CN-121985900-A - Medical assemblies, devices, systems, and related methods for dissipating heat

Abstract

A medical device may include a handle, an insertion portion coupled to the handle, and a distal tip coupled to a distal end of the insertion portion. The insertion portion may be configured to be inserted into a body cavity of a subject. The distal tip may include a Light Emitting Diode (LED) and a heat sink. The heat sink may be configured to absorb heat generated by the LEDs.

Inventors

• Constantine Kopotiyenko

Assignees

• 波士顿科学国际有限公司

Dates

Publication Date

20260505

Application Date

20240820

Priority Date

20230824

Claims (15)

1. 1. A medical device, comprising: A handle is arranged on the upper part of the handle, An insertion portion coupled to the handle, wherein the insertion portion is configured to be inserted into a body cavity of a subject, and A distal tip coupled to a distal end of the insertion portion, wherein the distal tip includes a Light Emitting Diode (LED) and a heat sink, wherein the heat sink is configured to absorb heat generated by the LED.
2. 2. The medical device of claim 1, wherein the heat sink is disposed proximal to the LED in the distal tip.
3. 3. The medical device of claim 1 or 2, wherein the heat sink comprises a ferrule and an articulation wire, wherein the heat sink is coupled to a distal end of the articulation wire, wherein each of the ferrule and the articulation wire is composed of one or more thermally conductive materials.
4. 4. The medical device of any preceding claim, wherein a space is defined between the LED and the heat sink, wherein the space comprises at least one of a thermally conductive material, a thermally conductive epoxy, or a thermally conductive adhesive.
5. 5. The medical device of claim 4, wherein the at least one of the thermally conductive material, thermally conductive epoxy, or thermally conductive adhesive of the space is configured to contact both the LED and the heat sink.
6. 6. The medical device of any preceding claim, Wherein the LED is a first LED, wherein the heat sink is a first heat sink, Wherein the distal tip further comprises a second LED and a second heat sink, an Wherein the second heat sink is disposed proximal to the second LED.
7. 7. The medical device of claim 6, wherein a first space is defined between the first LED and the first heat sink, wherein a second space is defined between the second LED and the second heat sink.
8. 8. The medical device of claim 7, wherein the first space comprises at least one of a first thermally conductive material, a first thermally conductive adhesive, or a first thermally conductive epoxy, and wherein the second space comprises at least one of a second thermally conductive material, a second thermally conductive epoxy, or a second thermally conductive adhesive.
9. 9. The medical device of claim 8, wherein the at least one of the first thermally conductive material, the first thermally conductive epoxy, or the first thermally conductive adhesive of the first space is in contact with both the first LED and the first heat sink, and wherein the at least one of the second thermally conductive material, the second thermally conductive epoxy, or the second thermally conductive adhesive of the second space is in contact with both the second LED and the second heat sink.
10. 10. The medical device of any one of claims 1 or 2, wherein the heat sink comprises an articulation joint, wherein the articulation joint is configured to articulate the distal tip.
11. 11. The medical device of claim 10, wherein the articulation joint comprises one or more gaps.
12. 12. The medical device of claim 10 or 11, wherein the articulation joint is disposed in a distal portion of the insertion portion.
13. 13. The medical device of any one of claims 10-12, wherein a space is defined between the LED and the articulation joint, wherein the space comprises at least one of a thermally conductive material, a thermally conductive adhesive, or a thermally conductive epoxy.
14. 14. The medical device of claim 1, wherein the heat sink comprises at least one layer of the insertion portion, wherein the at least one layer comprises a thermally conductive mesh.
15. 15. The medical device of claim 14, wherein a space is defined between the LED and the at least one layer of the insertion portion, wherein the space comprises at least one of a thermally conductive material, a thermally conductive adhesive, or a thermally conductive epoxy.

Description

Medical assemblies, devices, systems, and related methods for dissipating heat Cross Reference to Related Applications The present application claims the benefit of priority from U.S. provisional patent application No. 63/578,390 filed on 8/2023, 24, the entire contents of which are incorporated herein by reference. Technical Field The present disclosure relates generally to medical assemblies, devices, systems, and related methods for dissipating heat. More particularly, at least some embodiments of the present disclosure relate to assemblies, devices, systems, and related methods for managing the temperature of a distal tip of a medical device. Background Medical devices are typically inserted into the body to perform therapeutic and/or diagnostic procedures within the body of a subject. An example of such a device is an endoscope or other type of endoscope or insertion device, including an insertion portion that is introduced into the body for diagnostic or therapeutic purposes. The insertion portion of the endoscope is inserted into the subject's body through an opening (e.g., a natural opening or incision) and delivered to a site within the body, for example, through a body cavity. In one example, an endoscope may be inserted into a subject's mouth and advanced through the subject's esophagus. The endoscope or other speculum may include various features, for example, for assisting in performing therapeutic and/or diagnostic procedures within the subject's body. For example, the distal tip of the endoscope may include an imaging device and one or more illumination devices, such as one or more Light Emitting Diodes (LEDs). The LED illuminates the interior of the subject's body (e.g., a body cavity), thus allowing the user to view the interior of the subject's body. The distal tip may also include one or more openings (e.g., of a working channel), lifters, or other features. During use, one or more components of the distal tip may generate heat. For example, one or more LEDs may generate heat that may cause injury to the subject and/or affect the performance of the distal tip LED, imaging device, and/or other components. The size limitation of the distal tip may limit the number or type of components that may be included, for example, to manage the heat generated by the LEDs or other components of the distal tip. Accordingly, there is a need for medical assemblies, devices, systems, and related methods for incorporating a thermal management component in the distal tip of an endoscope. The assemblies, devices, systems, and methods of the present disclosure may correct some of the above-described deficiencies or address other aspects of the art. Disclosure of Invention Examples of the present disclosure relate, inter alia, to assemblies, devices, systems, and methods for performing one or more medical procedures with a medical device. In particular, the present disclosure includes medical assemblies, devices, and systems including at least one LED, and methods of use thereof (e.g., methods of managing heat generated by one or more components of a distal tip). Each example disclosed herein may include one or more features described in connection with any of the other disclosed examples. According to one aspect, a medical device may include a handle, an insertion portion coupled to the handle, and a distal tip coupled to a distal end of the insertion portion. The insertion portion may be configured to be inserted into a body cavity of a subject. The distal tip may include a Light Emitting Diode (LED) and a heat sink. The heat sink may be configured to absorb heat generated by the LEDs. The medical device may include one or more of the following features. In some aspects, a heat sink may be disposed in the distal tip proximal to the LED. The heat may include ferrules and articulation wires. A heat sink may be coupled to the distal end of the articulation wire. Each of the ferrule and the articulation wire may be constructed of one or more thermally conductive materials. In some aspects, a space may be defined between the LED and the heat sink. The space may include at least one of a thermally conductive material, a thermally conductive epoxy, or a thermally conductive adhesive. At least one of the thermally conductive material, the thermally conductive epoxy, or the thermally conductive adhesive of the space may be configured to contact both the LED and the heat sink. In some aspects, the LED may be a first LED and the heat sink may be a first heat sink. The distal tip may further include a second LED and a second heat sink. The second heat sink may be disposed proximal to the second LED. A first space may be defined between the first LED and the first heat sink. A second space may be defined between the second LED and the second heat sink. In some aspects, the first space may include at least one of a first thermally conductive material, a first thermally conductive adhesive, or a first thermally conductive e