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CN-121986182-A - Deposition system, shielding case set, substrate coating method and substrate

CN121986182ACN 121986182 ACN121986182 ACN 121986182ACN-121986182-A

Abstract

A deposition system is described. The system includes a first vacuum chamber having a first deposition source therein, a substrate transport rail configured to move a substrate past the first deposition source in a transport direction, and a shield transport rail positioned between the substrate transport rail and the first deposition source, configured to move a first shield in the transport direction in front of the substrate to protect an edge region of the substrate. The shield includes a first shield frame surrounding a first main opening defining a component area on a substrate. A first monitoring opening is arranged in the first protection frame, is positioned beside the first main opening and defines a first monitoring area outside the substrate element area.

Inventors

  • LI MINGYI
  • Jin Guancheng
  • HUANG RONGZHOU
  • Jin Rongdao
  • ZHENG ZHIYONG

Assignees

  • 应用材料公司

Dates

Publication Date
20260505
Application Date
20230907

Claims (20)

  1. 1. A deposition system, comprising: a first vacuum chamber having a first deposition source therein; A substrate transport track configured to move a substrate past the first deposition source in a transport direction; a shield transport rail between the substrate transport rail and the first deposition source and configured to move a first shield in the transport direction in front of the substrate to protect an edge region of the substrate, and The first protective cover comprises: A first protective frame surrounding a first main opening defining a device region on the substrate, The first protection frame is provided with a first monitoring opening, and the first monitoring opening is positioned beside the first main opening and defines a first monitoring area outside the element area on the substrate.
  2. 2. The deposition system of claim 1, wherein the first monitor opening extends from the first main opening into the first guard frame in a notched manner.
  3. 3. The deposition system of claim 1 or 2, wherein the first main opening is substantially rectangular in shape surrounded by the first guard frame, and the first monitor opening extends from the first main opening to the first guard frame in a C-shape, a U-shape, or a rectangle.
  4. 4. The deposition system of any of claims 1 to 3, wherein an area of the first main opening is 1m 2 or more and an area of the first monitor opening is 0.01m 2 or less.
  5. 5. The deposition system of any of claims 1 to 4, wherein the substrate transport track and the shield transport track extend substantially parallel in the first vacuum chamber to provide a distance between the substrate and the first shield of 1mm or more and no more than 10mm during deposition.
  6. 6. The deposition system according to any one of claims 1 to 5, wherein the first monitoring opening is located in the first protective frame and adjacent to the first main opening in the transport direction, with an opening width (W) in the transport direction that is larger than a width of a shadow area determined from a distance between the first protective cover and the substrate and from an opening angle of at least an evaporation plume emitted by the first deposition source.
  7. 7. The deposition system of any of claims 1 to 6, further comprising a second shield associated with a second deposition source, the second shield designed to protect the edge region of the substrate when coated with the second deposition source, the second shield comprising a second shield frame having a second monitor opening to define a second monitor region on the substrate outside the element region.
  8. 8. The deposition system of claim 7, wherein the second shield comprises: The second guard frame surrounds a second main opening having a size substantially corresponding to the first main opening of the first guard, wherein the second monitoring opening is disposed in the first guard frame beside the second main opening.
  9. 9. The deposition system of any of claims 1 to 8, comprising a set of shields including the first shield and at least two other shields, each shield frame of the set of shields having a monitoring opening defining a respective monitoring area on the substrate and located at a unique location between shields in the set of shields.
  10. 10. The deposition system of claim 9, wherein the monitor openings of each shield of the set of shields are on the same side of the main opening in the respective shield frame to define a plurality of monitor regions arranged in a column on the substrate.
  11. 11. The deposition system of claim 9 or 10, wherein the unique selection of locations of the monitoring openings in the protective frame of the protective cover set is such that the monitoring areas defined by the monitoring openings each comprise a measurement area on which only material from an associated deposition source is deposited.
  12. 12. The deposition system of any of claims 1 to 11, further comprising a substrate carrier having an electrostatic chuck to secure the substrate.
  13. 13. A set of shields for protecting a substrate in a deposition system, each shield of the set of shields configured to be movable in a transport direction and comprising: a guard frame surrounding a main opening to define a component area on the substrate, wherein a monitor opening is provided in the guard frame, the monitor opening being located alongside the main opening, the monitor opening being configured to define a respective monitor area outside the component area of the substrate; wherein the monitored opening position of each shield in the set of shields is a unique position between the shields.
  14. 14. The protective cover set of claim 13, wherein the monitoring opening of each protective cover extends from the respective main opening to the respective protective frame in a cutout-like manner.
  15. 15. A protective cover set according to claim 13 or 14, wherein the protective cover set is configured and dimensioned to substantially correspond to each other, only the positions of the respective monitoring openings being different.
  16. 16. A method of coating a substrate in a deposition system, comprising: moving the substrate past the first deposition source in a transport direction on a substrate transport track; Moving a first shield in front of the substrate on a shield transport rail to protect an edge region of the substrate from the first deposition source, the first shield including a first shield frame surrounding a first main opening, and A first material is directed to the substrate by the first deposition source, the first material being deposited on a device area defined by the first main opening and a first monitor area outside the device area defined by a first monitor opening located beside the first main opening.
  17. 17. The method of claim 16, wherein the first shield moves from the substrate in a range of 2mm to 10mm.
  18. 18. The method of claim 16 or claim 17, further comprising: moving the substrate on the substrate transport track past a second deposition source; Moving a second shield in front of the substrate to protect the edge region of the substrate from the second deposition source, the second shield including a second shield frame surrounding a second main opening, and Directing a second material towards the substrate by the second deposition source, the second material being deposited to the element area defined by the second main opening and a second monitoring area defined by a second monitoring opening provided in the second guard frame, the first and second monitoring areas being spaced apart or at least partially non-overlapping from each other.
  19. 19. The method of any of claims 16 to 18, comprising sequentially depositing a plurality of materials on the substrate by moving the substrate in front of a plurality of deposition sources, wherein the plurality of materials are deposited in a stack over the element area of the substrate, and only one of the plurality of materials is deposited within a measurement area defined by a monitoring opening of a protective mask set comprising the first protective mask, respectively.
  20. 20. The method of any of claims 16 to 19, comprising: A thickness of the first material within the first monitored region is measured.

