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CN-121986586-A - Pick-up system, joining device, sorting device, and control method

CN121986586ACN 121986586 ACN121986586 ACN 121986586ACN-121986586-A

Abstract

A pickup system (100) is provided with a pickup unit (14) which includes a pickup nozzle (14 a) and an ultrasonic wave generation unit (152 a) that generates ultrasonic waves by vibrating the pickup nozzle (14 a), a negative pressure generation unit (153), a rotation movement mechanism (15 b) for rotating the pickup unit (14), and a control unit (101). When the pickup nozzle (14 a) picks up the component (6 a) in a non-contact manner, the control unit (101) controls the negative pressure generating unit (153) and the ultrasonic wave generating unit (152 a) under the 1 st condition, and when the rotary movement mechanism (15 b) rotates the pickup unit (14), the control unit (101) controls the negative pressure generating unit (153) and the ultrasonic wave generating unit (152 a) under the 2 nd condition, and the repulsive force applied by the ultrasonic wave generating unit (152 a) to the component (6 a) under the 2 nd condition is weaker than the repulsive force applied by the ultrasonic wave generating unit (152 a) to the component (6 a) under the 1 st condition.

Inventors

  • MOTOMURA KOJI
  • KODA MASAHIRO
  • Bang Pingda

Assignees

  • 松下知识产权经营株式会社

Dates

Publication Date
20260505
Application Date
20241009
Priority Date
20231012

Claims (18)

  1. 1. A pickup system is provided with: A pickup unit including a suction nozzle having an opening for holding a component, and an ultrasonic wave generation section for generating ultrasonic waves by vibrating the suction nozzle; a negative pressure generating unit that generates a negative pressure around the opening of the suction nozzle; A rotation mechanism for rotating the pickup unit, and A control unit for controlling the negative pressure generating unit, the ultrasonic wave generating unit, and the rotating mechanism, The suction nozzle holds the component in a noncontact manner based on a repulsive force separating the component from the suction nozzle and an attractive force attracting the component to the suction nozzle, the repulsive force being a repulsive force obtained by the ultrasonic wave generated by the ultrasonic wave generating portion, the attractive force being an attractive force obtained by the negative pressure generated by the negative pressure generating portion, The control section controls the negative pressure generating section and the ultrasonic wave generating section in condition 1 when the suction nozzle picks up the component in a noncontact manner, The control section controls the negative pressure generating section and the ultrasonic wave generating section in condition 2 when the rotation mechanism rotates the pickup unit, The repulsive force applied to the member by the ultrasonic wave generating portion in the condition 2 is weaker than the repulsive force applied to the member by the ultrasonic wave generating portion in the condition 1.
  2. 2. The pickup system of claim 1, The suction force applied to the member by the negative pressure generating portion in the condition 2 is stronger than the suction force applied to the member by the negative pressure generating portion in the condition 1.
  3. 3. The pickup system of claim 1, After the rotation mechanism rotates and turns over the pickup unit, the control section controls the negative pressure generating section and the ultrasonic wave generating section in condition 3, In the case where the holding force of the suction nozzle to hold the component is defined as a force obtained by subtracting the repulsive force from the attractive force, the holding force of the component in the 3 rd condition is weaker than the holding force of the component in the 1 st condition.
  4. 4. A pick-up system as claimed in claim 3, The suction force applied to the member by the negative pressure generating portion in the 3 rd condition is weaker than the suction force applied to the member by the negative pressure generating portion in the 1 st condition.
  5. 5. A pick-up system as claimed in claim 3, The repulsive force applied to the member by the ultrasonic wave generating portion in the 3 rd condition is stronger than the repulsive force applied to the member by the ultrasonic wave generating portion in the 1 st condition.
  6. 6. The pickup system of claim 1, The ultrasonic wave generating part is provided with an ultrasonic vibrator, The control unit adjusts the repulsive force applied to the member by controlling the voltage applied to the ultrasonic vibrator.
  7. 7. The pickup system of claim 2, The negative pressure generating part is provided with an adjusting valve for adjusting the negative pressure, The control unit adjusts the attractive force applied to the member by controlling the adjustment valve.
  8. 8. The pickup system of claim 1, The suction nozzle further has: A suction passage for sucking the member, and A component-opposing surface opposing the component being picked up, The opening of the suction nozzle is composed of an inner suction hole and a plurality of outer suction holes, The plurality of outside suction holes are located on the opposite surface of the member and connected to the suction passage, The inner suction hole is located at a position surrounded by the plurality of outer suction holes on the member facing surface and is connected to the suction passage.
  9. 9. The pickup system of claim 8, At least one of the plurality of outer suction holes is connected to the suction passage so as to be inclined with respect to a vertical direction of the member facing surface.
  10. 10. The pickup system of claim 9, The suction nozzle includes a nozzle body portion, a convex portion protruding from the nozzle body portion toward the component side and having the component facing surface at a front end of the convex portion, The weight of the suction nozzle is adjusted by the shape of the suction nozzle body portion.
  11. 11. The pickup system of claim 8, The plurality of outer suction holes and the inner suction hole are each circular, The radius of the circular shape of the inner suction hole is larger than the radius of the circular shape of each of the plurality of outer suction holes.
  12. 12. The pickup system of claim 8, The plurality of outside suction holes are 4 outside suction holes, The 4 outer suction holes are provided at positions corresponding to 4 corners of the rectangular member on the member facing surface.
  13. 13. The pickup system of claim 8, The inner suction hole is formed by a plurality of holes.
  14. 14. The pickup system of claim 8, A groove is formed in the component facing surface of the suction nozzle, the groove being connected to each of the plurality of outer suction holes and the inner suction hole.
  15. 15. The pickup system of claim 8, The suction nozzle is formed with a convex portion having the component facing surface at a front end thereof, the component facing surface having a shape corresponding to a shape of the rectangular component, The plurality of outer suction holes and the inner suction hole penetrate the convex portion.
  16. 16. A bonding device is provided with: the pick-up system of any one of claims 1 to 15, and And an engagement unit that receives the component from the pickup unit after the pickup unit is rotated by the rotation mechanism, and engages the received component to another component.
  17. 17. A sorting apparatus provided with a pick-up system as claimed in any one of claims 1 to 15, by which the components are held.
  18. 18. A control method, which is a control method for a pick-up system, The pickup system is provided with: A pickup unit including a suction nozzle having an opening for holding a component, and an ultrasonic wave generation portion for generating ultrasonic waves by vibrating the suction nozzle, a negative pressure generation portion for generating negative pressure around the opening of the suction nozzle, and a rotation mechanism for rotating the pickup unit, The suction nozzle holds the component in a noncontact manner based on a repulsive force separating the component from the suction nozzle and an attractive force attracting the component to the suction nozzle, the repulsive force being a repulsive force obtained by the ultrasonic wave generated by the ultrasonic wave generating portion, the attractive force being an attractive force obtained by the negative pressure generated by the negative pressure generating portion, In the control method of the present invention, in the control method, Controlling the negative pressure generating portion and the ultrasonic wave generating portion in condition 1 when the suction nozzle picks up the component in a noncontact manner, Controlling the negative pressure generating part and the ultrasonic wave generating part in condition 2 when the rotation mechanism rotates the pick-up unit, The repulsive force applied to the member by the ultrasonic wave generating portion in the condition 2 is weaker than the repulsive force applied to the member by the ultrasonic wave generating portion in the condition 1.

