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CN-121986140-A - Dielectric film forming composition

CN121986140ACN 121986140 ACN121986140 ACN 121986140ACN-121986140-A

Abstract

The present disclosure relates to a dielectric film forming composition comprising (a) at least one poly (phenylene ether) resin comprising a methyl (acrylate) and (b) at least one second resin selected from the group consisting of i) at least one fully imidized polyimide polymer, ii) at least one polyamic acid ester, iii) at least one cyclized polydiene resin, and iv) a mixture of cyclized polydiene resin and a cyanate ester compound.

Inventors

  • B. B. De

Assignees

  • 富士胶片电子材料美国有限公司

Dates

Publication Date
20260505
Application Date
20240807
Priority Date
20230809

Claims (12)

  1. 1. A dielectric film forming composition comprising: (a) At least one polyphenylene ether resin comprising a methyl (acrylate), and (B) At least one second resin selected from the group consisting of: i) At least one fully imidized polyimide polymer; ii) at least one polyamic acid ester; iii) At least one cyclized polydiene resin, and Iv) a mixture of at least one cyclized polydiene resin and at least one cyanate ester compound.
  2. 2. The composition of claim 1, wherein the at least one poly (phenylene ether) resin comprising a methyl (acrylate) group comprises a poly (phenylene ether) resin having at least one methyl (acrylate) group as a terminal group.
  3. 3. The composition of claim 2, wherein the at least one poly (phenylene ether) resin comprising a methyl (acrylate) comprises a polymer of structure (I): (I), Wherein the method comprises the steps of N1 and n2 are each independently integers from 0 to 20; X is-C (O) -, -S (O) -, S (O) 2 -or-C (RR ') -, wherein R and R' are each independently H or C 1 -C 6 alkyl; each R 1 is independently an aliphatic hydrocarbon group having 1 to 6 carbon atoms, and Each R 2 is independently H, halo, or an aliphatic hydrocarbon group having 1 to 6 carbon atoms.
  4. 4. The composition of claim 2, wherein the at least one poly (phenylene ether) resin comprising a methyl (acrylate) comprises a polymer of structure (II): (II), Wherein m and n are each independently integers from 0 to 20, and Y is-C (O) -, -S (O) -, S (O) 2 -or-C (RR ') -, wherein R and R' are each independently H or C1-C6 alkyl.
  5. 5. The composition of any one of claims 1-4, wherein the at least one poly (phenylene ether) resin comprising a methyl (acrylate) comprises about 5 wt% to about 50% wt% of the composition.
  6. 6. The composition of any one of claims 1 to 5, wherein the at least one second resin comprises about 50 wt% to about 90 wt% of the composition.
  7. 7. The composition of any of claims 1 to 6, further comprising at least one cross-linking agent, at least one catalyst, at least one adhesion promoter, at least one solvent.
  8. 8. A method for preparing a dielectric film, comprising: a) Coating the dielectric film-forming composition according to any one of claims 1 to 7 on a substrate to form a film, and B) The film is optionally baked at a temperature of about 50 o C to about 150 o C for about 20 seconds to about 240 seconds.
  9. 9. The method of claim 8, further comprising exposing the film to radiation, heat, or a combination thereof without a mask.
  10. 10. A method for preparing a dry film, comprising: a) Coating a carrier substrate with the dielectric film-forming composition of any one of claims 1 to 7 to form a coated composition; b) Drying the coated composition to form a dielectric film, and C) Optionally, a protective layer is applied to the dielectric film.
  11. 11. The dielectric film of claims 1-10, wherein the dielectric film has a dissipation factor (Df) of at most about 0.01 at 5 GHz after curing by exposing the film to radiation, heat, or a combination thereof without a mask.
  12. 12. A photosensitive dielectric film forming composition comprising: (a) At least one polyphenylene ether resin comprising a methyl (acrylate), and (B) At least one second resin selected from the group consisting of: i) At least one fully imidized polyimide polymer; ii) at least one polyamic acid ester; iii) At least one cyclized polydiene resin, and Iv) a mixture of at least one cyclized polydiene resin and at least one cyanate ester compound, (C) At least one of the cross-linking agents, (D) At least one catalyst, and (E) At least one solvent.

