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CN-121986583-A - Delamination of uneven substrates

CN121986583ACN 121986583 ACN121986583 ACN 121986583ACN-121986583-A

Abstract

The invention relates to the removal of edge regions (14, 14 ') of a working layer (12, 12') arranged on an uneven substrate (10) by means of a delamination device (100). The delamination apparatus (100) has a delamination unit (20), a work plane movement unit (30), and a distance adjustment unit (50). The delamination unit (20) is designed for removing the edge regions (14, 14 ') and has a delamination outlet (22, 22 ') which is designed for being arranged opposite the working layer (12, 12 '). The work plane movement unit (30) is designed to move the delamination unit (20) in the work plane (40) above the edge regions (14, 14'). The distance adjustment unit (50) is designed to maintain a deviation from a predetermined distance between the delamination outlet (22) of the delamination unit (20) and the surface (16) of the edge region (14) in a distance direction (z) perpendicular to the working plane (40) within a predetermined deviation value when the delamination unit (20) is moved in the working plane (40) above the edge region (14, 14'). This enables improved removal of the edge regions of the working layer on uneven substrates.

Inventors

  • P. Muffler
  • S. Pinotti
  • A. B. Fonseca
  • R. Tautz
  • F. MAYER
  • M. Bickler
  • J. Dostal

Assignees

  • 概念系统公司

Dates

Publication Date
20260505
Application Date
20240920
Priority Date
20230926

Claims (15)

  1. 1. A delamination apparatus (100) for removing an edge region (14, 14 ') of a working layer (12, 12') arranged on an uneven substrate (10), comprising: a delamination unit (20) which is designed for removing the edge regions (14, 14 ') and has a delamination outlet (22, 22 ') which is designed for being arranged opposite the working layer (12, 12 '); A working plane movement unit (30) which is designed to move the delamination unit (20) in the working plane (40) above the edge regions (14, 14'), and is characterized in that: a distance adjustment unit (50) configured to maintain a deviation from a predetermined distance between the delamination outlet (22) of the delamination unit (20) and the surface (16) of the edge region (14) in a distance direction (z) perpendicular to the working plane (40) within a predetermined deviation value when the delamination unit (20) is moved in the working plane (40) above the edge region (14, 14').
  2. 2. The delamination apparatus (100) according to claim 1, wherein the distance adjustment unit (50) has a distance sensor (60) and a distance direction movement unit (52), and the distance sensor (60) is configured for determining a distance (d) in a distance direction (z) between the delamination outlet (22) of the delamination unit (20) and the surface (16) of the edge region (14), and the distance direction movement unit (52) is configured for moving the uneven substrate (10) and the delamination outlet (22) of the delamination unit (20) in the distance direction (z) relative to each other based on the distance (d) determined by the distance sensor (60).
  3. 3. The delamination apparatus (100) according to claim 1 or 2, comprising a holding unit (54) configured to hold a substrate (10).
  4. 4. A de-layering device (100) according to claim 3, wherein the holding unit (54) has at least two holders (58) configured for holding respective areas of the bottom side (18') of the uneven substrate (10) fixed, and the holders (58) are arranged such that the unevenness of the substrate (10) is reduced.
  5. 5. The delamination apparatus (100) according to claim 3 or 4, wherein the holding unit (54) has a movable holder (59) which is designed for holding an uneven substrate (10) and the distance adjustment unit (50) is designed for moving the movable holder (59) parallel to the delamination unit (20) in a holding plane (70) parallel to the working plane (40) such that the movable holder (59) is located at a constant distance from the delamination outlet (22) of the delamination unit (20) in the distance direction (z).
  6. 6. The delamination apparatus (100) according to at least one of claims 1 to 5, wherein the delamination unit (20) is configured for simultaneously removing an edge region (14) of the working layer (12) on the top side (18) of the substrate (10) and a further edge region (14 ') of the working layer (12 ') on the bottom side (18 ') of the substrate.
  7. 7. The delamination apparatus (100) according to at least one of claims 1 to 6, wherein the delamination unit (20) is configured for removing an edge region (14, 14 ') of the working layer (12, 12') comprising a flavoured element deposit, cu or Ti.
  8. 8. A delamination module (200) with a delamination device (100) according to at least one of claims 1 to 7, additionally comprising at least one medium reservoir (210, 220) which is designed for containing one or more dissolution media, one or more etching media, or one or more dissolution media and one or more etching media and for supplying the dissolution media or the etching media or the dissolution media and the etching media to a delamination unit (20) of the delamination device (100).
  9. 9. A de-layering system (300) with one or more de-layering modules (200, 200') according to claim 8, additionally comprising a substrate transport system (310) for transporting uneven substrates (10).
  10. 10. Substrate processing system (400) with one or more de-layering systems (300, 300') according to claim 9, additionally comprising at least one functional module (410) for processing uneven substrates (10).
  11. 11. Method (1000) for removing an edge region (14, 14 ') of a working layer (12, 12') arranged on an uneven substrate (10), comprising: moving the delamination unit in the working plane over the edge region with a delamination outlet arranged opposite the working layer, and The edge region is removed and the edge region is removed, It is characterized in that the method comprises the steps of, The deviation from a predetermined distance in a distance direction perpendicular to the working plane between the delamination exit of the delamination unit and the surface of the edge region is kept within a predetermined deviation value when the delamination unit is moved in the working plane above the edge region.
  12. 12. The method (1000) of claim 11, comprising one or more of the following steps: Measuring a distance between a delamination outlet of the delamination unit and a surface of the edge region in a distance direction perpendicular to the working plane; Moving the uneven substrate and the delamination outlet of the delamination unit relative to each other in a distance direction based on the distance between the delamination outlet of the delamination unit and the surface of the edge area determined by the distance sensor to maintain a deviation from a predetermined distance between the delamination outlet of the delamination unit and the surface of the edge area in a distance direction perpendicular to the working plane within a predetermined deviation value when the delamination unit is moved in the working plane above the edge area; Maintaining an uneven substrate; rotating the uneven substrate relative to the delamination unit; Maintaining the substrate stationary at least two areas of the bottom side of the substrate such that the substrate is less uneven; Moving the movable holder parallel to the de-layering unit in a holding plane parallel to the de-layering unit during holding of the uneven substrate by the movable holder such that the movable holder is at a constant distance from the de-layering outlet of the de-layering unit in a distance direction; simultaneously removing an edge region of the working layer on the top side of the substrate and a further edge region of the working layer on the bottom side of the substrate; A dissolution medium or etching medium adapted to the material of the edge region is provided to remove the edge region.
  13. 13. Use of a delamination apparatus (100) according to at least one of claims 1 to 7 for: removing the edge regions (14, 14'), and/or Removing the edge areas (14, 14') of the metal layer or of the lacquer, and/or Removing the edge regions (14, 14 ') of the working layers (12, 12') on the rectangular substrate (10), and/or The edge regions (14, 14 ') of the working layers (12, 12') on the wafer are removed.
  14. 14. Use of the method (1000) according to claim 11 or 12 for: removing the edge regions (14, 14'), and/or Removing the edge areas (14, 14') of the metal layer or of the lacquer, and/or Removing the edge regions (14, 14 ') of the working layers (12, 12') on the rectangular substrate (10), and/or The edge regions (14, 14 ') of the working layers (12, 12') on the wafer are removed.
  15. 15. Computer program product for removing an edge region (14, 14 ') of a working layer (12, 12') arranged on an uneven substrate (10), the computer program product comprising computer program code means for causing a processor (510) to carry out the method as claimed in claim 11 or 12 when the computer program product is executed on the processor.