Description

Pick-up system, joining device, sorting device, and control method Technical Field The present disclosure relates to systems and the like for picking up components. Background In order to realize high functionality of the semiconductor package, hybrid bonding without using bumps, bonding materials, and the like is required. In hybrid bonding, a semiconductor chip is bonded to a substrate or the like by hydrogen bonding or the like in a state where the surface of the semiconductor chip is cleaned. Therefore, in hybrid bonding, it is necessary to maintain high cleanliness of the surface of the semiconductor chip from the time after the semiconductor chip is picked up from the adhesive sheet such as dicing tape until the semiconductor chip is bonded. Then, a die pick-up module for holding a semiconductor chip called a die lifted from below a dicing tape in a noncontact manner using a noncontact pick-up device and a die bonding apparatus having the die pick-up module have been proposed (for example, refer to patent document 1). In addition, such a die pick-up module is also called a pick-up system that picks up the die as a component, a noncontact pick-up is also called a pick-up unit, and a die bonding device is also called a bonding device. The die pick-up module of patent document 1 holds the semiconductor chips lifted from below the dicing tape in a noncontact manner using ultrasonic waves and attractive force. Prior art literature Patent literature Patent document 1 U.S. patent application publication No. 2021/0060798 specification Disclosure of Invention Problems to be solved by the invention However, the die pick-up module (i.e., pick-up system) of patent document 1 has a problem that it is difficult to properly hold the semiconductor chip as a component. Thus, the present disclosure provides a pickup system or the like capable of holding a component appropriately in a noncontact manner. Means for solving the problems The pickup system according to one embodiment of the present disclosure includes a pickup unit including a suction nozzle having an opening for holding a component and an ultrasonic wave generation portion for generating ultrasonic waves by vibrating the suction nozzle, a negative pressure generation portion for generating negative pressure around the opening of the suction nozzle, a rotation mechanism for rotating the pickup unit, and a control portion for controlling the negative pressure generation portion, the ultrasonic wave generation portion, and the rotation mechanism, the suction nozzle holding the component in a noncontact manner based on a repulsive force separating the component from the suction nozzle and an attractive force attracting the component to the suction nozzle, the repulsive force being a repulsive force obtained by ultrasonic waves generated by the ultrasonic wave generation portion, the attractive force being an attractive force obtained by negative pressure generated by the negative pressure generation portion, the control portion controlling the negative pressure generation portion and the ultrasonic wave generation portion under condition 1 when the suction nozzle picks up the component in a noncontact manner, and controlling the negative pressure generation portion and the ultrasonic wave generation portion under condition 2 when the rotation mechanism rotates the pickup unit, the control portion exerting weaker than the repulsive force on condition 2 when the ultrasonic wave generation portion generates the ultrasonic wave. In addition, these general and specific aspects may be implemented by a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or by any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may be a non-transitory recording medium. Effects of the invention The pick-up system of the present disclosure can appropriately hold the components in a noncontact manner. Further advantages and effects in one mode of the present disclosure will be clarified by the specification and drawings. These advantages and/or effects are provided by the structures described in the several embodiments and the specification and drawings, but not necessarily all structures are required. Drawings Fig. 1 is an oblique view of the component mounting apparatus in embodiment 1. Fig. 2 is a diagram for explaining an operation of mounting a chip on a substrate by the component mounting apparatus in embodiment 1. Fig. 3 is a diagram showing an example of the structure of the pickup system in embodiment 1. Fig. 4A is a diagram exemplarily showing a part of an operation in which the pickup system in embodiment 1 picks up a chip using the pickup nozzle and delivers it to the component mounting nozzle. Fig. 4B is a diagram exemplarily showing a remaining part of an operation in which the pick-up system in embodiment 1 picks up a chip us