CN-121985862-A - Interconnect, package module and method of making the same

Abstract

The invention relates to the technical field of electronic equipment, in particular to an interconnection body, a packaging module and a preparation method thereof. The chip is packaged in the interconnection body, the first interconnection structure is located on the first side end face of the interconnection body, the second interconnection structure is located on the second side end face of the interconnection body, when the interconnection body is adopted to prepare the packaging module of the stacking structure, the interconnection body is ensured to be mounted through the existing SMT equipment, the mounting precision and the reliability of welding spots are improved, the problems of pin offset and falling in a reflow process are solved, the reliability and the service life of a product are improved, and the chip is packaged in the interconnection body, so that the packaging requirements of other chips or devices of the packaging module are reduced, and the functional density of the whole packaging module is improved.

Inventors

• WANG NAN
• GU JIONGJIONG
• LI PENG
• LI QUANBING

Assignees

• 长电科技(江阴)有限公司

Dates

Publication Date

20260505

Application Date

20260109

Claims (20)

1. 1. An interconnect body is provided which has a plurality of interconnect channels, characterized by comprising the following steps: The semiconductor device comprises a first chip, a first interconnection structure, a second interconnection structure, a metal lead and a plastic package body; The plastic package body wraps the first chip and the metal lead, the first interconnection structure is located on the first side end face of the plastic package body, the second interconnection structure is located on the second side end face of the plastic package body, the first side end face of the plastic package body and the second side end face of the plastic package body are oppositely arranged, and the first chip is electrically connected with the first interconnection structure and the second interconnection structure through the metal lead respectively.
2. 2. The interconnect of claim 1, wherein the first interconnect structure and the second interconnect structure are electrically connected through the first die and the metal leads.
3. 3. The interconnect of claim 1, wherein an end face of the metal lead exposed at a first side end face of the molded body serves as the first interconnect structure, and an end face of the metal lead exposed at a second side end face of the molded body serves as the second interconnect structure.
4. 4. The interconnect of claim 1, wherein the first surface of the first die comprises a plurality of first die pads, the first interconnect structure comprises a plurality of first interconnect substructures, the second interconnect structure comprises a plurality of second interconnect substructures, each of the first interconnect substructures is electrically coupled to a corresponding one of the first die pads via a metal lead, and each of the second interconnect substructures is electrically coupled to a corresponding one of the first die pads via a metal lead.
5. 5. An interconnect as in claim 4 wherein the number of first interconnect substructures and the number of second interconnect substructures are the same or different.
6. 6. The interconnect body of claim 4, wherein each of said first interconnect sub-structures further comprises a first interconnect pad located at an end face of each of said metal leads exposed at a first side end face of said molded body, and wherein each of said second interconnect sub-structures further comprises a second interconnect pad located at an end face of each of said metal leads exposed at a second side end face of said molded body.
7. 7. The interconnect of claim 4, wherein the molded body further comprises a molded body first surface and a molded body second surface, the molded body first surface and the molded body second surface are disposed opposite to each other, the molded body first surface, the molded body second surface are perpendicular to the molded body first side end surface, the molded body second surface exposes the second surface of the first chip, and the second surface of the first chip and the first surface of the first chip are disposed opposite to each other.
8. 8. An interconnect as in claim 7 wherein the second surface of the first chip has a heat sink or heat pipe.
9. 9. The interconnect of claim 7, wherein the second surface of the plastic package and the exposed second surface of the first chip have heat dissipating carrier plates.
10. 10. The interconnect of claim 1, further comprising a third interconnect structure, wherein the third interconnect structure is located on one or two plastic package side surfaces of the plastic package, the two plastic package side surfaces are disposed opposite to each other, the plastic package side surfaces are perpendicular to the first side end surface of the plastic package and the second side end surface of the plastic package, and the first chip and the third interconnect structure are electrically connected through metal leads.
11. 11. The interconnect of claim 10, wherein the end surfaces of the metal leads exposed from the side surfaces of the plastic package serve as the third interconnect structures, the third interconnect structures including a plurality of third interconnect sub-structures, each of the third interconnect sub-structures being electrically connected to the corresponding first die pad through a metal lead.
12. 12. An interconnect body according to claim 11, wherein each of said third interconnect substructures further includes a third interconnect pad located at an end face of each of said metal leads exposed at a side surface of said molded body.
