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CN-121986590-A - Ceramic joint body and electrostatic chuck device

CN121986590ACN 121986590 ACN121986590 ACN 121986590ACN-121986590-A

Abstract

A ceramic joined body is provided with a 1 st ceramic plate and a 2 nd ceramic plate, which are stacked in the thickness direction, and a band-shaped heater section, which is positioned between the 1 st ceramic plate and the 2 nd ceramic plate, wherein the 2 nd ceramic plate is provided with a plurality of groove sections which accommodate the heater sections and are arranged in the width direction, and wall sections, which are positioned between the groove sections and protrude with respect to the bottom wall surface of the groove sections, and the front end surface of the wall section is positioned outside the groove section in the width direction with respect to the bottom wall surface.

Inventors

  • Yi Youtuo
  • OZAKI MASAKI
  • Sugamata Takashi

Assignees

  • 住友大阪水泥股份有限公司

Dates

Publication Date
20260505
Application Date
20241108
Priority Date
20231115

Claims (16)

  1. 1. A ceramic joined body is provided with: A1 st ceramic plate and a2 nd ceramic plate laminated in a thickness direction, and A band-shaped heater part positioned between the 1 st ceramic plate and the 2 nd ceramic plate, At the 2 nd ceramic plate, set up: A plurality of grooves arranged along the width direction thereof, and A plurality of wall portions respectively located between adjacent ones of the groove portions and protruding with respect to a bottom wall surface of the groove portion, The heater portion is accommodated in the groove portion, The wall portion has a front end face, The front end surface is located outside the groove portion in the width direction with respect to the bottom wall surface.
  2. 2. The ceramic joint body according to claim 1, wherein, The groove portion has a side wall surface, The side wall surface has a1 st region extending in the thickness direction, and A2 nd region located closer to the 1 st ceramic plate than the 1 st region and connected to the front end face, The 2 nd region is inclined toward the widthwise outer side of the groove portion as it is toward the 1 st ceramic plate side.
  3. 3. The ceramic joint body according to claim 2, wherein, The 2 nd region is a curved surface having an inclination angle which increases with respect to the thickness direction as it goes toward the 1 st ceramic plate side, and is smoothly connected to the 1 st region and the front end surface.
  4. 4. The ceramic joint body according to claim 1, wherein, The dimension of the front end face in the width direction is 2500 [ mu ] m or less.
  5. 5. The ceramic joined body according to claim 1, comprising a buffer layer disposed between the 1 st ceramic plate and the 2 nd ceramic plate.
  6. 6. The ceramic joint body according to claim 5, wherein, The side surface of the heater part and the side wall surface of the groove part are opposite to each other with a gap, The buffer layer is formed of an insulating material having a thermal expansion coefficient larger than that of ceramic materials constituting the 1 st ceramic plate and the 2 nd ceramic plate, and at least a part thereof overlaps the gap when viewed in the thickness direction.
  7. 7. The ceramic joint body according to claim 6, wherein, The dimension in the width direction of the gap in the opening of the groove is larger than the thickness dimension of a portion of the buffer layer sandwiched between the 1 st ceramic plate and the 2 nd ceramic plate.
  8. 8. The ceramic joint body according to claim 6, wherein, The ratio of the thermal expansion coefficient of the insulating material constituting the buffer layer to the thermal expansion coefficient of the ceramic material constituting the 1 st ceramic plate and the 2 nd ceramic plate is 1.1 or more and 2.0 or less.
  9. 9. The ceramic joint body according to claim 6, wherein, The dimension of the heater portion in the width direction is 2 times or more the dimension of the front end surface in the width direction.
  10. 10. The ceramic joint body according to claim 6, wherein, A portion of the buffer layer is disposed in the gap.
  11. 11. The ceramic joint body according to claim 6, wherein, The side wall surface of the groove portion has: region 1 extending in the thickness direction, and A2 nd region located closer to the 1 st ceramic plate than the 1 st region and connected to the front end face, The 2 nd region is inclined toward the outside of the width direction of the groove as it is toward the 1 st ceramic plate side, The dimension in the width direction of the 2 nd region is larger than the thickness dimension of a portion of the buffer layer sandwiched between the 1 st ceramic plate and the 2 nd ceramic plate.
  12. 12. The ceramic joint body according to claim 11, wherein, The side wall surface of the groove portion has a 3 rd region, and the 3 rd region is located at a boundary portion between the 1 st region and the bottom wall surface and smoothly connects the 1 st region and the bottom wall surface.
  13. 13. The ceramic joint body according to claim 12, wherein, The radius of curvature of the 3 rd region is larger than the thickness dimension of the portion of the buffer layer sandwiched between the 1 st ceramic plate and the 2 nd ceramic plate.
  14. 14. The ceramic joint body according to claim 6, wherein, The heater portion has a thickness dimension greater than a thickness dimension of a portion of the buffer layer sandwiched between the 1 st ceramic plate and the 2 nd ceramic plate.
  15. 15. The ceramic joint body according to claim 1, wherein, The heater section is formed of a thin metal plate.
  16. 16. An electrostatic chuck apparatus having the ceramic joint of any one of claims 1 to 15.