Description

Deposition system, shielding case set, substrate coating method and substrate Technical Field Embodiments of the present invention relate to generating test structures or test components in deposition systems, particularly in-line deposition systems. Embodiments of the invention relate in particular to a deposition system, a set of shields, and a method of coating a substrate. Embodiments of the invention relate in particular to substrate processing for display applications, such as substrates for OLED display manufacturing, and in particular to creating OLED layer stacks. Background Organic Light Emitting Diodes (OLEDs) are a special type of light emitting diode in which the light emitting layer comprises a thin film of certain organic compounds. OLEDs are used to manufacture television screens, computer displays, mobile phones and other handheld devices, etc., to display information. OLEDs can also be used for general space illumination. OLED displays can display a larger range of colors and brightness than conventional LCD displays because the OLED materials emit light directly. The power consumption of an OLED display is significantly less than that of a conventional LCD display. Furthermore, OLEDs can be manufactured on flexible substrates, which further expands their application range. An OLED display may include an organic material layer between two electrodes, for example, an electrode made of a metal material. The OLED is typically placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED inside. Alternatively, the OLED may be encapsulated by thin film technology, such as encapsulation with a barrier film. In the fabrication of OLED cells, as well as other cells, multiple layers of material are deposited on a substrate. The plurality of material layers may be deposited by a corresponding plurality of deposition sources, such as evaporation sources. The deposition sources may deposit different materials such that the deposition sources have respective source conditions, for example, to optimize substrate processing. Independent source conditions may be advantageously monitored. For example, the layer thickness or layer uniformity of a single source is typically monitored. In particular, monitoring of operating conditions may be provided during manufacturing under production conditions. In view of the foregoing, it would be advantageous to provide a system, shield set, apparatus, and method that can separately monitor process conditions for different layers deposited on a substrate. Disclosure of Invention The invention is set forth in the appended claims. According to one embodiment, a deposition system is described. The system includes a first vacuum chamber having a first deposition source therein, a substrate transport rail configured to move a substrate past the first deposition source in a transport direction, and a shield transport rail positioned between the substrate transport rail and the first deposition source and configured to move a first shield in the transport direction in front of the substrate to protect an edge region of the substrate. The shield includes a first shield frame surrounding a first main opening defining a component area on a substrate. The first monitoring opening is arranged in the first protection frame, is positioned beside the first main opening and defines a first monitoring area outside the substrate element area. According to one embodiment, a set of shields for protecting a substrate in a deposition system is described. The deposition system may be a deposition system in some embodiment described herein. Each shield in the set is configured to be movable in a transport direction and includes a shield frame surrounding a main opening to define a component area on a substrate. The protective frame is provided with a monitoring opening beside the main opening, and the monitoring opening is configured to define a corresponding monitoring area outside the substrate element area. The monitored opening position of each shield in the set is unique among the shields. According to one embodiment, a method of coating a substrate in a deposition system is described. The method includes moving a substrate past a first deposition source in a transport direction on a substrate transport rail and moving a first shield in front of the substrate on a shield transport rail to protect an edge region of the substrate from being coated by the first deposition source. The first shield includes a first shield frame surrounding the first main opening. The method further includes directing, by a first deposition source, a first material toward the substrate, the first material being deposited on a first monitor region outside of a device region defined by a first monitor opening provided in a first guard frame beside the first main opening. Drawings So that the manner in which the above recited features can be understood in detail, a more par