CN-121986549-A - Packaging of power modules

Abstract

An electronic system is provided that includes a printed circuit board having conductive traces coupled to voltage outputs. A voltage regulator is disposed on the printed circuit board, the voltage regulator including a voltage regulator phase output terminal. Further, the electronic system includes an inductor module coupled with the voltage regulator. The inductor module includes an inductor core and an inductor segment having a first end and a second end, wherein the first end of the inductor segment is connected to the voltage regulator phase output terminal and the second end of the inductor segment is connected to the conductive trace of the printed circuit board. The inductor segment is configured to pass through and wrap around at least a portion of the inductor core, and the voltage regulator is configured to transfer heat to the inductor segment and the inductor module through the voltage regulator phase output terminal.

Inventors

• LIU ZHIZHENG
• ZHANG HAIYU
• Sri Ganesh Ataru Malingam
• Mark Alan Kuaka
• YAN YONGJIU

Assignees

• 瑞萨电子美国有限公司

Dates

Publication Date

20260505

Application Date

20240606

Priority Date

20230606

Claims (20)

1. 1. An electronic system, comprising: A printed circuit board having conductive traces coupled to the voltage output; a voltage regulator disposed on the printed circuit board and having voltage regulator phase output terminals accessible on a top surface of the voltage regulator, and An inductor module coupled with the voltage regulator, the inductor module having an inductor core and an inductor segment, the inductor segment having a first end and a second end, the first end of the inductor segment being connected to the voltage regulator phase output terminal, the second end of the inductor segment being connected to the conductive trace of the printed circuit board, the inductor segment being configured to pass through and wrap around at least a portion of the inductor core, the voltage regulator being configured to transfer heat to the inductor segment and the inductor module through the voltage regulator phase output terminal.
2. 2. The electronic system of claim 1, wherein the conductive trace has a conductive trace first end and a conductive trace second end, the conductive trace second end disposed below a bottom of the voltage regulator such that the inductor segment and the conductive trace encircle at least an end of the voltage regulator.
3. 3. The electronic system of claim 1, wherein the inductor core is configured to be one of: (a) Located entirely on the top surface of the voltage regulator, (B) Partially on top of the voltage regulator, partially on the side adjacent to the voltage regulator, and (C) On the side adjacent to the voltage regulator.
4. 4. The electronic system of claim 1, wherein the voltage regulator phase output terminal comprises a metal block containing a thermal mass.
5. 5. The electronic system of claim 1, wherein the inductor segment overlaps a portion of or the entire voltage regulator phase output terminal.
6. 6. The electronic system of claim 1, wherein the inductor segment is U-shaped and extends continuously from a lower portion of the inductor module to the printed circuit board.
7. 7. The electronic system of claim 6, wherein the first end of the inductor segment is soldered to the voltage regulator output phase terminal and the second end of the inductor segment is soldered to the conductive trace of the printed circuit board.
8. 8. The electronic system of claim 1, further comprising: A power stage comprising a pair of Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) arranged in series between a voltage input and ground, the pair of MOSFETs having an intermediate node therebetween, the intermediate node coupled to the voltage regulator phase output terminal, and A drive circuit is coupled to the power stage and is configured to control operation of the pair of transistors to drive power from the voltage input to the voltage output.
9. 9. The electronic system of claim 8, further comprising: A controller is coupled to the drive circuit and is configured to execute at least one of a sequence of instructions and a hardware algorithm to operate the drive circuit.
10. 10. The electronic system of claim 1, wherein the inductor segment is a first inductor segment, the electronic system further comprising a second inductor segment configured to surround the portion of the inductor core wound by the first inductor segment, the second inductor segment disposed between the first inductor segment and the inductor core, the first and second inductor segments forming a transformer with the inductor core.
11. 11. An electronic system, comprising: A printed circuit board having a first conductive trace and a second conductive trace; A first voltage regulator disposed on the printed circuit board and having a first voltage regulator phase output terminal accessible on a top surface of the first voltage regulator; A second voltage regulator disposed on the printed circuit board and having a second voltage regulator phase output terminal accessible on a top surface of the second voltage regulator, and An inductor module coupled with the first voltage regulator and the second voltage regulator and spanning at least a portion of a first top surface portion of the first voltage regulator and a second top surface portion of the second voltage regulator, the inductor module having an inductor core and an inductor segment, the inductor segment having a first end and a second end, the first end of the inductor segment being connected to the first voltage regulator phase output terminal and the second voltage regulator phase output terminal, the second end of the inductor segment being connected to the conductive trace of the printed circuit board, the inductor segment being configured to pass through and wrap around at least a portion of the inductor core, the first voltage regulator and the second voltage regulator being configured to transfer heat to the inductor segment and the inductor module through the first voltage regulator phase output terminal and the second voltage regulator phase output terminal.