Description

Ceramic joint body and electrostatic chuck device Technical Field The present invention relates to a ceramic joined body and an electrostatic chuck device. Background In the semiconductor manufacturing process, an electrostatic chuck device for holding a semiconductor wafer in a vacuum atmosphere is used. The electrostatic chuck device mounts a plate-like sample such as a semiconductor wafer on a mounting surface, and generates an electrostatic force between the plate-like sample and an internal electrode to thereby adsorb and fix the plate-like sample. In such an electrostatic chuck device, a heater portion is embedded in a ceramic joined body having a mounting surface formed thereon, and the mounting surface is heated by the heater portion (for example, patent document 1). Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 9-82786 Disclosure of Invention Technical problem to be solved by the invention In recent semiconductor manufacturing processes, there is an increasing demand for achieving etching with a high aspect ratio. To achieve this, it is necessary to further reduce the temperature of the refrigerant used to cool the wafer. However, if the temperature of the refrigerant is lowered, the viscosity of the refrigerant increases, which may cause temperature unevenness due to the flow path to increase. Therefore, local heating is required in a range where the temperature is too low. On the other hand, with the progress of miniaturization of wafer processing, a high etching selectivity is demanded. However, in order to achieve a desired etching selectivity, there is a case where an insufficient etching occurs only by the incident energy of etching. In order to compensate for this disadvantage, it is conceivable to heat the substrate (plate-like sample) by a heater incorporated in the ceramic joined body to raise the temperature of the substrate to an elevated temperature, thereby performing energy assist or the like. For this reason, it is sometimes required to heat the mounting surface of the electrostatic chuck device to a higher temperature and to control the mounting surface to a uniform temperature. In order to meet these demands, it is conceivable to arrange the heater portion densely with respect to the mounting surface. For example, the heater portion is disposed in the groove portion of one of the pair of ceramic plates and then sandwiched between the pair of ceramic plates. However, it has been found that when the heater portions are densely arranged with respect to the mounting surface, the strength of the region of the ceramic plate disposed between the heater portions is insufficient, and large damage may easily occur to the ceramic plate. An object of the present invention is to provide a ceramic joined body and an electrostatic chuck device, which suppress damage to a ceramic plate. Means for solving the technical problems The present invention includes the following [1] to [11]. The following [1] to [11] are also preferably combined with 2 or more as required. [1] A ceramic joined body is provided with a1 st ceramic plate and a 2 nd ceramic plate, which are stacked in the thickness direction, and a band-shaped heater section, which is positioned between the 1 st ceramic plate and the 2 nd ceramic plate, wherein a plurality of groove sections are provided in the 2 nd ceramic plate, which are arranged in the width direction thereof, and a plurality of wall sections, which are respectively positioned between adjacent groove sections and protrude with respect to the bottom wall surface of the groove section, wherein the heater section is accommodated in the groove section, wherein the wall section has a front end surface, which is positioned outside the width direction of the groove section with respect to the bottom wall surface. [2] The ceramic joint body according to [1], wherein, The groove portion has a side wall surface having a 1 st region extending in the thickness direction and a2 nd region located closer to the 1 st ceramic plate than the 1 st region and connected to the front end surface, and the 2 nd region is inclined toward the outside in the width direction of the groove as it goes toward the 1 st ceramic plate side. [3] The ceramic joint body according to [2], wherein, The 2 nd region is a curved surface having an inclination angle which increases with respect to the thickness direction as it goes toward the 1 st ceramic plate side, and is smoothly connected to the 1 st region and the front end surface. [4] The ceramic joint body according to [1] or [2], wherein, The dimension of the front end face in the width direction is 2500 [ mu ] m or less. [5] The ceramic joined body according to any one of [1] to [4], wherein the ceramic joined body comprises a buffer layer, and the buffer layer is disposed between the 1 st ceramic plate and the 2 nd ceramic plate. [6] The ceramic joint body according to [5], wherein, The side surface of the heater