of the adjusting rod and used for fixing the position of the adjusting rod. Further, the elastic piece is any one of a spring, an elastic rubber block or an elastic sheet. Further, the leveling mechanism further comprises a guiding unit; The guide unit comprises an elastic reed, one end of the elastic reed is connected with the first mounting surface, and the other end of the elastic reed is connected with the second transverse plate. Further, the first transverse plate, the second transverse plate and the web plate of the first connecting piece are of an integrated structure; the first mounting surface, the second mounting surface and the connecting arm of the second connecting piece are of an integrated structure. Further, the first connecting piece is of a C-shaped structure; The second connecting piece is of a Z-shaped structure. According to a second aspect of the present application, there is provided a semicond