12. 12. The electronic system of claim 11, wherein the first conductive trace has a first conductive trace first end and a first conductive trace second end, the first conductive trace second end disposed below a bottom of the first voltage regulator such that a first inductor segment and the first conductive trace at least encircle an end of the first voltage regulator, and wherein the second conductive trace has a second conductive trace first end and a second conductive trace second end, the second conductive trace second end disposed below a bottom of the second voltage regulator such that a second inductor segment and the second conductive trace at least encircle an end of the second voltage regulator.
13. 13. The electronic system of claim 11, wherein the inductor core is configured to be one of: (a) Located entirely on the top surface of the first voltage regulator and the top surface of the second voltage regulator, (B) Partially on top of the first voltage regulator, partially on top of the second voltage regulator, and (C) On a side adjacent to the first voltage regulator and the second voltage regulator.
14. 14. The electronic system of claim 11, wherein at least one of the first voltage regulator phase output terminal and the second voltage regulator phase output terminal comprises a metal block including a thermal mass.
15. 15. The electronic system of claim 11, wherein the inductor segment is U-shaped and extends continuously from a lower portion of the inductor module to the printed circuit board.
16. 16. The electronic system of claim 11, wherein the first end of the inductor segment is soldered to the voltage regulator output phase terminal and the second end of the inductor segment is soldered to the conductive trace of the printed circuit board.
17. 17. The electronic system of claim 11, further comprising: a first power stage comprising a first pair of Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) arranged in series between a voltage input and ground, the first pair of MOSFET transistors having a first intermediate node therebetween, the first intermediate node coupled to the first voltage regulator phase output terminal; A first drive circuit coupled to the first power stage and configured to control operation of the first pair of transistors to drive power from the voltage input to the voltage output; A second power stage comprising a second pair of metal oxide semiconductor field effect transistors arranged in series between the voltage input terminal and the ground, the second pair of MOSFET transistors having a second intermediate node therebetween, the second intermediate node being coupled to the second voltage regulator phase output terminal, and A second drive circuit is coupled to the second power stage and is configured to control operation of the second pair of transistors to drive power from the voltage input to the voltage output.
18. 18. The electronic system of claim 17, further comprising: a controller coupled to the first and second drive circuits, the controller for executing a sequence of instructions to operate the first and second drive circuits.
19. 19. The electronic system of claim 11, further comprising: a third inductor segment configured to surround a portion of the inductor core wound by the first inductor segment, the third inductor segment disposed between the first inductor segment and the inductor core, the first and third inductor segments and the inductor core forming a first transformer, and A fourth inductor segment configured to surround a portion of the inductor core wound by the second inductor segment, the fourth inductor segment disposed between the second inductor segment and the inductor core, the second inductor segment and the fourth inductor segment forming a second transformer with the inductor core.
20. 20. A semiconductor module, comprising: a wiring substrate; A first module assembly mounted on the wiring substrate, comprising: the first MOSFET is used to drive the first MOSFET, A second MOSFET serially coupled to the first MOSFET, and A first driver IC for controlling a first gate of the first MOSFET and a second gate of the second MOSFET; a second module assembly mounted on the wiring substrate and disposed beside the first module assembly, comprising: The third MOSFET is used to drive the second MOSFET, A fourth MOSFET serially coupled to the third MOSFET, an A second driver IC for controlling a third gate of the third MOSFET and a fourth gate of the fourth MOSFET, and An inductor module, comprising: A sealing body having an upper surface, a lower surface opposite the upper surface, and a side surface between the upper surface and the lower surface; A first inductor segment having: The main portion of the main portion, A first inductor portion protruding from the main portion and coupled with a first output terminal of the first module assembly and extending in a first/horizontal direction, the first output terminal being coupled with each of a source of the first MOSFET and a drain of the second MOSFET, and A second inductor portion protruding from the main portion and coupled with a second output terminal of the second module assembly and extending in the first direction, the second output terminal being coupled with each of a source of the third MOSFET and a drain of the fourth MOSFET, and An output portion protruding from the main portion, coupled with a terminal of the wiring substrate, and extending in a second direction, the second direction being a vertical direction intersecting the first direction, Wherein the inductor module is arranged on each of the first and second modules.

