CN-121986556-A - Heat dissipation device

Abstract

The heat dissipating device according to the present invention includes a one side heat conductive panel provided as a metal plate member, another side heat conductive panel provided as a metal plate member, forming a refrigerant flow space between the other side heat conductive panel and the one side heat conductive panel, through which a refrigerant flows after a phase change, and provided as a metal plate member, and a joint-guiding frame body provided to mediate a joint of edge ends of the one side heat conductive panel and the other side heat conductive panel, thereby providing advantages of maximizing heat dissipating performance and greatly improving product productivity.

Inventors

• LI JINHUAN
• Di Jiaoxing
• XU ZHENGUO
• LIU ZHIBAI
• CUI GUIZHE
• JIN DONGYUAN
• Jiang Xuangui
• Cui Renhua

Assignees

• 株式会社KMW

Dates

Publication Date

20260505

Application Date

20240920

Priority Date

20230920

Claims (20)

1. 1. A heat sink, comprising: a side heat conduction panel provided as a metal plate member; A heat-conducting panel on the other side, a refrigerant flowing space formed between the heat-conducting panel on the other side and the heat-conducting panel on the one side for flowing the refrigerant after phase change and arranged as a metal plate member, and The joint guiding frame body is arranged to mediate the joint of the edge end parts of the one side heat conducting panel and the other side heat conducting panel.
2. 2. The heat sink of claim 1, wherein, The joint guide frame body shields the refrigerant flowing space formed between the one side heat conduction panel and the other side heat conduction panel.
3. 3. The heat sink of claim 1, wherein, The one side heat conducting panel and the other side heat conducting panel are made of the same metal material with heat conducting coefficient above a preset value.
4. 4. The heat sink of claim 1, wherein, The joint-mediated frame body is joined and laminated along the edge-end-portion-mediated surface of the one side heat-conducting panel and the other side heat-conducting panel.
5. 5. The heat sink of claim 1, wherein, The joint guide frame body is arranged between the one side heat conduction panel and the other side heat conduction panel, and provides a preset joint surface for the inner side surface in the edge end part of the one side heat conduction panel and the inner side surface in the edge end part of the other side heat conduction panel.
6. 6. The heat sink of claim 1, wherein, The joint-guiding frame body has a quadrangular tube section made of copper.
7. 7. The heat sink of claim 6 wherein the heat sink is configured to dissipate heat from the heat sink, The first surface of the quadrangular tube section of the joint dielectric frame body is surface-jointed with the inner side surface of the edge end part of the one side heat conduction panel, And a second surface of the rectangular tube section of the joint medium frame body, which is opposite to the first surface, is in surface joint with an inner surface of the edge end part of the other side heat conduction panel.
8. 8. The heat sink of claim 1, wherein, When a portion which is a portion of the refrigerant flow space located relatively below in the gravitational direction and which stores the liquid-phase refrigerant of the refrigerant and is disposed relatively close to the heat generating element as the heat supply source is defined as an evaporation portion, In the joint-mediated frame body, a first frame provided near the evaporation portion and a second frame provided at a portion other than the evaporation portion are formed of different materials.
9. 9. The heat sink of claim 8 wherein the heat sink is configured to dissipate heat from the heat sink, The first frame is formed to have a quadrangular tube section made of copper, The second frame is formed to have a quadrangular tube section made of stainless steel.
10. 10. The heat sink of claim 1, further comprising: And a plurality of condensing unit sintered body columns disposed in the refrigerant flow space and connected to the joint guide frame body.
11. 11. The heat sink of claim 10 wherein the heat sink is configured to dissipate heat from the heat sink, The plurality of condensing unit sintered body columns are connected to the joint-mediating frame body through an evaporating unit sintered body base for connecting one end of each sintered body column.
12. 12. The heat sink of claim 11 wherein the heat sink is configured to dissipate heat from the heat sink, The plurality of condensing unit sintered body columns are arranged in a straight line, and the lower end corresponding to the one end is located relatively below the upper end with respect to the gravity direction.
13. 13. The heat sink of claim 10 wherein the heat sink is configured to dissipate heat from the heat sink, One end of the plurality of condensation section sintered body columns is connected to the inside of the joint guide frame body located relatively below with respect to the gravitational direction.
14. 14. The heat sink of claim 13 wherein the heat sink is configured to dissipate heat from the heat sink, The other ends of the plurality of condensation-section sintered body columns are connected to the inner side of the joint-guiding frame body located relatively above with respect to the gravitational direction.
15. 15. The heat sink of claim 13 wherein the heat sink is configured to dissipate heat from the heat sink, The other ends of the plurality of condensing unit sintered body columns are spaced apart from the junction-guiding frame body located above with respect to the gravitational direction by a predetermined distance.
16. 16. A heat sink as in claim 3, wherein, The one side heat conducting panel and the other side heat conducting panel are made of stainless steel sheet metal members.
17. 17. The heat sink of claim 10 wherein the heat sink is configured to dissipate heat from the heat sink, The plurality of condensing unit sintered body columns and the evaporating unit sintered body base are formed by sintering stainless steel powder.
18. 18. The heat sink of claim 1, wherein, The joint guiding frame body is provided with an exhaust hole, and the exhaust hole is connected with an exhaust pipe for vacuumizing or filling the refrigerant flowing space.
19. 19. The heat sink of claim 18 wherein the heat sink is configured to dissipate heat from the heat sink, The exhaust hole is formed to communicate with the refrigerant flowing space.
20. 20. The heat sink of claim 1, wherein, The one side heat conduction panel and the other side heat conduction panel are laminated and bonded by laser welding.

