CN-121985871-A - Power module

Abstract

The invention discloses a power module. The power module includes a substrate provided with a chip mounted thereon, a molding portion provided to surround the substrate and the chip, a lead portion having one end electrically connected to the chip inside the molding portion and the other end exposed to the outside of the molding portion, and an insulating rib protruding from an outer surface of the molding portion provided with the lead portion.

Inventors

• DU HANZHEN
• LI DONGHUAN
• YANG ZHENMING
• Pu Shengyuan

Assignees

• 现代自动车株式会社
• 起亚株式会社

Dates

Publication Date

20260505

Application Date

20250604

Priority Date

20241030

Claims (20)

1. 1. A power module, comprising: A substrate provided with a chip mounted thereon; A molding portion provided to surround the substrate and the chip; A lead portion having a first end electrically connected to the chip inside the molding portion and a second end exposed to the outside of the molding portion, and And an insulating rib protruding from an outer surface of the molding portion where the lead portion is provided.
2. 2. The power module of claim 1, wherein, The lead part includes a signal lead for transmitting a control signal and a power supply lead for transmitting power, The insulation rib includes a signal lead insulation rib protruding from a first surface provided with a signal lead and a power lead insulation rib protruding from a first surface provided with a power lead.
3. 3. The power module of claim 2 wherein the signal lead includes a plurality of adjacent signal pins and the signal lead insulating rib is disposed between the plurality of signal pins.
4. 4. The power module of claim 3, wherein, The intervals between the signal pins are set to a first interval and a second interval, the second interval being wider than the first interval, The signal lead insulating ribs include first signal lead insulating ribs arranged in the first space and second signal lead insulating ribs arranged in the second space.
5. 5. The power module of claim 4, wherein a protruding length of the second signal lead insulation rib protruding from the outer surface of the molded portion is set to be longer than a protruding length of the first signal lead insulation rib protruding from the outer surface of the molded portion.
6. 6. The power module of claim 4 wherein a plurality of second signal lead insulating ribs are disposed in the second space.
7. 7. The power module of claim 4 wherein the signal lead insulating rib is disposed around an inner end of at least one of the signal pins that is in contact with the molded portion.
8. 8. The power module of claim 7 wherein the signal lead insulating rib is disposed around inner ends of a plurality of signal pins adjacently disposed at the first spacing.
9. 9. The power module of claim 7 wherein the signal lead insulating rib is disposed around an inner end of an outermost signal pin of a plurality of signal pins adjacently arranged at the first interval.
10. 10. The power module of claim 2, wherein the power supply leads include a plurality of input terminals for supplying power to the chip and a plurality of output terminals for outputting power converted by the chip.
11. 11. The power module of claim 10 wherein the power lead insulating rib comprises: a first power supply lead insulating rib provided between adjacent input terminals or between adjacent output terminals, and And a second power lead insulating rib provided between the input terminal and the adjacent output terminal.
12. 12. The power module of claim 11, wherein a protruding length of the second power lead insulation rib protruding from an outer surface of the molded portion is configured to be longer than a protruding length of the first power lead insulation rib protruding from an outer surface of the molded portion.
13. 13. The power module of claim 10, wherein the power lead insulating rib is disposed around an inner end of at least one of the input terminal or the output terminal that is in contact with the molded portion.
14. 14. A power module, comprising: A substrate provided with a chip mounted thereon; A molding part disposed around the substrate and the chip, and A lead portion having a first end electrically connected to the chip inside the molding portion and a second end exposed to the outside of the molding portion, Wherein the lead portion is exposed to the outside through an insulation groove formed by being recessed inward from an outer surface of the molded portion.
15. 15. The power module of claim 14 wherein, The lead part includes a signal lead for transmitting a control signal and a power supply lead for transmitting power, The insulation grooves include a signal lead insulation groove exposing the signal lead to the outside and a power lead insulation groove exposing the power lead to the outside.
16. 16. The power module of claim 15 wherein, The signal lead includes a plurality of adjacent signal pins, At least one of the plurality of signal pins is disposed within the signal lead insulation slot.
17. 17. The power module of claim 15 wherein the power supply leads include a plurality of input terminals that supply power to the chip and a plurality of output terminals that output power converted by the chip.
18. 18. The power module of claim 17 wherein the plurality of input terminals are disposed within the power lead insulation slots.
19. 19. The power module of claim 17 wherein the plurality of output terminals are disposed within the power lead insulation slot.
20. 20. The power module of claim 1, wherein, The lead portion includes a plurality of leads, The insulation rib comprises a plurality of insulation ribs, The plurality of insulating ribs protrude between the plurality of leads.

