CN-121986582-A - Processing method, processing system and inspection device

Abstract

A method for processing a stacked substrate formed by bonding a first substrate and a second substrate, the method comprising the steps of irradiating a laser beam toward an interface between the first substrate and the second substrate at a peripheral edge portion of the first substrate to form a bonding force lowering region in which the first substrate and the second substrate are peeled off at the interface, inspecting the peripheral edge portion in which the bonding force lowering region is formed to obtain an image of the peripheral edge portion, processing the image to extract a peeled portion of the first substrate and the second substrate, deriving an area of the peeled portion in the processed image, and determining peeling of the first substrate and the second substrate based on the area.

Inventors

• Chai Hehong
• HAYAKAWA SUSUMU
• YAMASHITA HINATA

Assignees

• 东京毅力科创株式会社

Dates

Publication Date

20260505

Application Date

20240926

Priority Date

20231010

Claims (20)

1. 1. A processing method for a stacked substrate formed by bonding a first substrate and a second substrate, the processing method comprising: irradiating a laser beam toward an interface between the first substrate and the second substrate at a peripheral portion of the first substrate to form a bonding force reduced region peeled off from the first substrate and the second substrate at the interface; inspecting the peripheral edge portion formed with the joining force lowering region, and acquiring an image of the peripheral edge portion; processing the image, and extracting a stripping part of the first substrate and the second substrate; deriving an area of the peeled portion in the processed image, and And determining the peeling of the first substrate and the second substrate based on the area.
2. 2. The process according to claim 1, wherein, The step of extracting the peeled portion includes processing the image by binarization processing.
3. 3. The process according to claim 2, wherein, The step of determining the peeling includes comparing the area with a predetermined threshold.
4. 4. A process according to claim 3, wherein, The step of extracting the peeled portion includes the steps of: Extracting at least one color component capable of determining the peeled portion among color components constituting the image and acquiring at least one component image corresponding to the at least one color component, and And performing binarization processing on the component image to extract the stripping part.
5. 5. A process according to claim 3, wherein, In the step of acquiring the image, a displacement amount of the peripheral edge portion is measured by using an optical interferometry method, and a morphological image of the displacement amount is acquired.
6. 6. The method according to any one of claim 3 to 5, wherein, And feedback-controlling the irradiation condition of the laser beam in the step of forming the joining-force lowering zone based on the area.
7. 7. The process according to claim 2, wherein, The processing method further comprises the following steps: Determining a processing portion to be processed by irradiation of the laser beam based on the image, thereby determining an area of the processing portion, and Calculating an area ratio of an area of the peeled portion to an area of the processed portion, Wherein the step of determining the peeling includes comparing the area ratio with a predetermined area ratio threshold.
8. 8. The process according to claim 7, wherein, In the step of acquiring the image, the peripheral edge portion is inspected using an ultrasonic microscope, and a gray-scale image of the peripheral edge portion is acquired.
9. 9. The process according to claim 8, wherein, The step of extracting the peeled portion includes performing binarization processing on the gradation image by a predetermined brightness threshold value, The brightness threshold is predetermined by a method comprising the steps of: (a) A step of irradiating the laser beam toward the interface of one of the superimposed substrates under a plurality of irradiation conditions to form a plurality of processing portions; (b) A step of inspecting the peripheral edge portion of the superimposed substrate on which the plurality of processing portions are formed using an ultrasonic microscope, and acquiring a grayscale image of the peripheral edge portion; (c) A step of selecting one irradiation condition from the plurality of irradiation conditions; (d) A step of irradiating the laser beam toward the interface of the other overlapping substrate according to the selected irradiation condition, thereby forming the bonding force lowering region at the interface; (e) Removing the peripheral edge portion of the first substrate in the superimposed substrate in which the bonding force lowering region is formed; (f) A step of judging whether or not the removal of the peripheral edge portion is satisfactorily performed; (g) Repeating the steps (c) to (f) until two critical irradiation conditions are determined, each of which is a critical condition for determining whether or not the removal of the peripheral edge portion is satisfactorily performed; (h) A step of determining critical two processing portions which are corresponding to the critical two irradiation conditions and which are capable of satisfactorily removing the peripheral edge portion, and (J) And (c) determining the brightness threshold so that critical two processed portions can be distinguished from each other in the grayscale image obtained in the step (b).
