CN-121986559-A - Heat dissipation device

Abstract

The present invention relates to a heat dissipating device, and more particularly, to a heat dissipating device including an evaporation plate assembly receiving heat by surface-contacting a heat generating surface of a heat generating body and forming a storage part storing a liquid refrigerant in a refrigerant, a plurality of condensation plate assemblies coupled to the evaporation plate assembly and providing a refrigerant flow space for diffusing and condensing a gaseous refrigerant phase-changed in the storage part, and a mounting panel shielding the storage part of the evaporation plate assembly and mediating the coupling of the plurality of condensation plate assemblies with respect to the evaporation plate assembly, wherein a sintered mass receiving heat from the evaporation plate assembly at a predetermined temperature or more and evaporating the liquid refrigerant into the gaseous refrigerant is disposed inside the storage part of the evaporation plate assembly, thereby providing an advantage of maximizing a heat dissipating performance of the heat generating body.

Inventors

• JIN DELONG
• Di Jiaoxing
• LIU ZHIBAI
• XU ZHENGUO
• Cui Renhua

Assignees

• 株式会社KMW

Dates

Publication Date

20260505

Application Date

20241011

Priority Date

20231012

Claims (20)

1. 1. A heat dissipating device, comprising: An evaporation plate unit which receives heat by being in surface contact with a heat generating surface of the heat generating body and which is formed with a storage unit for storing a liquid refrigerant among the refrigerants; A plurality of condensing plate assemblies coupled to the evaporating plate assemblies and providing a refrigerant flow space for diffusing and condensing the gaseous refrigerant phase-changed in the storage portion, and A mounting panel shielding the storage portion of the evaporator plate assembly and mediating the bonding of the plurality of condenser plate assemblies with respect to the evaporator plate assembly, Wherein a sintered block that receives heat of a predetermined temperature or higher from the heat generating body and evaporates the liquid refrigerant into a gaseous refrigerant is disposed inside the storage portion of the evaporation plate portion assembly.
2. 2. The heat sink of claim 1, wherein, The sinter cake is formed by sintering a predetermined metal powder and is arranged to occupy a portion of the storage portion of the evaporation plate assembly.
3. 3. The heat sink of claim 1, wherein, The lower surface of the sintered block is closely attached to the bottom surface of the storage portion corresponding to the opposite lower side with respect to the gravitational direction.
4. 4. The heat sink of claim 3, wherein, The sinter cake is disposed on a bottom surface of the storage part in such a manner that an upper surface thereof is spaced apart from the mounting panel corresponding to an upper side of the storage part by a predetermined distance.
5. 5. The heat sink of claim 1, wherein, The sintered blocks are disposed at predetermined distances from one end and the other end of the storage portion in the longitudinal direction, respectively.
6. 6. The heat sink of claim 1, wherein, A range of receiving heat above the predetermined temperature is defined between one end and the other end in the length direction of the storage portion.
7. 7. The heat dissipating device of any of claims 1 to 6, wherein, The sintered block is formed by sintering metal powder made of copper.
8. 8. The heat dissipating device of any of claims 1 to 6, wherein, A plurality of rigid reinforcing columns equipped to support at least an upper end thereof a lower surface of the mounting panel are disposed inside the storage portion of the evaporation plate portion assembly.
9. 9. The heat sink of claim 8, wherein, The plurality of rigid reinforcing columns includes: an outer column supporting a bottom surface of the storage part and a lower surface of the mounting panel at the same time, and A center pillar supporting both an upper surface of the sinter cake and a lower surface of the mounting panel.
10. 10. The heat sink of claim 9, wherein, A plurality of support grooves concavely formed downward and supporting a portion of the respective lower ends of the plurality of condensing plate part assemblies are formed at the upper surfaces of the outer column and the center column.
11. 11. The heat sink of claim 10, wherein, The plurality of support grooves are formed to be spaced apart corresponding to a spacing distance in a width direction of the plurality of condensation plate part assemblies.
12. 12. The heat sink of claim 9, wherein, The lower surface of the outer column is supported on the bottom surface of the storage part, the upper surface is supported on the lower surface of the mounting panel, and the outer column is arranged to be closely attached to one side end and the other side end in the length direction of the sintered block arranged to be spaced apart from one end and the other end, respectively, by a predetermined distance with respect to the length direction of the storage part.
13. 13. The heat sink of claim 12, wherein, A plurality of liquid refrigerant collecting holes having a height of an upper end at least lower than that of an upper surface of the sintered block are formed in the outer column.
14. 14. The heat sink of claim 13, wherein, The plurality of liquid refrigerant collecting holes are formed so as to communicate with each other at one end and the other end in the longitudinal direction of the sintered block.
15. 15. The heat sink of claim 13, wherein, The liquid refrigerant located outside the storage portion corresponding to the outer side of the outer column with respect to one side end and the other side end of the sintered block is absorbed and dispersed to the sintered block through the plurality of liquid refrigerant collecting holes.
16. 16. The heat sink of claim 1, wherein, Each of the plurality of cold plate portion assemblies includes: A side heat-conducting plate formed by sheet metal working by a press forming process as a metal plate member having a thermal conductivity of a predetermined or more, and The other side heat conducting plate is formed by performing sheet metal processing through a stamping forming process as the same metal plate component as the one side heat conducting plate, And further comprises at least one liquid refrigerant guiding column for guiding the liquid refrigerant condensed in the refrigerant flowing space to one side end and the other side end close to the sintered block.
17. 17. The heat sink of claim 16, wherein, In the case where a pair of the liquid refrigerant guiding columns are arranged at a predetermined distance from each other, the liquid refrigerant guiding columns are arranged obliquely so as to be directed downward with respect to the gravitational direction, and the width thereof is gradually narrowed.
18. 18. The heat sink of claim 16, wherein, In the case where a pair of the liquid refrigerant guiding columns are arranged at a predetermined distance from each other, the liquid refrigerant guiding columns are arranged obliquely so as to be directed downward with respect to the gravitational direction, and the width thereof gradually increases.
19. 19. The heat sink of claim 16, wherein, In the case where the liquid refrigerant guiding columns are arranged singly, the liquid refrigerant guiding columns are obliquely arranged in a form in which the upper ends are close to one side end or the other side end of the sintered block and the lower ends are close to the other side end or the one side end of the sintered block.
20. 20. The heat dissipating device of claim 1, further comprising: A plurality of fin reinforcing panels disposed between each of the plurality of condensing plate portions and arranged to support outer side surfaces of adjacent condensing plate portion assemblies, respectively.

