CN-121986277-A - Display device

Abstract

The invention provides a display device with excellent heat dissipation. The wavelength conversion substrate (3A) is provided with a transparent substrate (31) having a first main surface and a second main surface, a partition layer (34) provided on the first main surface and having a plurality of first through holes arranged in a first direction and a second direction intersecting each other, a plurality of functional layers (36R, 36G, 36B) provided at the positions of the plurality of first through holes, respectively, wherein 1 or more of the functional layers are wavelength conversion layers for converting light emitted from a light source into light of another color, and a heat conduction layer (38) having light transmittance at the positions of the plurality of first through holes and having a higher thermal conductivity than the plurality of functional layers, with the partition layer and the plurality of functional layers being interposed therebetween.

Inventors

• Modern lucky filial piety two
• SAITO KEISUKE
• Kawada Kyokei

Assignees

• 凸版控股株式会社

Dates

Publication Date

20260505

Application Date

20241007

Priority Date

20231027

Claims (20)

1. 1. A wavelength conversion substrate is provided with: A transparent substrate having a first main surface and a second main surface; A partition wall layer provided on the first main surface and having a plurality of first through holes arranged in a first direction and a second direction intersecting each other; A plurality of functional layers provided at the positions of the plurality of first through holes, respectively, wherein at least 1 of the functional layers is a wavelength conversion layer for converting light emitted from the light source into light of other colors, and And a heat conductive layer which is opposed to the first main surface with the partition wall layer and the plurality of functional layers interposed therebetween, has light transmittance at the positions of the plurality of first through holes, and has higher thermal conductivity than the plurality of functional layers.
2. 2. The wavelength converting substrate of claim 1, wherein, The heat conductive layer has 1 or more openings, and the 1 or more openings are provided such that a first orthographic projection of an opening of each of the plurality of first through holes on a side opposite to the transparent substrate onto the first main surface and a second orthographic projection of the 1 or more openings onto the first main surface overlap at least partially.
3. 3. The wavelength converting substrate of claim 2, wherein, The overlapping portion of the first orthographic projection and the second orthographic projection is smaller than the first orthographic projection.
4. 4. The wavelength conversion substrate according to claim 3, wherein, The overlapping portion has an area which occupies 50% or less of the area of the first orthographic projection.
5. 5. The wavelength converting substrate according to any one of claims 1 to 4, wherein, The heat conduction layer is provided with a plurality of second through holes at the positions of the plurality of first through holes.
6. 6. The wavelength converting substrate according to any one of claims 1 to 4, wherein, The heat conductive layer has a plurality of second through holes arranged in the first direction and the second direction, and the plurality of second through holes are provided so as to cross 2 or more of the plurality of first through holes, respectively.
7. 7. The wavelength converting substrate according to any one of claims 1 to 4, wherein, The heat conductive layer includes 1 or more belt-shaped portions.
8. 8. The wavelength converting substrate according to any one of claims 1 to 7, wherein, The thermally conductive layer comprises a layer composed of a metal or alloy.
9. 9. The wavelength converting substrate according to any one of claims 1 to 7, wherein, The heat conductive layer is composed of a transparent oxide layer.
10. 10. The wavelength conversion substrate according to any one of claims 1 to 9, wherein, The heat conductive layer is made of a material having a thermal conductivity of 15W/mK or more.
11. 11. The wavelength converting substrate according to any one of claims 1 to 10, wherein, The heat conducting layer has a thickness in the range of 100-5000 nm.
12. 12. The wavelength converting substrate according to any one of claims 1 to 11, wherein, The barrier rib layer has a thickness in the range of 10 to 40 μm.
13. 13. The wavelength converting substrate according to any one of claims 1 to 12, wherein, An overcoat layer is also provided between the plurality of functional layers and the thermally conductive layer.
14. 14. The wavelength converting substrate of claim 13, wherein, The overcoat layer is also between the barrier wall layer and the thermally conductive layer.
15. 15. A display device is provided with: The wavelength converting substrate of any one of claims 1 to 14; a dimmer device disposed opposite to the first main surface, and And an adhesive layer interposed between the wavelength conversion substrate and the light control device and adhering them.
16. 16. The display device according to claim 15, further comprising: a radiator disposed outside the laminated body of the wavelength conversion substrate, the light adjusting device and the adhesive layer, and And a heat conductor for guiding heat from the heat conductive layer to the heat radiator.
17. 17. The display device of claim 16, wherein, The heat sink includes a back heat sink provided so as to sandwich the light adjuster and the adhesive layer and face the wavelength conversion substrate.
18. 18. The display device of claim 17, wherein, The back heat radiation body is a back heat radiation layer arranged on the dimming device.
19. 19. The display device according to any one of claims 16 to 18, wherein, At least a portion of the thermal conductor is disposed outside of the laminate.
20. 20. The display device of claim 19, wherein, The heat conductor at least partially covers an end face of the laminate.

Description

Display device Technical Field The present invention relates to a display device. Background In a display device, a light emitting element such as a light emitting diode is used as a light source of a backlight unit or as a constituent element of a pixel or a subpixel (see patent documents 1 and 2). Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 2000-131683 Patent document 2 Japanese patent application laid-open No. 2009-244383 Disclosure of Invention The invention aims to provide a display device with excellent heat dissipation. According to one aspect of the present invention, there is provided a wavelength conversion substrate including a transparent substrate having a first main surface and a second main surface, a partition layer provided on the first main surface and having a plurality of first through holes arranged in a first direction and a second direction intersecting each other, a plurality of functional layers provided at positions of the plurality of first through holes, respectively, wherein 1 or more of the functional layers are wavelength conversion layers that convert light emitted from a light source into light of another color, and a heat conductive layer that has a light transmittance at the positions of the plurality of first through holes and a higher thermal conductivity than the plurality of functional layers, with the partition layer and the plurality of functional layers being interposed therebetween so as to face the first main surface. According to another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the heat conductive layer has 1 or more openings, and the 1 or more openings are provided such that a first orthographic projection of an opening of each of the plurality of first through holes on a side opposite to the transparent substrate toward the first main surface overlaps at least partially with a second orthographic projection of the 1 or more openings toward the first main surface. According to a further aspect of the present invention, there is provided the wavelength converting substrate according to the above aspect, wherein an overlapping portion of the first orthographic projection and the second orthographic projection is smaller than the first orthographic projection. According to still another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein a proportion of an area of the overlapping portion in an area of the first orthographic projection is 50% or less. According to still another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the heat conductive layer has a plurality of second through holes at positions of the plurality of first through holes, respectively. According to still another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the heat conductive layer has a plurality of second through holes aligned in the first direction and the second direction, the plurality of second through holes being provided so as to respectively cross 2 or more of the plurality of first through holes. According to still another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the heat conductive layer includes 1 or more belt-shaped portions. According to a further aspect of the present invention, there is provided the wavelength converting substrate according to the above aspect, wherein the thermally conductive layer comprises a layer composed of a metal or an alloy. According to a further aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the heat conductive layer is constituted by a transparent oxide layer. According to still another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the heat conductive layer is composed of a material having a thermal conductivity of 15W/m·k or more. According to still another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the heat conductive layer has a thickness in a range of 100 to 5000 nm. According to still another aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein the partition wall layer has a thickness in a range of 10 to 40 μm. According to a further aspect of the present invention, there is provided the wavelength conversion substrate according to the above aspect, wherein an overcoat layer is further provided between the plurality of functional layers and the thermally conductive layer. According to a further aspect