10. 10. The process according to claim 9, wherein, The area ratio threshold is predetermined by a method including: (k) Determining critical areas of the two processing portions in the grayscale image obtained in the step (b); (l) A step of obtaining a binarized image by performing binarization processing on the gray-scale image obtained in the step (b) by the brightness threshold value; (m) determining areas of the two peeled portions corresponding to the critical two irradiation conditions in the binarized image obtained in the step (l); (n) calculating the area ratio of the areas of the two peeled portions determined in the (m) to the areas of the two processed portions determined in the (k), respectively, and And (p) determining the area ratio threshold so that the two area ratios calculated in the step (n) can be distinguished.
11. 11. A processing system for processing a superimposed substrate formed by joining a first substrate and a second substrate, the processing system comprising: An interface modifying device that irradiates a laser beam toward an interface between the first substrate and the second substrate at a peripheral edge portion of the first substrate, and forms a bonding force lowering region where the first substrate and the second substrate are peeled off at the interface; an inspection device for inspecting peeling of the first substrate and the second substrate in the bonding force lowering region, and The control device is used for controlling the control device, Wherein, when the peeling is inspected by the inspection device, the control device performs control including: inspecting the peripheral edge portion formed with the joining force lowering region, and acquiring an image of the peripheral edge portion; processing the image, and extracting a stripping part of the first substrate and the second substrate; deriving an area of the peeled portion in the processed image, and And determining the peeling of the first substrate and the second substrate based on the area.
12. 12. The processing system of claim 11, wherein, The step of extracting the peeled portion includes processing the image by binarization processing.
13. 13. The processing system of claim 12, wherein, The step of determining the peeling includes comparing the area with a predetermined threshold.
14. 14. The processing system of claim 13, wherein, The control means performs the following control when the extraction of the peeling section is performed: Extracting at least one color component capable of determining the peeled portion among color components constituting the image and acquiring at least one component image corresponding to the at least one color component, and And performing binarization processing on the component image to extract the stripping part.
15. 15. The processing system of claim 14, wherein, The control device performs control to measure the displacement amount of the peripheral edge portion using an optical interferometry method and to acquire a topography image of the displacement amount when acquiring the image.
16. 16. The processing system of any of claims 13-15, wherein, The control means feedback-controls the irradiation condition of the laser beam when the joining-force lowering region is formed, based on the area.
17. 17. The processing system of claim 12, wherein, The method also comprises the following steps: Determining a processing portion to be processed by irradiation of the laser beam based on the image, thereby determining an area of the processing portion, and Calculating an area ratio of an area of the processing portion to an area of the peeling portion, Wherein the step of determining the peeling includes comparing the area ratio with a predetermined area ratio threshold.
18. 18. The processing system of claim 17, wherein, In the step of acquiring the image, the peripheral edge portion is inspected using an ultrasonic microscope, and a gray-scale image of the peripheral edge portion is acquired.
19. 19. The processing system of claim 18, wherein, In the step of extracting the peeled portion, the gradation image is binarized by a predetermined brightness threshold value.
20. 20. An inspection apparatus for inspecting peeling of a first substrate and a second substrate, which are formed in a joining force lowering region of an interface between the first substrate and the second substrate at a peripheral edge portion of the first substrate, from among superimposed substrates formed by joining the first substrate and the second substrate, the inspection apparatus comprising: A measuring part for inspecting the peripheral edge part formed with the bonding force lowering region, and The control part is used for controlling the control part to control the control part, Wherein, when the peeling is inspected by the inspection device, the control section performs the following control: The measuring part checks the peripheral edge part to obtain an image of the peripheral edge part; processing the image, and extracting a stripping part of the first substrate and the second substrate; deriving an area of the peeled portion in the processed image, and And determining the peeling of the first substrate and the second substrate based on the area.