Description

Heat dissipation device Technical Field The present invention relates to a heat sink (HEAT DISSIPATION APPARATUS), and more particularly, to a heat sink designed to prevent a volume change of a refrigerant flowing space and to uniformly collect condensed liquid-phase refrigerant in a gravitational direction in spite of a change in an internal pressure of the refrigerant flowing space at the time of phase change of a refrigerant as a phase change material, thereby maximizing heat dissipation performance, and to prevent injury of workers by forming sharp edge ends into a rounded shape, and to improve productivity of products. Background In various industrial fields such as communications, electronics, and electricity, the related art is continuously advancing for application to more advanced industries. To achieve a higher level of technical development, high power energy is required, and equipment using high power energy must suffer from high heat generation, so a horizontal heat dissipation (Cooling) system must be developed in response to this. The heat dissipation system is used in various industries such as Air conditioning (Air Conditioner), mobile communication, data center, air travel, electric vehicle, energy storage device, display (Display), etc. Such a heat dissipation system is one of the main causes of power consumption, and the power consumption tends to increase gradually with the development of industry. Generally, heat dissipating apparatuses are broadly classified into an active heat dissipating device (Active Cooling Device) which performs forced convection (Forced Convection) mainly using a Fan (Fan), and a passive heat dissipating device (Passive Cooling Device) which can be classified into a technology using natural convection (Natural Convection) without using a Fan. However, the existing heat dissipation system has a limitation in achieving heat dissipation for high heat generated by the continuously developing advanced technology. Accordingly, in the related industry, innovative technologies that can solve such problems are required, and as a ring to solve the problems, heat dissipating devices are being developed. The phase transition is a change in the state of Liquid (Liquid)/Gas (Gas)/Solid (Solid) which is inherent when a large amount of energy is stored or stored thermal energy is released. The phase change is not a chemical reaction such as chemical bonding or formation, but a physical arrangement of molecules is changed, and when energy is applied to a certain substance, heat used when the phase change does not occur is called sensible heat (Sensible heat), and heat used when the phase change occurs is called latent heat (LATENT HEAT). However, the heat sink has a problem that the pressure increases when the temperature increases because the temperature is proportional to the pressure. In the sealed heat sink, the pressure rises due to the high temperature conducted from the heating element, causing a problem of the heat sink itself breaking. To solve this problem, it is necessary that the pressure is not raised, and the heat sink is required to have a sufficient internal volume to achieve pressure equilibrium during the phase change cycle of the substance. Disclosure of Invention Technical problem The present invention is directed to solving the above-mentioned problems, and an object of the present invention is to provide a heat sink capable of maximizing heat dissipation performance. Further, another object of the present invention is to provide a heat sink capable of improving productivity of products. Further, another object of the present invention is to provide a heat sink capable of preventing injury to a setting worker. The technical problems of the present invention are not limited to the above technical problems, and yet other technical problems not mentioned can be clearly understood by those skilled in the art from the following description. Technical proposal A heat dissipating device according to an embodiment of the present invention includes a one-side heat conductive panel provided as a metal plate member, another-side heat conductive panel provided as a metal plate member with a refrigerant flow space formed between the other-side heat conductive panel and the one-side heat conductive panel, the refrigerant flow space being formed by a refrigerant flowing after a phase change, and the joint-guiding frame being provided to mediate a joint of edge ends of the one-side heat conductive panel and the other-side heat conductive panel. The joint guide frame body is formed between the one side heat conduction panel and the other side heat conduction panel, and can shield the refrigerant flowing space. In addition, the one side heat conductive panel and the other side heat conductive panel may be made of the same metal material having a heat conductivity coefficient of a predetermined value or more. The joint guide frame may be joined and laminated along an edge end