CN-121986552-A - Material for printed circuit board and method for producing printed circuit board

Abstract

The material (10) for printed wiring boards is produced by laminating at least a catalyst layer (12) and an adhesive layer (13) containing a polyimide resin, which is produced by copolymerizing an acid dianhydride containing a bisphenol diether type acid dianhydride and a diamine compound, in this order on at least one surface (11 a) of a metal foil (11).

Inventors

• Matsuhara Moeko
• SEKIGUCHI FUMIYA
• Minamiyama Hiroaki
• Waze Nayang

Assignees

• 东洋铝株式会社
• 索马龙株式会社

Dates

Publication Date

20260505

Application Date

20240926

Priority Date

20230927

Claims (7)

1. 1. A material for printed circuit boards, characterized in that: Is produced by laminating at least a catalyst layer and an adhesive layer containing a polyimide resin in this order on at least one surface of a metal foil, The polyimide resin is produced by copolymerizing an acid dianhydride containing a bisphenol diether type acid dianhydride with a diamine compound.
2. 2. The material for printed circuit boards according to claim 1, wherein: the adhesive layer contains 0.1 to 10 parts by mass of at least one adhesion-imparting additive selected from the group consisting of aminosilanes, epoxysilanes and triazines, based on 100 parts by mass of the polyimide resin.
3. 3. The material for printed circuit boards according to claim 1, wherein: The polyimide resin comprises a polyurethane modified polyimide resin.
4. 4. The material for printed circuit boards according to claim 1, wherein: The metal foil has a surface roughness Ra of 0.4 [ mu ] m or less.
5. 5. The material for printed circuit boards according to claim 1, wherein: The metal foil is at least one selected from the group consisting of aluminum foil, aluminum alloy foil, copper foil, and tin foil.
6. 6. The material for printed circuit boards according to claim 1, wherein: the catalyst layer contains at least one catalyst selected from the group consisting of palladium, platinum, gold, and copper.
7. 7. A method of manufacturing a printed circuit board, characterized by: the manufacturing method of the printed circuit board sequentially comprises the following steps: a step of bonding the adhesive layer and the base material of the printed wiring board material according to any one of claims 1 to 6 to each other; removing the metal foil of the material for a printed circuit board to expose a surface of the catalyst layer on which the adhesive layer is not provided; a step of laminating a copper-plated layer on the surface, and And processing the copper plating layer into a circuit pattern shape.

Description

Material for printed circuit board and method for producing printed circuit board Technical Field The present disclosure relates to a material for a printed circuit board and a method for manufacturing a printed circuit board manufactured using the same. Background Printed circuit boards such as rigid substrates, laminated substrates, and flexible printed circuit boards, which are generally in commercial use, have a catalyst layer on the surface of a base material such as a resin and a copper plating layer having a circuit pattern shape on the surface thereof. Along with the high-speed processing of electronic components such as semiconductor chips to be mounted, there is also a demand for a fine wiring structure for a printed circuit board, and there is also a demand for a high production efficiency of a printed circuit board having such a fine wiring structure. For example, patent document 1 discloses a method in which a catalyst material is supported on the surface of a metal foil, the surface of the metal foil on which the catalyst material is supported is bonded to a base material of a circuit board, and then the metal foil is removed to laminate the catalyst material on the base material. Further copper plating and patterning on the catalyst material laminated on the base material can efficiently obtain a printed wiring board having a circuit pattern. In this method, when patterning is performed to form a circuit, if the adhesion between the copper plating layer and the base material is weak, peeling of the copper plating layer occurs during the process, resulting in a reduction in yield. In patent document 1, the irregularities provided on the metal foil are transferred to the surface of the substrate, and the adhesion between the copper plating layer and the substrate is improved by the anchoring effect of the irregularities. Prior art literature Patent literature Patent document 1 International publication No. 2021/163440 Disclosure of Invention Technical problem to be solved by the invention However, in applications requiring high frequency characteristics, the skin effect is accompanied by more concentration of the electrical signal passing through the circuit near the surface. Thus, the interface between the copper plating layer and the substrate, which forms the circuit, is required to have high smoothness. That is, in the technique of patent document 1, in order to improve the adhesion, it is necessary to provide irregularities on the interface, and in order to improve the high-frequency characteristics, it is necessary to ensure high smoothness of the interface, and both are in a contradictory relationship, which is a problem. Accordingly, an object of the present disclosure is to provide a material for a printed circuit board capable of providing a printed circuit board having sufficient adhesive strength at an interface between a copper plating layer and a base material without forming irregularities at the interface, and a method for manufacturing a printed circuit board using the material. Technical solution for solving the technical problems The present inventors have intensively studied and found that, when a printed circuit board is manufactured using a material for a printed circuit board, if an adhesive layer containing a specific polyimide resin is to be provided at the interface between a copper plating layer and a base material, sufficient adhesion can be ensured without providing irregularities at the interface. That is, one aspect of the printed wiring board material disclosed herein is produced by laminating at least a catalyst layer and an adhesive layer containing a polyimide resin, which is produced by copolymerizing an acid dianhydride containing a bisphenol diether type acid dianhydride (in this specification, sometimes referred to as "specific acid dianhydride") and a diamine compound, in this order on at least one surface of a metal foil. Effects of the invention If the adhesive layer of the material for a printed circuit board of the present disclosure and the base material are adhered together and the metal foil is removed, copper plating is performed on the exposed catalyst layer and patterning is performed, a printed circuit board can be obtained. In the obtained printed wiring board, an adhesive layer containing the polyimide resin is formed at the interface between the copper plating layer and the base material. Further, chemical bonds are formed between the copper plating layer and the polyimide resin of the adhesive layer and between the polyimide resin and the substrate, respectively, so that the copper plating layer adheres to the substrate with a strong adhesive strength. That is, if the material for a printed wiring board of the present disclosure is used, it is not necessary to form irregularities at the interface between the copper plating layer and the base material to obtain an anchor effect, and a printed wiring board having both high smoothness and high