CN-121986006-A - Repair using 2D and 3D combinations

Abstract

A repair system may use a laser to repair defects, such as excess material defects and open defects. The repair system may use a method of repairing the defect that combines 2D images and 3D measurements during the repair. Combining the 2D image and the 3D measurement during the repair may reduce defect repair time while repairing the finest part of the defect.

Inventors

• O.Mo

Assignees

• 奥宝科技有限公司

Dates

Publication Date

20260505

Application Date

20241115

Priority Date

20240605

Claims (20)

1. 1. A repair system, comprising: A light source configured to generate illumination; a laser generator configured to generate laser light; a dual axis scanner configured to steer the laser light; A sample stage configured to support a sample; an objective lens, wherein the laser light is configured to pass through the objective lens to the specimen to perform repair of a defect located at a defect location on the specimen; A detector configured to generate a 2D image of the defect location based on collected light, wherein the collected light is reflected or emitted from the defect location, passes through the objective lens to the detector, and A controller comprising one or more processors configured to execute program instructions stored on a memory, the program instructions causing the controller to: generating a 3D measurement of the defect location; determining a 3D shape of the defect by comparing the 3D measurement to an expected design of the defect location; Ablating the 3D shape of the defect by iteratively: Ablating a defect shape of the defect in the current layer by causing the laser light to scan the defect shape; Generating the 2D image; finding residues of the defect in the 2D image, and Ablating said residue of said defect.
2. 2. The repair system of claim 1, wherein the 3D measurement is generated using in-focus ranging.
3. 3. The repair system of claim 2 wherein the detector is configured to generate a plurality of 2D images having a plurality of inter-image offsets in a focal plane, wherein the 3D measurements are generated from the plurality of 2D images.
4. 4. The repair system of claim 3, wherein the plurality of inter-image offsets in the focal plane decrease toward a substrate of the sample.
5. 5. The repair system of claim 1 comprising a 3D camera, wherein the controller is configured to cause the 3D camera to generate the 3D measurement.
6. 6. The repair system of claim 1 wherein the program instructions cause the controller to segment the 3D shape into a plurality of defect shapes stacked together.
7. 7. The repair system of claim 1 wherein the program instructions cause the controller to determine that the 3D shape has been ablated using an open loop condition.
8. 8. The repair system of claim 7 wherein the open loop condition is a depth of ablation at the current layer estimated by the controller using an energy density of the laser light.
9. 9. The repair system of claim 7, wherein the repair system ablates the 3D shape without producing additional 3D measurements.
10. 10. The repair system of claim 1, wherein the residue of the defect is below a 3D accuracy limit of the 3D measurement.
11. 11. The repair system of claim 1 wherein the program instructions cause the controller to repeatedly generate the 2D image of the defect location, find the residue of the defect, and ablate the residue of the defect.
12. 12. The repair system of claim 11 wherein the program instructions cause the controller to repeatedly generate the 2D image of the defect location, find the residue of the defect, and ablate the residue of the defect until the controller determines that the residue of the defect is below an allowable defect size.
13. 13. The repair system of claim 11 wherein the program instructions cause the controller to refocus the laser light at different depths as the 2D image of the defect location is repeatedly generated, the residue of the defect is found, and the residue of the defect is ablated.
14. 14. The repair system of claim 1 wherein the defect is an excess material defect, wherein the laser light repairs the excess material defect by ablating the excess material defect.
15. 15. The repair system of claim 1 wherein the memory holds a design file and a defect report, wherein the design file includes the intended design.
16. 16. The repair system of claim 1, wherein the collected light reflected from the sample comprises light emitted by the sample after excitation by at least one of the illumination or the laser light.
17. 17. The repair system of claim 1 wherein the illumination is directed to the sample in a bright field configuration, wherein the illumination and the laser light are configured to pass through the objective lens to the sample.
18. 18. The repair system of claim 1, wherein the illumination is directed to the sample in a dark field configuration.
19. 19. The repair system of claim 1, wherein the controller is configured to ablate the 3D shape of the defect by repeatedly: ablating the defect shape of the defect in the current layer by causing the laser light to scan the defect shape, and The laser light is refocused down to the next layer.
20. 20. The repair system of claim 19, wherein the controller is configured to ablate the defect shape by causing the laser light to scan the defect shape of the defect in the current layer once before refocusing the laser light down to the next layer.

