CN-121986141-A - Resin composition, sheet molding material, and alumina particles used in resin composition

Abstract

The invention provides a resin composition which comprises alumina particles and resin and has lower charge than the prior art. The resin composition comprises alumina particles and a resin, the amount of moisture generated in heating from 200 ℃ to 900 ℃ being greater than 59.8 ppm.

Inventors

• Ogen Uehara
• ITO TOMOHIRO
• SHIMASAKI YASUHARU
• Kayoguchi Yasuhiro

Assignees

• 住友化学株式会社

Dates

Publication Date

20260505

Application Date

20240919

Priority Date

20230929

Claims (7)

1. 1. A resin composition comprising alumina particles and a resin, The alumina particles have a moisture content greater than 59.8ppm produced in heating from 200 ℃ to 900 ℃.
2. 2. The resin composition according to claim 1, wherein the alumina particles have a moisture content generated in heating from 200 ℃ to 550 ℃ of greater than 43.0ppm.
3. 3. The resin composition according to claim 1, wherein the alumina particles have an absolute value of charge amount of 0.17kV or less.
4. 4. The resin composition according to claim 1, wherein the amount of α -rays is less than 0.022cph/cm 2 .
5. 5. The resin composition according to claim 1, wherein a ratio L2/L1 of a total length L2 of grain boundaries inside the alumina particles to a length L1 of an outer edge is less than 139.1%.
6. 6. A sheet molding compound comprising the resin composition according to any one of claims 1 to 5, The thickness is 1000 μm or less.
7. 7. An alumina particle that produces a moisture content greater than 59.8ppm in heating from 200 ℃ to 900 ℃.

Description

Resin composition, sheet molding material, and alumina particles used in resin composition Technical Field The present disclosure relates to a resin composition and a sheet molding compound, and alumina particles used in the resin composition. Background Since heat generated by energizing the electronic component is liable to adversely affect the performance of the electronic component, rapid heat dissipation is desired. Therefore, it is desirable that, for example, a material constituting the semiconductor sealing member surrounding the IC chip exhibits high thermal conductivity for heat dissipation. The sealing member generally includes inorganic particles (for example, alumina particles) and a resin as described in patent document 1. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2020-200478 Disclosure of Invention If dust or the like adheres during the manufacture of the semiconductor device, it becomes a cause of failure. In particular, in recent years, with miniaturization of semiconductor devices and narrowing of wiring pitches, adhesion of even fine dust has become a problem. In order to more reliably suppress adhesion of fine dust, a resin composition used for a semiconductor sealing member is required to further reduce the charge amount compared with the conventional one. However, a specific method for further reducing the charge amount of the resin composition as compared with the prior art is not known. The charge amount of the resin composition is not fully studied in patent document 1. In view of the above, an object of one embodiment of the present invention is to provide a resin composition which contains alumina particles and a resin and has a lower charge amount than before. Another embodiment of the present invention is to provide a sheet-like composition (sheet molding compound) composed of such a resin composition. Another object of the present invention is to provide alumina particles for use in the resin composition. The embodiment 1 of the present invention is a resin composition comprising alumina particles and a resin, The moisture content of the alumina particles produced in the heating from 200 ℃ to 900 ℃ is more than 59.8ppm. Mode 2 of the present invention the resin composition according to mode 1, wherein the amount of moisture generated in the heating of the alumina particles at 200 ℃ to 550 ℃ is more than 43.0ppm. In accordance with embodiment 3 of the present invention, the resin composition according to embodiment 1 or 2, wherein the absolute value of the charge amount of the alumina particles is 0.17kV or less. The invention according to mode 4 is the resin composition according to any one of modes 1 to 3, wherein an amount of the α -ray is less than 0.022cph/cm 2. The aspect 5 of the present invention is the resin composition according to any one of aspects 1 to 4, wherein a ratio (L2/L1) of a total length L2 of grain boundaries inside the alumina particles to a length L1 of an outer edge is less than 139.1%. The invention according to claim 6 provides a sheet molding material comprising the resin composition according to any one of claims 1 to 5, wherein the thickness is 1000 μm or less. Mode 7 of the present invention is an alumina particle which generates a moisture amount of more than 59.8ppm in heating from 200 to 900 ℃. According to one embodiment of the present invention, a resin composition having a lower charge amount than before can be provided. According to another embodiment of the present invention, a sheet molding material composed of such a resin composition can be provided. According to still another embodiment of the present invention, an alumina particle used in a resin composition can be provided. Detailed Description In order to reduce the risk of adhesion of fine dust to the resin composition as much as possible, the inventors have conducted intensive studies on a resin composition in which the amount of charge is suppressed to be lower than before. As a result, it has been found for the first time that the amount of charge of a resin composition can be effectively reduced by setting the amount of moisture contained in alumina particles used in the resin composition to a predetermined amount or more, and the present invention has been completed. Hereinafter, the resin composition of the embodiment, alumina particles used in the resin composition, and Sheet Molding Compound (SMC) composed of the resin composition will be described. [ Resin composition ] The resin composition of the present embodiment includes alumina particles and a resin. The alumina particles used were those having a moisture content of more than 59.8ppm generated in heating from 200 to 900 ℃. In the present specification, the term "resin composition" refers to a resin composition that includes all of a liquid state before curing the resin in the resin composition, a semi-cured state (B stage) in which the resin is semi-cured, and