CN-121986256-A - Inspection system, semiconductor manufacturing apparatus, and inspection method

CN121986256ACN 121986256 ACN121986256 ACN 121986256ACN-121986256-A

Abstract

The inspection system includes a table, a camera, a first moving mechanism, a second moving mechanism, and a control unit. The control section controls the camera, the first moving mechanism, and the second moving mechanism, respectively, to generate a plurality of first partial image data respectively representing mutually different portions of the electronic component. The control section performs a first process of performing correction in which inclination of the camera with respect to the first axis and correction in which a difference between an angle formed by the first axis and the second axis and a reference angle is taken into consideration, for each of the plurality of first partial image data, a second process of generating composite image data by synthesizing the plurality of corrected first partial image data, and a third process of inspecting the electronic component based on the composite image data.

Inventors

Miyada Kazushi
IKI Yoshino
Ou kyoshun
NAKAMURA KAZUMI
KIMURA SHUSATO

Assignees

东和株式会社

Dates

Publication Date: 20260505
Application Date: 20240807
Priority Date: 20231214

Claims (9)

1. An inspection system is provided with: A stage for holding the electronic component; A camera that photographs a part of the electronic component and generates first partial image data; A first moving mechanism that moves at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on a first axis; A second moving mechanism for moving at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on a second axis, and A control unit that controls the camera, the first moving mechanism, and the second moving mechanism, respectively, to generate a plurality of first partial image data that respectively indicate mutually different portions of the electronic component, The control section performs a first process of performing, for each of the plurality of first partial image data, correction in which inclination of the camera with respect to the first axis is taken into consideration, and correction in which a difference between an angle formed by the first axis and the second axis and a reference angle is taken into consideration, a second process of generating composite image data by synthesizing the plurality of corrected first partial image data, and a third process of inspecting the electronic component based on the composite image data.
2. The inspection system of claim 1, wherein, The reference angle is 90 °.
3. The inspection system of claim 1 or 2, wherein, The camera may include a lens that is configured to receive a lens, In the first process, correction in consideration of distortion of the lens is also performed for each of the plurality of first partial image data.
4. An inspection system according to any one of claims 1 to 3, wherein, The inspection system further includes a third moving mechanism that moves the camera along a third axis orthogonal to the first axis and the second axis, The control section controls the third moving mechanism so that a focus position of the camera along the third axis is adjusted, respectively, when each of the plurality of first partial image data is generated.
5. The inspection system of claim 4, wherein, The control section controls the third moving mechanism to adjust the focus position by referring to an imaginary plane, The imaginary plane is generated based on the focus positions of each of at least three points around a photographing position of the camera.
6. The inspection system of any one of claims 1 to 5, wherein, In the first process, the control unit sequentially performs, for each of the plurality of first partial image data, correction in which inclination of the camera with respect to the first axis is taken into account, and correction in which a difference between an angle formed by the first axis and the second axis and the reference angle is taken into account.
7. The inspection system of any one of claims 1 to 6, wherein, First correction data is used in correction taking into account the inclination of the camera with respect to the first axis, second correction data is used in correction taking into account the difference between the angle formed by the first axis and the second axis and the reference angle, Each of the first correction data and the second correction data is generated in advance, The camera captures the calibration plate, generates a second portion of image data, The second correction data is generated based on the second partial image data after correction using the first correction data is performed.
8. A semiconductor manufacturing apparatus includes: the inspection system of claim 1 to 7, and A manufacturing system for manufacturing the electronic component, The electronic component is a semiconductor device and, The inspection system inspects the electronic components manufactured by the manufacturing system.
9. An inspection method using an inspection system, The inspection system includes: A stage for holding the electronic component; A camera that photographs a part of the electronic component and generates partial image data; A first moving mechanism for moving at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on a first axis, and A second moving mechanism that moves at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on a second axis, The inspection method comprises the following steps: generating a plurality of partial image data respectively representing mutually different portions of the electronic component; A step of performing, for each of the plurality of partial image data, correction in consideration of inclination of the camera with respect to the first axis and correction in consideration of a difference between an angle formed by the first axis and the second axis and a reference angle; a step of generating composite image data by synthesizing the plurality of partial image data after correction, and And a step of inspecting the electronic component based on the synthesized image data.

Description

Inspection system, semiconductor manufacturing apparatus, and inspection method Technical Field The invention relates to an inspection system, a semiconductor manufacturing apparatus and an inspection method. Background Japanese patent application laid-open No. 2023-076250 (patent document 1) discloses an inspection system that inspects an inspection object from a captured image of the inspection object. In this inspection system, for example, 4 inspection objects are included in one captured image (see patent document 1). Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2023-076250 When an electronic component as an inspection object is large, the electronic component may not be entirely within the field of view of the camera. Patent document 1 does not disclose a method for inspecting electronic components which cannot be fully accommodated in the field of view of a camera. Disclosure of Invention The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an inspection system, a semiconductor manufacturing apparatus, and an inspection method capable of inspecting electronic components of a size that cannot be fully accommodated in a field of view of a camera with relatively high accuracy. An inspection system according to an aspect of the present invention includes a table, a camera, a first moving mechanism, a second moving mechanism, and a control section. The stage holds the electronic components. The camera captures a portion of the electronic component and generates first portion image data. The first moving mechanism moves at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on the first axis. The second moving mechanism moves at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on the second axis. The control unit controls the camera, the first moving mechanism, and the second moving mechanism, respectively, to generate a plurality of first partial image data, which respectively represent mutually different portions of the electronic component. The control section performs a first process of performing, for each of the plurality of first partial image data, correction in which inclination of the camera with respect to the first axis is taken into consideration, and correction in which a difference between an angle formed by the first axis and the second axis and a reference angle is taken into consideration, a second process of generating composite image data by synthesizing the plurality of corrected first partial image data, and a third process of inspecting the electronic component based on the composite image data. A semiconductor manufacturing apparatus according to another aspect of the present invention includes the inspection system and the manufacturing system described above. The manufacturing system manufactures the electronic component. The electronic component is a semiconductor device. The inspection system inspects electronic components manufactured by the manufacturing system. An inspection method according to another aspect of the present invention is an inspection method using an inspection system. The inspection system includes a table, a camera, a first movement mechanism, and a second movement mechanism. The stage holds the electronic components. The camera captures a portion of the electronic component and generates first portion image data. The first moving mechanism moves at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on the first axis. The second moving mechanism moves at least one of the table and the camera to change a relative positional relationship between the electronic component and the camera on the second axis. The inspection method includes a step of generating a plurality of partial image data respectively representing mutually different portions of the electronic component, a step of performing, for each of the plurality of partial image data, correction in which inclination of the camera with respect to the first axis is taken into consideration, and correction in which a difference between an angle formed by the first axis and the second axis and a reference angle is taken into consideration, a step of generating composite image data by synthesizing the plurality of partial image data after the correction, and a step of inspecting the electronic component based on the composite image data. Effects of the invention According to the present invention, it is possible to provide an inspection system, a semiconductor manufacturing apparatus, and an inspection method capable of inspecting electronic components of a size that cannot be fully accommodated in the field of view of a camera with relatively hig