Description

Packaging of power modules Cross Reference to Related Applications The present application is based on U.S. patent application No. 63/506,431 entitled "inductor lead as radiating pipe" filed on 6/2023 and 6, and claims priority from 35 u.s.c.119 (e), the entire contents of which are incorporated herein by reference. Background The present invention relates generally to semiconductor devices and packages, and more particularly to voltage regulator systems, including trans-inductor voltage regulator (trans-inductor voltage regulator, TLVR) systems. Voltage regulators such as buck and boost converters may be used to convert an input voltage to an output voltage at a different voltage level. Buck converters (buck converters or step-down converters) may convert an input voltage to a lower voltage. Boost converters (boost converters or step-up converters) may convert an input voltage to a higher voltage. Buck-boost converters (buck-boost converters) may boost or buck the input voltage. The voltage regulator may include a pair of power transistors that may be alternately turned on and off by a pulse width modulation (pulse width modulated, PWM) control signal. The duty cycle of the PWM control signal determines the output voltage of the voltage converter. When the voltage converter is connected to the load, the load may request a particular amount of power by drawing a particular amount of current, and the voltage converter may perform voltage conversion to generate an output voltage that delivers the power required by the load. One example voltage regulator architecture is a multi-phase voltage regulator that includes a plurality of phases. Each phase includes a power stage and an inductor. All phases share a controller and an output capacitor. The controller generates PWM signals to the power stages to control the turning on and off of the power transistors. The controller may adjust the duty cycle of the PWM signal to obtain the target output voltage. The phases are connected in parallel, and the conduction of the phases can be performed in an interlaced manner to reduce the output current ripple, the output voltage ripple, and the input current ripple, thereby improving the system performance. Heat build-up in electronic components in the voltage regulator may affect the reliability of the voltage regulator and may even cause damage and shorten component life. Disclosure of Invention In one embodiment, an electronic system is generally described. The electronic system may include a printed circuit board having conductive traces coupled to the voltage output. The voltage regulator may be disposed on a printed circuit board and have voltage regulator phase output terminals accessible on a top surface of the voltage regulator. The electronic system may also include an inductor module coupled with the voltage regulator. The inductor module may include an inductor core and an inductor segment having a first end and a second end. The first end of the inductor segment may be connected to a voltage regulator phase output terminal. The second end of the inductor segment may be connected to a conductive trace of the printed circuit board. The inductor segment may pass through and wrap around at least a portion of the inductor core. The voltage regulator may be configured to transfer heat to the inductor segment and the inductor module through the voltage regulator phase output terminals. In one embodiment, an electronic system is generally described. The electronic system may include a printed circuit board having a first conductive trace and a second conductive trace. The electronic system may also include a first voltage regulator disposed on the printed circuit board and having a first voltage regulator phase output terminal accessible on a top surface of the first voltage regulator. The electronic system may also include a second voltage regulator disposed on the printed circuit board and having a second voltage regulator phase output terminal accessible on a top surface of the second voltage regulator. The electronic system may also include an inductor module coupled with the first voltage regulator and the second voltage regulator and spanning at least a portion of a first top surface portion of the first voltage regulator and a second top surface portion of the second voltage regulator. The inductor module may include an inductor core and an inductor segment having a first end and a second end. The first end of the inductor segment may be connected to a first voltage regulator phase output terminal and a second voltage regulator phase output terminal. The second end of the inductor segment may be connected to a conductive trace of the printed circuit board. The inductor segment may pass through and wrap around at least a portion of the inductor core. The first voltage regulator and the second voltage regulator may be configured to transfer heat to the inductor segment and the inductor module to the first voltage