Description

Processing method, processing system and inspection device Technical Field The present disclosure relates to a processing method, a processing system, and an inspection apparatus. Background Patent document 1 discloses a substrate processing system including a modified layer forming device that forms a modified layer inside a first substrate along a boundary between a peripheral edge portion and a central portion of the first substrate, which is a removal target, in a stacked substrate formed by bonding a first substrate and a second substrate, and a peripheral edge removing device that removes the peripheral edge portion of the first substrate with the modified layer as a base point. Prior art literature Patent literature Patent document 1 International publication No. 2019/176589 Disclosure of Invention Problems to be solved by the invention The technology according to the present disclosure suitably checks peeling of a bonding force lowering region formed at an interface between a first substrate and a second substrate in a stacked substrate formed by bonding the first substrate and the second substrate. Solution for solving the problem One embodiment of the present disclosure is a method for processing a stacked substrate formed by bonding a first substrate and a second substrate, the method including the steps of irradiating a laser beam toward an interface between the first substrate and the second substrate at a peripheral edge portion of the first substrate to form a bonding force lowering region in which the first substrate and the second substrate are peeled off at the interface, inspecting the peripheral edge portion in which the bonding force lowering region is formed to obtain an image of the peripheral edge portion, processing the image to extract a peeled portion of the first substrate and the second substrate, deriving an area of the peeled portion in the processed image, and determining peeling of the first substrate and the second substrate based on the area. ADVANTAGEOUS EFFECTS OF INVENTION According to the present disclosure, peeling of a bonding force lowering region formed at an interface between a first substrate and a second substrate can be appropriately inspected in a stacked substrate in which the first substrate and the second substrate are bonded. Drawings Fig. 1 is a side view schematically showing a structural example of a reconstituted wafer as a processing target. Fig. 2 is a plan view schematically showing a configuration example of the wafer processing system. Fig. 3 is a cross-sectional view showing a bonding force decreasing region and a peripheral edge modifying layer formed on a superimposed wafer. Fig. 4 is an explanatory diagram showing main steps of wafer processing in the wafer processing system. Fig. 5 is a plan view schematically showing a configuration example of the interface modifying apparatus according to the first embodiment. Fig. 6 is a side view schematically showing a configuration example of the interface modifying apparatus according to the first embodiment. Fig. 7 is an explanatory diagram schematically showing an example of the operation of the inspection apparatus according to the first embodiment. Fig. 8 is an explanatory diagram schematically showing another example of the operation of the inspection apparatus according to the first embodiment. Fig. 9 is an explanatory diagram showing an inspection area set for a superimposed wafer according to the first embodiment. Fig. 10 is a flowchart showing the main steps of the separation judgment according to the first embodiment. Fig. 11 is an explanatory diagram showing an example of a topography image in a state where the first wafer and the second wafer are partially peeled. Fig. 12 is an explanatory diagram showing an example of a topography image in a state where the first wafer and the second wafer are peeled off. Fig. 13 is an explanatory diagram showing a case of decomposing a topography image into images of color components. Fig. 14 is an explanatory diagram showing a case of binarizing an image of a color component in a state where a first wafer and a second wafer are partially peeled. Fig. 15 is an explanatory diagram showing a case of binarizing an image of a color component in a state where a first wafer and a second wafer are peeled. Fig. 16 is a graph showing the area of the peeled portion in the partial peeling and the area of the peeled portion in the peeling. Fig. 17 is a plan view schematically showing a configuration example of an interface modifying apparatus according to the second embodiment. Fig. 18 is an explanatory diagram schematically showing an example of the operation of the inspection apparatus according to the second embodiment. Fig. 19 is a flowchart showing main steps of the separation judgment according to the second embodiment. Fig. 20 is an explanatory diagram showing an example of a grayscale image in a state where the first wafer and the second wafer are partially p