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CN-121985873-A - Positioning device and positioning method used before chip bonding

CN121985873ACN 121985873 ACN121985873 ACN 121985873ACN-121985873-A

Abstract

The disclosure provides a positioning device and a positioning method before chip bonding, belonging to the technical field of semiconductor packaging. The positioning device comprises two positioning units, wherein each positioning unit comprises a workbench and a visual recognition system, the visual recognition system is electrically connected with the workbench and is configured to recognize the position of an object connected with the workbench, the object connected with the workbench of one positioning unit is a chip, the object connected with the workbench of the other positioning unit is a carrier plate, the two workbench are oppositely arranged, and at least one workbench is configured to adjust the position of the corresponding object according to the result of the visual recognition system so as to align the chip with the carrier plate. The bonding precision of the chip and the carrier plate can be improved, and the appearance yield of the device can be improved.

Inventors

  • ZHAO XIANG
  • YAN FAN
  • WANG NING

Assignees

  • 京东方华灿光电(广东)有限公司

Dates

Publication Date
20260505
Application Date
20251208

Claims (10)

  1. 1. A positioning device used before chip bonding, which is characterized by comprising two positioning units; each positioning unit comprises a workbench (1) and a visual recognition system (2); The visual recognition system (2) is electrically connected with the workbench (1) and is configured to recognize the position of an object connected with the workbench (1), the object connected with the workbench (1) of one positioning unit is a chip, and the object connected with the workbench (1) of the other positioning unit is a carrier plate; the two work tables (1) are arranged opposite to each other, and at least one work table (1) is configured to adjust the position of the corresponding object according to the result of the visual recognition system (2) so as to align the chip and the carrier plate.
  2. 2. Positioning device according to claim 1, characterized in that the chip and the carrier plate each have at least two marking features (400) on their surfaces, the marking features (400) being spaced apart along the circumference of the chip and the carrier plate where they are located, the position of the object comprising the coordinates of the center points of the at least two marking features (400); The visual recognition system (2) comprises an imaging unit (21) and a processing unit (22), wherein the imaging unit (21) is positioned between the two workbenches (1) and is used for acquiring images of the corresponding objects; The processing unit (22) is configured to determine coordinates of a center point of each of the marker features from the image of the object acquired by the imaging unit (21).
  3. 3. The positioning device of claim 2, wherein the marker feature is a cross marker, a circular marker, or a square marker.
  4. 4. A positioning device according to any one of claims 1-3, characterized in that the table (1) comprises an articulated moving table (11) and an adsorption table (12), the adsorption table (12) being remote from the adsorption surface (101) of the moving table (11) for adsorbing the object, and the adsorption table (12) being for levelling the adsorption surface (101).
  5. 5. The positioning device according to claim 4, characterized in that the positioning unit further comprises a leveling detection component (3), the leveling detection component (3) being adapted to detect the planarity of the surface of the object remote from the suction table (12).
  6. 6. The positioning device according to claim 5, wherein the leveling detection assembly (3) comprises a light emitter (31) and an image acquisition module (32), the light emitter (31) and the image acquisition module (32) being located on a side of the object remote from the adsorption table (12) and on opposite sides of the adsorption table (12), respectively; The light emitter (31) is used for emitting light to the surface of the object far away from the adsorption table (12), the image acquisition module (32) is used for acquiring an image of the surface of the object far away from the adsorption table (12) under the irradiation of the light, and the flatness is determined according to the acquired image.
  7. 7. The positioning device according to claim 5 or 6, wherein the adsorption table (12) comprises an adsorption disc (121) and a plurality of telescopic leveling structures (122) which are arranged at intervals, the telescopic direction of the telescopic leveling structures (122) is the axial direction of the adsorption disc (121), one end of each telescopic leveling structure (122) is connected with the adsorption disc (121), the other end is connected with the mobile table (11), and the end faces of one end of each telescopic leveling structure (122) and one end of the adsorption disc (121) are located in the same plane.
  8. 8. The positioning device according to claim 7, wherein the telescopic leveling structure (122) comprises a servo motor (1221), a support rod (1222) and a transmission structure (1223), a fixed end of the servo motor (1221) is connected with the mobile station (11), an output end is in transmission connection with the transmission structure (1223), the transmission structure (1223) is connected with one end of the support rod (1222), the other end of the support rod (1222) is connected with the adsorption table (12), and a length direction of the support rod (1222) is an axial direction of the adsorption disc (121).
  9. 9. Positioning device according to claim 7, wherein the table (1) further comprises a motion driving module (13), the motion driving module (13) being connected to the mobile station (11) and being configured to drive the mobile station (11) to move in a first direction, a second direction and a third direction and to drive the mobile station (11) to rotate, the axis direction of the rotation axis of the mobile station (11) being the same as the third direction; The first direction, the second direction and the third direction are perpendicular to each other, and the third direction is the same as the axial direction of the adsorption disc (121).
  10. 10. A positioning method for use before chip bonding, the positioning method comprising: Fixing the chip by a mobile station in one of the positioning units in a positioning device, the positioning device being as claimed in any one of claims 1-9; Fixing the carrier plate through a mobile station in another positioning unit in the positioning device; after the chip and the carrier plate are fixed, the visual recognition system recognizes the actual positions of the chip and the carrier plate; And the mobile station adjusts the positions of the chip or the carrier plate according to the actual positions of the chip and the carrier plate, so that the chip and the carrier plate are bonded after moving to the bonding position for alignment.

