CN-121986587-A - Cleaning device

Abstract

The cleaning device of one embodiment of the present invention may include an image pickup unit to pick up a surface of a flat substrate including a wafer or a mask, a laser unit to irradiate a laser beam to a target position where foreign matter is attached when the target position is confirmed by the image pickup unit, a cleaning unit to spray gas toward the target position and a peripheral portion thereof, and a suction (suction) unit to suck suspended matter generated by the laser unit and/or the cleaning unit.

Inventors

• JIN XIANZHU
• LI ZHENYUAN
• CHENG MINGJUN
• ZHAO DEGAO
• PU XUN

Assignees

• 株式会社考恩斯特

Dates

Publication Date

20260505

Application Date

20240829

Priority Date

20231106

Claims (7)

1. 1. A cleaning device, comprising: an imaging unit that images a surface of a flat substrate including a wafer or a mask, A laser unit that irradiates a laser beam to a target position where foreign matter is attached when the target position is confirmed by the image pickup unit, A purge unit for injecting gas toward the target position and the peripheral portion thereof, and And a suction unit sucking in suspended matters generated by the laser unit and/or the cleaning unit.
2. 2. The cleaning apparatus of claim 1, wherein the cleaning apparatus comprises a cleaning device, The cleaning unit desorbs the foreign matter by physically colliding the foreign matter in a process of rapidly contracting the foreign matter and rapidly expanding the foreign matter.
3. 3. The cleaning apparatus of claim 1, wherein the cleaning apparatus comprises a cleaning device, The cleaning unit is configured to remove organic foreign matters, The laser unit is configured to remove foreign substances including organic foreign substances not removed by the cleaning unit.
4. 4. The cleaning apparatus of claim 1, wherein the cleaning apparatus comprises a cleaning device, In the foreign matter removal process by the laser unit, The cleaning unit is configured to: Solid carbon dioxide is sprayed in order to prevent thermal damage of the flat substrate, so that suspended matters generated in the foreign matter removal process are purged while cooling the flat substrate.
5. 5. The cleaning device of claim 1, further comprising: And an objective lens unit disposed on an optical path in which an optical axis of the laser unit and an optical axis of the imaging unit overlap.
6. 6. The cleaning apparatus of claim 1, wherein the cleaning apparatus comprises a cleaning device, A suction portion is formed at one side of the suction unit, the suction portion being recessed toward the inside of the suction unit, and the suction portion having a circular cross section so that suspended matter is sucked in a radial direction.
7. 7. The cleaning apparatus of claim 6, wherein the cleaning apparatus comprises a cleaning device, The inner diameter center of the suction part is arranged on the optical path of the image pickup unit; The cleaning unit is disposed opposite to the suction portion, and ejects solid carbon dioxide toward the suction portion during operation of the suction unit.

Description

Cleaning device Technical Field The present invention relates to a cleaning apparatus, and more particularly, to a cleaning apparatus capable of removing foreign matter while cooling a flat substrate including a wafer or a mask. Background Recently, under the trend of functional enhancement of electronic devices, portability improvement, and the like, semiconductor devices mainly use stacked semiconductor devices in which bonding (bonding) technology is applied to a plurality of semiconductor chips or semiconductor packages are stacked. The bump (bump) is an external connection terminal formed on the surface of the wafer by a conductive metal material. The bumps serve as channels for electrically connecting circuits of the semiconductor chips different from each other. However, if foreign materials adhere to the wafer surface or bumps during the fabrication of stacked semiconductor devices, problems may occur during the stacking process or operation. Conventionally, when bumps are damaged during the manufacturing process of stacked semiconductor devices, foreign matters are manually removed or directly discarded without performing a foreign matter removal operation, and thus there are problems in that the yield of products is lowered and the manufacturing cost is greatly lost. In addition, in practice, even in the case of masks (including photomasks and the like), further improved cleaning apparatuses are required. Disclosure of Invention Problems to be solved by the invention The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a cleaning device capable of removing foreign matter adhering to the surface of a flat substrate including a wafer and a mask and to bumps. Further, an object of the present invention is to provide a cleaning apparatus capable of removing foreign matter and cooling a surface of a flat substrate including a wafer or a mask. Further, an object of the present invention is to provide a cleaning apparatus capable of preventing suspended matters generated during foreign matter removal from remaining on the surface of a flat substrate including a wafer or a mask. Further, an object of the present invention is to provide a cleaning device capable of removing foreign matter in different manners according to the kind of the foreign matter. Means for solving the problems In order to solve the above-described problems, an embodiment of the present invention may provide a cleaning apparatus including an image pickup unit to photograph a surface of a flat substrate including a wafer or a mask, a laser unit to irradiate a laser beam to a target position where foreign matter is attached when the target position is confirmed by the image pickup unit, a cleaning unit to spray gas toward the target position and a peripheral portion thereof, and a suction (suction) unit to suck suspended matter generated by the laser unit and/or the cleaning unit. Preferably, the cleaning unit desorbs the foreign matter in a process of rapidly contracting the foreign matter and rapidly expanding the foreign matter again by physically colliding the foreign matter. Preferably, the cleaning unit is configured to remove organic foreign matters, and the laser unit is configured to remove foreign matters including organic foreign matters not removed by the cleaning unit. Preferably, in the foreign matter removal process by the laser unit, the cleaning unit is configured to spray solid carbon dioxide in order to prevent thermal damage of the flat substrate, thereby purging suspended matters generated in the foreign matter removal process while cooling the flat substrate. Preferably, the imaging device further includes an objective lens unit disposed on an optical path where an optical axis of the laser unit and an optical axis of the imaging unit overlap. Preferably, a suction part is formed at one side of the suction unit, the suction part is recessed toward the inside of the suction unit, and the suction part has a circular cross section so that the suspended matter is sucked in a radial direction. Preferably, the suction unit is disposed at an inner diameter center of the image pickup unit on an optical path thereof, and the cleaning unit is disposed opposite to the suction unit and ejects the solid carbon dioxide toward the suction unit during operation of the suction unit. Effects of the invention According to the means for solving the problems of the present invention as described above, various effects including the following can be expected. However, the present invention does not necessarily achieve the following effects. The cleaning device of the embodiment of the invention can remove the foreign matters attached to the surface of the flat substrate including the wafer or the mask and the convex blocks, thereby improving the yield of products and reducing the loss cost caused by discarding. In addition, the invention can cool the surface of