Description

Repair using 2D and 3D combinations Cross Reference to Related Applications The present application claims the benefit of U.S. provisional application No. 63/611,771 entitled "repair with 2D AND 3D combination (REPAIR USING COMBINED D AND 3D)", filed on U.S. c. ≡119 (e) regulations on day 2023, month 12, AND 19, which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates generally to printed circuits, and more particularly to repairing printed circuits. Background The printed circuit may include defects during fabrication, such as excess material defects (e.g., short circuit defects) or missing material defects (e.g., open circuit defects). Printed circuits with defects are either discarded or repaired. Repairing defects may be desirable to improve yield and reduce scrap. It would therefore be advantageous to provide an apparatus, system, and method that addresses the shortcomings described above. Disclosure of Invention In accordance with one or more embodiments of the present disclosure, a repair system is described. The repair system may include a light source configured to generate illumination, a laser generator configured to generate laser light, a dual-axis scanner configured to steer the laser light, a sample stage configured to support a sample, an objective lens, wherein the laser light is configured to pass through the objective lens to the sample to perform repair of a defect located at a defect location on the sample, a detector configured to generate a 2D image of the defect location based on collected light, wherein the collected light reflects or emits from the defect location, through the objective lens to the detector, and a controller including one or more processors configured to execute program instructions stored on a memory that cause the controller to generate a 3D measurement of the defect location, determine a 3D shape of the defect by comparing the 3D measurement to an expected design of the defect location, ablate the 3D shape of the defect by iteratively performing the following operations by causing the laser light to be reflected or emitted from the defect location, pass through the objective lens to the detector, and the ablation of the defect in the defect 2D image of the defect. In some aspects, the 3D measurement is generated using in-focus ranging. In some aspects, the detector is configured to generate a plurality of 2D images in a focal plane having a plurality of inter-image offsets, wherein the 3D measurements are generated from the plurality of 2D images. In some aspects, the plurality of inter-image offsets in the focal plane may decrease toward a substrate of the sample. In some aspects, the repair system may include a 3D camera, wherein the controller is configured to cause the 3D camera to generate the 3D measurements. In some aspects, the program instructions cause the controller to segment the 3D shape into a plurality of defect shapes stacked together. In some aspects, the program instructions cause the controller to determine that the 3D shape has been ablated using an open loop condition. In some aspects, the open loop condition is a depth of ablation at the current layer estimated by the controller using an energy density of the laser light. In some aspects, the repair system ablates the 3D shape without producing additional 3D measurements. In some aspects, the residue of the defect is below a 3D accuracy limit of the 3D measurement. In some aspects, the program instructions cause the controller to repeatedly generate the 2D image of the defect location, find the residue of the defect, and ablate the residue of the defect. In some aspects, the program instructions cause the controller to repeatedly generate the 2D image of the defect location, find the residue of the defect, and ablate the residue of the defect until the controller determines that the residue of the defect is below an allowable defect size. In some aspects, the program instructions cause the controller to refocus the laser light at different depths as the 2D image of the defect location is repeatedly generated, the residue of the defect is found, and the residue of the defect is ablated. In some aspects, the defect is an excess material defect, wherein the laser light repairs the excess material defect by ablating the excess material defect. In some aspects, the memory holds a design file and a defect report, wherein the design file includes the intended design. In some aspects, the collected light reflected from the sample includes light emitted by the sample after excitation by at least one of the illumination or the laser light. In some aspects, the illumination is directed to the sample in a bright field configuration, wherein the illumination and the laser light are configured to pass through the objective lens to the sample. In some aspects, the illumination is directed to the sample in a dark field configuration. In some aspects, the con