Description

Dielectric film forming composition Cross Reference to Related Applications The present application claims priority from U.S. provisional application Ser. No. 63/531,581, having a filing date of 2023, 8, 9, the contents of which are incorporated herein by reference in their entirety. Background Dielectric materials having a low dielectric constant (Dk) and a low dielectric loss tangent (Df) can reduce transmission loss of materials used in high frequency bands. It is an object of the present disclosure to provide a dielectric material composition suitable for suppressing transmission loss of electrical signals in next generation high frequency (10 GHz or greater) applications. Disclosure of Invention In one aspect, the disclosure features a dielectric film-forming composition containing (a) at least one poly (phenylene ether) resin containing a methyl (acrylate), and (b) at least one second resin selected from the group consisting of i) at least one fully imidized polyimide polymer, ii) at least one polyamic acid ester, iii) at least one cyclized polydiene resin, and iv) a mixture of at least one cyclized polydiene resin and at least one cyanate ester compound. In some embodiments, the dielectric film-forming composition of the present disclosure is a photosensitive composition. In another aspect, the disclosure features a method for preparing a dielectric film that includes a) coating a dielectric film forming composition described herein on a substrate to form a dielectric film, and b) optionally baking the film at a temperature of about 50 o C to about 150 o C for about 20 seconds to about 240 seconds. In another aspect, the disclosure features a method for preparing a dry film that includes a) coating a carrier substrate with a dielectric film-forming composition described herein to form a coated composition, b) drying the coated composition to form a dry film, and c) optionally, applying a protective layer to the dry film. In yet another aspect, the disclosure features a dielectric film that contains (a) at least one poly (phenylene ether) resin containing a methyl (acrylate), (b) at least one second resin selected from the group consisting of i) at least one fully imidized polyimide polymer, ii) at least one polyamic acid ester, iii) at least one cyclized polydiene resin, and iv) a mixture of at least one cyclized polydiene resin and at least one cyanate ester compound. In some embodiments, the dielectric films of the present invention are photosensitive. Detailed Description Generally, the present disclosure relates to dielectric film forming compositions, and related methods, dry films, and dielectric films. In some embodiments, the dielectric film-forming compositions described herein include at least one (e.g., two, three, or four) meth (acrylate) -containing polyphenylene ether resin. As referred to herein, a poly (phenylene ether) resin containing a methyl group (acrylate) refers to a poly (phenylene ether) resin containing at least one (e.g., two) end groups having acrylate or methacrylate groups comprising an unsaturated double bond. As used herein, the term "(meth) acrylate" includes both acrylates and methacrylates. Examples of the methyl (acrylate) -containing polyphenylene ether resins described herein are polymers of structure (I): (I), Wherein each of n1 and n2 is independently an integer from 0 to 20; X is-C (O) -, -S (O) 2 -or-C (RR ') -, wherein each of R and R' is independently H or C 1-C6 alkyl; each R 1 is independently an aliphatic hydrocarbon group having 1 to 6 carbon atoms (e.g., a C 1-C6 alkyl group), and each R 2 is independently H, a halo group (e.g., F, cl, br, or I), or an aliphatic hydrocarbon group having 1 to 6 carbon atoms (e.g., a C 1-C6 alkyl group). Examples of polymers of structure (I) are polymers of structure (II): (II), wherein each of m and n is independently an integer from 0 to 20, and Y is-C (O) -, -S (O) -, S (O) 2 -or-C (RR ') -, wherein each of R and R' is independently H or C 1-C6 alkyl. A commercially available example of a polymer of structure (I) or (II) is SA9000 resin available from SABIC. In some embodiments, the poly (phenylene ether) resin comprising a methyl (acrylate) can comprise an amount of at least about 5wt% (e.g., at least about 10 wt%, at least about 15wt%, at least about 20wt%, at least about 25wt%, at least about 30 wt%, at least about 35 wt%, or at least about 40 wt%) to at most about 50 wt% (e.g., at most about 45 wt%, at most about 40 wt%, at most about 35 wt%, at most about 30 wt%, at most about 25wt%, at most about 20wt%, at most about 15wt%, or at most about 10 wt%) of the dielectric film forming compositions described herein. In some embodiments, the dielectric film-forming compositions described herein include at least one (e.g., two, three, or four) second resin (which is different from the poly (phenylene ether) ether-containing resin) selected from the group consisting of i) at least one fully imidized polyimide polymer, ii)