Description

Delamination of uneven substrates Technical Field The present invention relates to the delamination of uneven, in particular curved, substrates. A delamination apparatus and method for removing edge regions of a working layer of an uneven, in particular curved, substrate is provided. Background US 2006/0003591 A1 describes a method for removing edge ridges on a wafer. The method includes providing a wafer having a layer, coating the layer with a photoresist, rotating the wafer, and removing edge ridges from the wafer by removing edge raised portions of the edge ridges in a first step and removing edge sections of the edge ridges in a second step. Disclosure of Invention It may be seen as an object of the present invention to provide a delamination apparatus, a delamination module, a delamination system, a substrate treatment system and a method for removing edge regions of a working layer arranged on an uneven substrate, which enable a better removal of edge regions of a working layer arranged on an uneven substrate, in particular a curved substrate. According to a first aspect of the invention, a delamination apparatus for removing an edge region of a working layer arranged on an uneven substrate is provided. The delamination device comprises a delamination unit, a working plane movement unit and a distance adjustment unit. The delamination unit is configured for removing edge regions and has a delamination exit. The delamination outlet is configured to be disposed opposite to the working layer. The work plane movement unit is configured to move the delamination unit in the work plane above the edge area. The distance adjustment unit is configured to maintain a deviation from a predetermined distance between a delamination outlet of the delamination unit and a surface of the edge region in a distance direction perpendicular to the working plane within a predetermined deviation value when the delamination unit is moved above the edge region in the working plane. Since the distance adjustment unit is provided, which is configured to keep a deviation from a predetermined distance in the distance direction between the delamination exit of the delamination unit and the surface of the edge region within a predetermined deviation value when the delamination unit moves above the edge region in the working plane, collision of the delamination unit with the substrate can be avoided and the edge region of the working layer can be removed with improved accuracy on uneven substrates. By being able to maintain an almost constant distance between the delamination exit and the surface of the edge region, an almost straight edge can be created at the transition of the removed edge region to the working layer. This enables a reduction of edge effects, which can occur in an enhanced manner in the case of non-straight, in particular wavy edges. The edges of the wave form are produced in particular in the case where the distance between the delamination exit and the surface of the edge region fluctuates and the surface that is removed depends on the distance of the delamination exit to the surface of the edge region. This is the case, for example, when the delamination outlets are not arranged perpendicular to the surface of the edge region, but are arranged at an angle, for example 45 °, to the surface, and/or the delamination outlets have a conical output volume, such that larger faces are removed at a larger distance and smaller faces are removed at a smaller distance. The distance between the delamination outlet of the delamination unit and the surface of the edge region in the direction of the distance perpendicular to the working plane may be, for example, the smallest distance between the point of the delamination outlet closest to the surface, in particular the distal end thereof, and the surface of the edge region in the perpendicular direction. But the distance may also be the distance in the vertical direction from any other point of the delamination exit to the surface of the edge region. The delamination outlet may be configured for applying a delamination agent, such as a dissolution medium or an etching medium, to the edge region in order to remove the edge region. The delamination outlet may for example be the outlet of a nozzle. The delamination outlet may be configured for applying a delamination agent to a face of the edge region that is related to a distance of the delamination outlet from a surface of the edge region in a vertical direction. This enables removal of differently sized facets depending on the distance of the delamination exit from the surface of the edge region. For example, the delamination outlets may be configured for generating a conical output volume such that larger faces are removed at a larger distance and smaller faces are removed at a smaller distance. Alternatively or additionally, the delamination outlets may be arranged perpendicular to the surface of the edge area or at an angle