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CN-121985867-A - Injection molding packaging technology based on RFID chip

CN121985867ACN 121985867 ACN121985867 ACN 121985867ACN-121985867-A

Abstract

The invention relates to the technical field of plastic product molding, and discloses an injection molding packaging process based on an RFID chip, an intermediate packaging body and a plastic product. The process comprises the steps of providing an RFID chip with a through hole and a high-temperature resistant protective layer, performing first injection molding to enable a first plastic material to cover the chip and fill the through hole to form an intermediate packaging body, performing second injection molding to enable the intermediate packaging body to be covered with a second plastic material to obtain a final product. According to the invention, through holes are formed on the chip, so that a mechanical interlocking structure is formed after the injection molding material is filled, and meanwhile, the high-temperature resistant protective layer is utilized to isolate thermal shock, so that the implantation, protection and fixation of the chip are integrated in an automatic injection molding process. The process effectively solves the problems of complicated working procedures, easy chip release, easy falling and easy damage of the traditional method, remarkably improves the production efficiency and the product qualification rate, and the manufactured product has extremely high anti-theft property and reliability.

Inventors

  • YU ZHICHUN
  • ZHANG XIAOQING

Assignees

  • 广州芯伟达智能科技有限公司
  • 科创智联科技有限公司

Dates

Publication Date
20260505
Application Date
20251226

Claims (10)

  1. 1. An injection molding packaging process based on an RFID chip is characterized by comprising the following steps: s1, providing an RFID chip with an improved structure, wherein at least one through hole is arranged on a substrate of the chip, and the surface of a wafer of the chip is covered with a high-temperature resistant protective layer; S2, placing the RFID chip with the improved structure into a first injection mold for first injection molding, injecting a first plastic material into the mold, enabling the first plastic material to cover the chip and fill the at least one through hole, and cooling to form an RFID middle packaging body, wherein the first plastic material filled in the through hole and the plastic body covering the chip are connected into a whole to form an interlocking structure for mechanically locking the chip; And S3, placing the RFID middle packaging body serving as an insert into a second injection mold for second injection molding, and using a second plastic material to inject into the mold to cover at least a part of the RFID middle packaging body so as to form a final plastic product with the RFID chip.
  2. 2. The process of claim 1, wherein the at least one via comprises three vias, the center lines of the three vias forming an equilateral triangle.
  3. 3. The process of claim 1, wherein the high temperature resistant protective layer is a high temperature resistant epoxy.
  4. 4. The process of claim 2, wherein the diameter of the through hole is greater than 1mm.
  5. 5. The process of claim 1, wherein the first plastic material is a nylon composite material.
  6. 6. The process of claim 1, wherein the first plastic material is a different color than the second plastic material.
  7. 7. An RFID interposer package, comprising: the RFID chip with the improved structure is characterized in that at least one through hole is formed in a substrate of the chip, and a high-temperature resistant protective layer is covered on the surface of a wafer of the chip; the first injection molding body is formed integrally by injection molding of a first plastic material, and covers at least part of the surface of the RFID chip and fills at least one through hole on the chip substrate, so that the chip and the first injection molding body form a mechanical interlocking structure through the filling material in the through hole.
  8. 8. A plastic article incorporating RFID, comprising: The RFID intermediate package of claim 7, and A second injection-molded body formed by injection molding of a second plastic material and covering the RFID intermediate package At least a portion of the first and second portions.
  9. 9. The plastic article of claim 8, wherein the first plastic material is a different color than the second plastic material.
  10. 10. The plastic article of claim 8, wherein the plastic article is a gaming token, an identification tag, or a security tag.

Description

Injection molding packaging technology based on RFID chip Technical Field The invention relates to the technical field of plastic product molding, in particular to an injection molding packaging process based on an RFID chip, an intermediate packaging body prepared by the process and a plastic product with an RFID. Background Plastic products with built-in RFID chips are widely used in various fields such as asset tracking, anti-counterfeiting tracing, access control management, game entertainment, and the like. Conventional manufacturing methods of such products typically manufacture a plastic case, then manually insert the RFID chip therein, and finally seal with ultrasonic welding. The method has the defects of multiple working procedures, low production efficiency, easy chip missing due to manual operation and easy chip falling from a welding part in the use process, so that the product qualification rate is difficult to ensure. In the prior art, there is also a method such as a lamination hot press method for manufacturing a multilayer structural member (for example, a prior art document CN116172319A, EP4613143A2, etc.), which combines a multilayer plastic sheet with a chip by hot press and then press-forms. However, this process is complex and it is difficult to achieve effective protection and secure attachment of the fragile RFID chip in a high temperature, high pressure fluid environment. Another technique (for example, the prior art document WO2019/139609 A1) employs multiple injection molding to fix a decorative or structural insert (e.g., "CLIP INSERT"), but the packaging object is a peripheral mechanical structure, and the RFID chip itself is not directly structurally modified to achieve mechanical locking and thermal protection during injection molding. In particular, the hole or window in the prior art document WO2019/139609A1 is located on "CLIP INSERT" for the second shot of injection molding material filling to lock the insert, but its RFID chip is placed in the insert, the chip itself has no through hole or high temperature resistant protective layer design, and therefore the problem of direct impact of the injection molding melt, thermal stress damage to the chip, and lack of fundamental mechanical interlock between the chip and the plastic body cannot be solved. Therefore, a new method for packaging the RFID chip plastic, which can simplify the production flow, prevent the chip from being leaked and falling off, effectively protect the chip in the injection molding process and realize the firm combination of the chip and the plastic body, is urgently needed in the field. Disclosure of Invention In order to solve the problems in the background technology, the invention provides an innovative injection molding packaging scheme based on an RFID chip, which is characterized in that the structure of an RFID chip body is improved, and the two injection molding processes are combined to realize direct mechanical interlocking and thermal protection at the chip level. Specifically, the invention adopts the following technical scheme: In a first aspect, the present application provides an injection molding packaging process based on an RFID chip, including the steps of: S1, providing an RFID chip with an improved structure. The RFID chip is provided with at least one through hole for being filled with plastic materials in subsequent injection molding to form mechanical interlocking and disperse injection molding stress, and the surface of a wafer of the RFID chip is covered with a high-temperature resistant protective layer for isolating thermal shock in the injection molding process. S2, performing first injection molding to form the intermediate packaging body. The RFID chip with the improved structure is placed in a first injection mold, a first plastic material is injected, the first plastic material is made to cover at least part of the surface of the RFID chip and simultaneously fills at least one through hole in the chip, after cooling, an intermediate packaging body is formed, and plastic filled in the through hole and the plastic body covering the chip are connected into a whole to form an interlocking structure for mechanically locking the chip. And S3, carrying out injection molding for the second time to obtain a final plastic product. And placing the middle packaging body into a second injection mold as an insert, injecting a second plastic material, and enabling the second plastic material to cover at least part of the middle packaging body to form a final plastic product with the RFID chip. As a preferred embodiment of the present application, the at least one through hole includes three through holes, and a central line of the three through holes forms an equilateral triangle to provide balanced stress dispersion and locking force. As a preferred embodiment of the application, the diameter of the through holes is greater than 1mm to ensure that the molten plastic is sufficiently f