Description

Power module Cross Reference to Related Applications The present application claims the benefit of priority from korean patent application No. 10-2024-0150962 filed on the korean intellectual property office on 10-10/30 th 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present invention relates to a power module. Background With the increasing environmental concerns, environmentally friendly vehicles equipped with an electric motor as a power source are increasing. Environmentally friendly vehicles, also referred to as electric vehicles, representative examples include Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs). The inverter is used as a core component of power control affecting the performance and efficiency of the eco-friendly vehicle. An inverter is a device that converts Direct Current (DC) power into Alternating Current (AC) power, and may drive a motor by receiving power from a high-voltage battery. The inverter includes a power module as a core component. The power module processes high voltage and current to perform power conversion. In the design of power modules, ensuring the creepage (creepage) distance between the signal leads and the power leads is useful in maintaining signal accuracy and reliability. In the related art, in order to secure a creepage distance between a signal lead and a power lead, a method of adjusting a position of a chip mounted on a substrate may be used, however, it may be useful to have a power module structure that can achieve miniaturization of a power module while securing a creepage distance between a signal lead and a power lead. Disclosure of Invention An aspect of the present invention is to provide a power module suitable for miniaturization while providing a sufficient creepage distance between a signal lead and a power supply lead. According to an aspect of the present invention, a power module includes a substrate provided with a chip mounted thereon, a molding portion provided to surround the substrate and the chip, a lead portion having one end (e.g., a first end) electrically connected to the chip inside the molding portion and the other end (e.g., a second end) exposed to the outside of the molding portion, and an insulation rib protruding from an outer surface of the molding portion provided with the lead portion. The lead part may include a signal lead for transmitting a control signal and a power lead for transmitting power, and the insulation rib may include a signal lead insulation rib protruding from one surface provided with the signal lead and a power lead insulation rib protruding from one surface provided with the power lead. The signal lead may include a plurality of signal pins arranged adjacently, and the signal lead insulation rib may be arranged between the plurality of signal pins. The intervals between the signal pins may be set to a first interval and a second interval wider than the first interval, and the signal lead insulation ribs may include first signal lead insulation ribs disposed between the first intervals and second signal lead insulation ribs disposed between the second intervals. A protruding length of the second signal lead insulation rib protruding from the outer surface of the mold part may be set to be longer than a protruding length of the first signal lead insulation rib protruding from the outer surface of the mold part. The signal lead insulating rib may be disposed to surround an inner end of at least one of the signal pins, which is in contact with the mold portion. The signal lead insulating rib may be disposed to surround inner ends of the plurality of signal pins adjacently arranged at the first interval. The signal lead insulating rib may be disposed to surround an inner end of an outermost signal pin of a plurality of signal pins adjacently arranged at the first interval. The power supply lead may include a plurality of input terminals for supplying power to the chip and a plurality of output terminals for outputting power converted by the chip. The power lead insulation rib may include a first power lead insulation rib provided in the input terminal or the output terminal disposed adjacently, and a second power lead insulation rib provided between the input terminal and the output terminal disposed adjacently. A protruding length of the second power lead insulation rib protruding from the outer surface of the mold part may be configured to be longer than a protruding length of the first power lead insulation rib protruding from the outer surface of the mold part. The power lead insulating rib may be disposed to surround an inner end of at least one of the input terminal or the output terminal, which is in contact with the mold portion. According to an aspect of the present invention, a power module includes a substrate provided with a chip mounted thereon, a molding portion provided to surround the substrate and the chip, and a lead porti