CN-121986592-A - Inspection apparatus, cutting apparatus, and method for manufacturing semiconductor device

Abstract

The inspection apparatus includes a control unit. The control unit sets a defective mark region in advance in a setting image in which an inspection object is imaged, the defective mark region being a region in which a defective mark is imaged when the defective mark is contained in the inspection object, and checks whether the defective mark is contained in the inspection object imaged in the inspection image by checking the defective mark region in the inspection image. The preset defective mark area includes acquiring a setting image of a defective product, which is an inspection object that does not include a defective mark, and a defective product, which is an inspection object that includes a defective mark, and determining the defective mark area by comparing the brightness of the defective product area that is imaged in the setting image with the brightness of the defective product area that is imaged in the setting image.

Inventors

• TANAKA KOTARO
• Mizuta ayaka
• FUJIKI TOMOHIRO

Assignees

• 东和株式会社

Dates

Publication Date

20260505

Application Date

20240709

Priority Date

20231212

Claims (10)

1. 1. An inspection apparatus includes a control unit that presets a defective mark region in a setting image in which an inspection object is imaged, the defective mark region being a region in which the defective mark is imaged when the defective mark is included in the inspection object, and inspects whether or not the defective mark is included in the inspection object imaged in the inspection image by inspecting the defective mark region in the inspection image, The presetting of the defective marking area includes: acquiring the setting image in which a good product which is the inspection object and which does not include the defective mark and a defective product which is the inspection object and which includes the defective mark are imaged, The defective mark region is determined by comparing the brightness of the defective region in which the defective product is imaged in the setting image with the brightness of the defective region in which the defective product is imaged in the setting image.
2. 2. The inspection apparatus according to claim 1, wherein, The control unit divides the good region and the defective region into a plurality of divided regions, and compares the brightness of the good region with the brightness of the defective region for each of the divided regions to determine the defective mark region.
3. 3. The inspection apparatus according to claim 2, wherein, The control unit selects the divided regions in which the luminance difference between the good region and the defective region is equal to or greater than a first threshold value, and determines the defective mark region so as to include the selected divided regions.
4. 4. The inspection apparatus according to claim 3, wherein, The control unit selects the divided regions having the luminance difference equal to or greater than a second threshold among the divided regions adjacent to the divided regions having the luminance difference equal to or greater than the first threshold, and determines the defective flag region so as to include the selected divided regions.
5. 5. The inspection apparatus according to claim 3 or 4, wherein, The control unit determines the defective mark region so as to include a region of a largest area among one or more regions formed by stitching the selected divided regions.
6. 6. The inspection apparatus according to any one of claims 1 to 5, wherein, The control unit sets a third threshold value for checking the defective mark region in the check image in advance based on the brightness of the defective mark region in the setting image.
7. 7. The inspection apparatus according to claim 6, wherein, Presetting the third threshold includes: Calculating a difference between an area of a portion of the defective mark region having a luminance exceeding the third threshold value and an area of a portion of the defective mark region having a luminance exceeding the third threshold value, The third threshold is preset based on the difference.
8. 8. The inspection apparatus according to claim 7, wherein, The control unit sets, as the third threshold, a luminance which maximizes the difference value within a variation range of the third threshold and differs from the third threshold by an offset value in advance.
9. 9. A cutting device is provided with: a cutting mechanism for cutting a substrate including a plurality of semiconductor components to singulate the semiconductor components, and The inspection apparatus according to any one of claims 1 to 8, wherein the singulated semiconductor devices are inspected as the inspection objects.
10. 10. A method of manufacturing a semiconductor component, comprising: A step of cutting a substrate including a plurality of semiconductor components by a cutting mechanism to singulate the semiconductor components, and A step of inspecting the singulated semiconductor components as the inspection object using the inspection apparatus according to any one of claims 1 to 8.

Description

Inspection apparatus, cutting apparatus, and method for manufacturing semiconductor device Technical Field The present invention relates to an inspection apparatus, a cutting apparatus, and a method for manufacturing a semiconductor device. Background In a production line of a product such as a semiconductor device, a defective mark indicating that the product is defective may be marked on the product. In this case, a defective mark inspection is often performed in a subsequent inspection apparatus, the defective mark inspection being an inspection to inspect whether or not a product is marked with a defective mark. Patent document 1 discloses a method for detecting a defective mark based on image processing. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2013-38285 In order to accurately detect the defective mark, it is desirable to set a region (defective mark region) in which the defective mark is marked if the product includes the defective mark as accurately as possible in the image in which the product is imaged. However, since the position and shape of the defective mark are different depending on the product, the position of the defective mark region in the image may not be uniformly determined. In addition, the position of the defective mark region in the image also changes depending on the mounting position, angle, and the like of the camera. Therefore, in many cases, the defective mark region has to be manually set. As a result, there are problems such as a large variation in settings performed by the operator, and it is difficult to ensure the accuracy of the defective mark inspection. Disclosure of Invention The present invention aims to provide an inspection apparatus, a cutting apparatus, and a method for manufacturing a semiconductor component, which can appropriately set a defective mark region in an image of an object to be inspected, thereby improving the accuracy of defective mark inspection. An inspection apparatus according to an aspect of the present invention includes a control unit. The control unit sets a defective mark region in advance in a setting image in which an inspection object is imaged, the defective mark region being a region in which a defective mark is imaged when the defective mark is contained in the inspection object, and checks whether the defective mark is contained in the inspection object imaged in the inspection image by checking the defective mark region in the inspection image. The preset defective mark area includes acquiring a setting image of a defective product, which is an inspection object that does not include a defective mark, and a defective product, which is an inspection object that includes a defective mark, and determining the defective mark area by comparing the brightness of the defective product area that is imaged in the setting image with the brightness of the defective product area that is imaged in the setting image. The cutting device according to another aspect of the present invention includes a cutting mechanism for cutting a substrate including a plurality of semiconductor components to singulate the semiconductor components, and the inspection device inspects the singulated semiconductor components as an inspection object. A method for manufacturing a semiconductor device according to another aspect of the present invention includes a step of cutting a substrate including a plurality of semiconductor devices by a cutting mechanism to singulate the semiconductor devices, and a step of inspecting the singulated semiconductor devices as an inspection object using the inspection apparatus. Effects of the invention According to the present invention, the defective marker region is appropriately set in the image in which the inspection object is imaged, and thereby the accuracy of defective marker inspection can be improved. Drawings Fig. 1 is a plan view schematically showing a cutting device according to an embodiment. Fig. 2 is a side sectional view schematically showing a shooting environment of a second optical inspection camera according to an embodiment. Fig. 3 is a diagram schematically showing a hardware configuration of a computer according to an embodiment. Fig. 4 is a view showing an example of an image of a semiconductor component captured by a second optical inspection camera according to an embodiment. Fig. 5 is a flowchart showing a flow of a method for setting a parameter for checking a defect flag according to an embodiment. Fig. 6 is a diagram showing an example of divided regions set in one component region according to an embodiment. Fig. 7A is a diagram showing a comparison result of brightness between a good product region and a defective product region according to an embodiment. Fig. 7B is a diagram showing a comparison result of brightness between a good product region and another good product region according to an embodiment. Fig. 7C is a diagram showing a comp