13. 13. The interconnect of claim 1, further comprising other components encased in the plastic, the other components being electrically connected to the first die by metal leads.
14. 14. An interconnect as in claim 1 wherein said first chip comprises a plurality of first sub-chips; When the first chip is one first sub-chip, the first sub-chip is electrically connected with the first interconnection structure and the second interconnection structure through metal leads; when the first chip is a plurality of first sub-chips, the plurality of first sub-chips are electrically connected with the first interconnection structure and the second interconnection structure through metal leads at the same time, or the plurality of first sub-chips are electrically connected with the first interconnection structure or the second interconnection structure through metal leads and the plurality of first sub-chips are electrically connected with each other through metal leads.
15. 15. An interconnect as in claim 14 wherein a plurality of said first sub-chips are electrically connected to said first interconnect structure and said second interconnect structure simultaneously via metal leads, and wherein a plurality of said first sub-chips are electrically connected to each other independently or via metal leads.
16. 16. A method of making an interconnect, comprising: providing a carrier plate and a plurality of first chips; Arranging a plurality of first chips on the surface of the carrier plate, wherein the first surface of the first chips is far away from the surface of the carrier plate; Electrically connecting the first chips adjacent to each other in the first direction through metal leads; Forming a first plastic packaging material layer, wherein the first plastic packaging material layer covers the surfaces of the first chip, the metal lead and the carrier plate; The carrier plate is removed, a plurality of discrete interconnection bodies are formed by cutting, the first plastic package material layer is used as a plastic package body of the interconnection bodies, the plastic package body wraps the first chip and the metal leads, the plastic package body comprises a plastic package body first side end face and a plastic package body second side end face which are oppositely arranged, the plastic package body first side end face, the plastic package body second side end face and the first direction are perpendicular, the metal leads are cut off, the end faces of the metal leads are exposed to the plastic package body first side end face and the plastic package body second side end face, the end faces of the metal leads exposed from the plastic package body first side end face are used as a first interconnection structure, the end faces of the metal leads exposed from the plastic package body second side end face are used as a second interconnection structure, and the first chip is electrically connected with the first interconnection structure and the second interconnection structure through the metal leads.
17. 17. The method of manufacturing an interconnect of claim 16, wherein a heat sink and a heat pipe are disposed on the second surface of the first chip after the discrete interconnect is formed by dicing.
18. 18. The method of manufacturing an interconnect of claim 16, wherein the first surface of the first die includes a plurality of first die pads, the first interconnect structure includes a plurality of first interconnect substructures, the second interconnect structure includes a plurality of second interconnect substructures, each of the first interconnect substructures is electrically connected to a corresponding one of the first die pads through a metal lead, and each of the second interconnect substructures is electrically connected to a corresponding one of the first die pads through a metal lead.
19. 19. The method of claim 18, further comprising forming a first interconnect pad on an end surface of each of the metal leads exposed at a first side end surface of the molded body, the end surface of the metal lead and the first interconnect pad on the end surface of the metal lead as a first interconnect substructure, and forming a second interconnect pad on an end surface of each of the metal leads exposed at a second side end surface of the molded body, the end surface of the metal lead and the second interconnect pad on the end surface of the metal lead as a second interconnect substructure.
20. 20. The method of fabricating an interconnect of claim 16, wherein the interconnect further comprises a third interconnect structure, the step of forming the third interconnect structure comprising: The first chips are arranged on the surface of the carrier plate, the first chips adjacent to each other in the second direction are electrically connected through metal leads, and the second direction is perpendicular to the first direction; The method comprises the steps of cutting to form a plurality of discrete interconnects, wherein the plastic package further comprises two plastic package side surfaces which are oppositely arranged, the plastic package side surfaces are perpendicular to the first side end surface of the plastic package and the second side end surface of the plastic package, the metal lead wire which is used for being electrically connected in the second direction is cut off, the end surface of the metal lead wire is exposed on one plastic package side surface or two plastic package side surfaces of the plastic package, the end surfaces of the metal lead wire which are exposed on one plastic package side surface or two plastic package side surfaces serve as a third interconnection structure, and the first chip and the third interconnection structure are electrically connected through the metal lead wire.