Description

Heat dissipation device Technical Field The present invention relates to a heat sink, and more particularly, to a heat sink capable of preventing physical sloshing due to an increase in internal pressure generated during a gas-liquid cycle of a refrigerant and realizing a shorter gas-liquid cycle period. Background In various industrial fields such as communications, electronics, and electric, the related art is being highly developed to be applied to more advanced industries. High technology development requires high power energy sources, and equipment using the high power energy sources is necessarily faced with high heat generation problems, so that it is necessary to develop a heat dissipation (Cooling) system suitable for the level. The heat dissipation system is used in various industries such as air conditioning, mobile communication, data center, aviation movement, electric automobile, energy storage device, display and the like. Such a heat dissipation system is one of the main causes of power consumption, and the power consumption tends to increase gradually with the development of industry. Generally, heat dissipating apparatuses are broadly classified into an active cooling device (Active Cooling Device) that mainly uses forced convection (Forced Convection) generated by a fan and a passive cooling device (Passive Cooling Device) that can be classified as a technology using natural convection (Natural Convection) without using a fan. However, the existing heat dissipation system has limitations in dissipating high heat generated by the advanced technology that is continuously developed. Accordingly, in the related industry, innovative technologies capable of solving these problems are required, and as a link for solving these problems, heat sinks are being developed. Phase change refers to a change in its inherent state when Liquid (Liquid)/Gas (Gas)/Solid (Solid) stores a large amount of energy or releases stored thermal energy. Phase change refers to a change in the physical arrangement of molecules, not a chemical reaction such as chemical bonding or formation, and heat in a state where a certain substance does not undergo phase change when energy is applied is called sensible heat (Sensible heat), and heat used in phase change is called latent heat (LATENT HEAT). However, since the temperature is proportional to the pressure, the heat sink has a problem that the pressure increases when the temperature increases. In the sealed radiator, if the pressure increases due to the high temperature conducted from the heating element, the radiator itself may break. To solve this problem, it is necessary to prevent pressure rise, and in the heat sink, it is necessary to have a sufficient internal volume to enable pressure balance during the phase change cycle of the substance. In addition, heat transferred to the radiator should be used as much as possible for the phase change of the refrigerant, but in the case where energy is used for the sloshing (swimming) of the radiator itself due to an increase in internal pressure, there is a possibility that the heat radiation performance is deteriorated due to a long gas-liquid cycle period. Disclosure of Invention Technical problem The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a heat dissipating device capable of shortening a gas-liquid cycle per unit time by minimizing conversion of thermal energy required for phase-changing a liquid refrigerant into a gaseous refrigerant into physical force, thereby more actively guiding the gas-liquid cycle. Another object of the present invention is to provide a heat sink device capable of improving heat dissipation performance by guiding a liquid refrigerant condensed from a gaseous refrigerant to quickly collect and move to a portion close to a heating element. The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art to which the present invention pertains through the following descriptions. Technical proposal A heat dissipating device according to an embodiment of the present invention includes an evaporation plate assembly receiving heat by surface-contacting a heat generating surface of a heat generating body and forming a storage portion storing a liquid refrigerant in a refrigerant, a plurality of condensation plate assemblies coupled to the evaporation plate assembly and providing a refrigerant flow space for diffusing and condensing a gaseous refrigerant phase-changed at the storage portion, and a mounting panel shielding the storage portion of the evaporation plate assembly and mediating coupling of the plurality of condensation plate assemblies with respect to the evaporation plate assembly, wherein a sintered mass receiving heat from the heat generating body above a predetermined tempe