Description

Positioning device and positioning method used before chip bonding Technical Field The disclosure belongs to the technical field of semiconductor packaging, and in particular relates to a positioning device and a positioning method before chip bonding. Background In Micro panel display (Micro PANEL DISPLAY, MPD) packaging, a temporary bonding adhesive is required to bond an ultrathin chip with a rigid carrier plate (such as glass) with the same shape and size, so as to provide a uniform supporting surface for the chip and prevent the chip from warping or breaking due to stress in the steps of thinning, cutting and the like. In the related art, the positioning of the chip and the carrier plate before bonding is realized through the positioning device. The positioning device comprises a moving table, a plurality of limiting pins and an adsorption table. The limiting pins are fixed on the table top of the mobile station at intervals and form limiting spaces matched with the circular arc edges of the chip and the carrier plate. In the positioning process, the adsorption table adsorbs the carrier plate and drives the carrier plate to move to the table surface of the mobile table, so that the circular arc edges corresponding to the central angles larger than 200 DEG can be contacted with the limiting pins to realize limiting, and then the chip is placed above the carrier plate in the same mode and the circular arc edges corresponding to the central angles larger than 200 DEG are abutted against the limiting pins, so that the alignment and the fixation of the chip and the carrier plate are realized. And finally, pressing the chip and the carrier plate to finish bonding. However, due to the manufacturing tolerance and assembly gap of the limiting pin, and the microscopic deformation of the carrier plate or chip may occur when the carrier plate or chip contacts with the limiting pin, the carrier plate or chip may introduce random rotation or translation deviation during the positioning process. The chip and the carrier plate after bonding can be misplaced, the chip and the carrier plate cannot be completely overlapped, bonding precision is affected, and finally, the appearance yield of the device is adversely affected. Disclosure of Invention The embodiment of the disclosure provides a positioning device and a positioning method before chip bonding, which can improve the bonding precision of a chip and a carrier plate and the appearance yield of a device. The technical scheme is as follows: The embodiment of the disclosure provides a positioning device used before chip bonding, which comprises two positioning units, wherein each positioning unit comprises a mobile station and a visual recognition system, the visual recognition system is electrically connected with the mobile station and is configured to recognize the position of an object connected with the mobile station, the object connected with the mobile station of one positioning unit is a chip, the object connected with the mobile station of the other positioning unit is a carrier plate, the two mobile stations are arranged oppositely, and at least one mobile station is configured to adjust the position of the corresponding object according to the result of the visual recognition system so as to align the chip with the carrier plate. In still another implementation manner of the present disclosure, the chip and the surface of the carrier plate each have at least two marking features, the marking features are distributed at intervals along the circumferential direction of the chip and the carrier plate, the position of the object includes coordinates of center points of the at least two marking features, the visual recognition system includes an imaging unit and a processing unit, the imaging unit is located between the two mobile stations and is used for acquiring images of the corresponding object, and the processing unit is used for determining the coordinates of the center point of each marking feature according to the images of the object acquired by the imaging unit. In yet another implementation of the present disclosure, the marker feature is a cross marker, a circular marker, or a square marker. In yet another implementation of the present disclosure, the table includes a movable table and an adsorption table movably connected, the adsorption table is remote from an adsorption surface of the movable table for adsorbing the object, and the adsorption table is for leveling the adsorption surface. In yet another implementation of the present disclosure, the positioning unit further includes a leveling detection assembly for detecting a flatness of a surface of the object away from the adsorption table, and the adsorption table is moved relative to the mobile table to level the adsorption surface according to a detection result of the leveling detection assembly. In yet another implementation of the disclosure, the leveling detection assembly includes a l