Description

Interconnect, package module and method of making the same Technical Field The invention relates to the technical field of electronic equipment, in particular to an interconnection body, a packaging module and a preparation method thereof. Background Along with the continuous development of integrated electronic technology, the packaging module is widely applied to the high-performance computing fields such as servers, AI, GPU and the like, the conventional packaging module realizes multiplication of functional density per unit volume through vertical stacking, and transmission delay is effectively reduced by shortening the length of signal interconnection lines. The conventional packaging module is generally composed of a first substrate structure and a second substrate structure, as shown in fig. 1, the interconnection of the first substrate structure 1 and the second substrate structure 2 is completed through devices such as a pin header 3 and a copper column 4, the pin header 3 and the copper column 4 can complete the simple conduction function of the first substrate structure 1 and the second substrate structure 2, but the integration level is low, the higher requirements of high-performance calculation on the functional density and the performance cannot be met, in addition, the Surface mounting Technology (Surface-Mount Technology) of the pin header 3 and the copper column 4 is difficult, the rigid connection of the pin header 3 and the copper column 4 is low in welding spot reliability, and the problems such as cold welding and false welding are easy to occur. Disclosure of Invention In order to solve the technical problems, the invention provides an interconnection body, a packaging module and a preparation method thereof. The invention provides an interconnect, comprising: The semiconductor device comprises a first chip, a first interconnection structure, a second interconnection structure, a metal lead and a plastic package body; The plastic package body wraps the first chip and the metal lead, the first interconnection structure is located on the first side end face of the plastic package body, the second interconnection structure is located on the second side end face of the plastic package body, the first side end face of the plastic package body and the second side end face of the plastic package body are oppositely arranged, and the first chip is electrically connected with the first interconnection structure and the second interconnection structure through the metal lead respectively. Optionally, the first interconnection structure and the second interconnection structure are electrically connected through the first chip and the metal lead. Optionally, the end face of the metal lead exposed from the end face of the first side of the plastic package body is used as the first interconnection structure, and the end face of the metal lead exposed from the end face of the second side of the plastic package body is used as the second interconnection structure. Optionally, the first surface of the first chip comprises a plurality of first chip bonding pads, the first interconnection structure comprises a plurality of first interconnection substructures, the second interconnection structure comprises a plurality of second interconnection substructures, each first interconnection substructure is electrically connected with the corresponding first chip bonding pad through a metal lead, and each second interconnection substructure is electrically connected with the corresponding first chip bonding pad through a metal lead. Optionally, the number of the first interconnect substructures is the same as or different from the number of the second interconnect substructures. Optionally, each first interconnection substructure further comprises a first interconnection pad, wherein the first interconnection pad is located at an end face of each metal lead exposed from a first side end face of the plastic package body, and each second interconnection substructure further comprises a second interconnection pad, and the second interconnection pad is located at an end face of each metal lead exposed from a second side end face of the plastic package body. Optionally, the plastic package body further includes a first surface of the plastic package body and a second surface of the plastic package body, the first surface of the plastic package body and the second surface of the plastic package body are oppositely disposed, the first surface of the plastic package body, the second surface of the plastic package body, the first side end surface of the plastic package body, the second side end surface of the plastic package body are mutually perpendicular, the second surface of the plastic package body exposes the second surface of the first chip, and the second surface of the first chip and the first surface of the first chip are oppositely disposed. Optionally, the second surface of the first chip has a heat sink or