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CN-121986596-A - Microchannel cooling block, cooling system comprising same and method for manufacturing microchannel cooling block

CN121986596ACN 121986596 ACN121986596 ACN 121986596ACN-121986596-A

Abstract

A microchannel cooling block includes a substrate, a microchannel array including a plurality of heat conducting plates connected to and extending from a surface of the substrate, the heat conducting plates being arranged such that their highest or second highest heat conducting axis extends away from the surface of the substrate, adjacent heat conducting plates being spaced apart from one another to form a plurality of microchannels between the heat conducting plates, one of the microchannels between each two adjacent heat conducting plates, and a manifold connected to the heat conducting plates, an interior of the manifold being in fluid communication with the microchannels in the microchannel array.

Inventors

  • JOHN H. MARTIN
  • DAVID A. SMITH
  • CHRISTOPHER ROPER

Assignees

  • HRL实验室有限责任公司

Dates

Publication Date
20260505
Application Date
20230823

Claims (20)

  1. 1. A microchannel cooling block, comprising: A substrate; A microchannel array comprising a plurality of thermally conductive plates connected to and extending from a surface of the substrate, the thermally conductive plates being arranged such that their highest or second highest thermal conductivity axes extend away from the surface of the substrate, adjacent ones of the thermally conductive plates being spaced apart from each other to form a plurality of microchannels between the thermally conductive plates, one of the microchannels between each two adjacent ones of the thermally conductive plates, and A manifold connected to the thermally conductive plate, an interior of the manifold being in fluid communication with the microchannels in the array of microchannels.
  2. 2. The microchannel cooling block of claim 1, wherein the thermally conductive plate comprises graphite, boron nitride, boron arsenide, diamond, silver, copper, gold, silicon carbide, aluminum nitride, tungsten, copper tungsten (CuW), copper molybdenum (CuMo), molybdenum, graphene, carbon nanotubes, boron nitride nanotubes, or boron nitride platelet composites.
  3. 3. The microchannel cooling block of claim 1, wherein one or more of the thermally conductive plates are individually coated with metal.
  4. 4. The microchannel cooling block of claim 1, wherein the thermally conductive plate has a thickness in the range of 1 μιη to 500 μιη.
  5. 5. The microchannel cooling block of claim 1, wherein the microchannels have a width in the range of 1 μιη to 500 μιη.
  6. 6. The microchannel cooling block of claim 1, wherein the substrate comprises copper.
  7. 7. The microchannel cooling block of claim 1, wherein the manifold comprises a plurality of levels, the number of fluid flow channels of each subsequent level being greater than the previous level.
  8. 8. A cooling system, comprising: An electronic component; a microchannel cooling block disposed on the electronic component, the microchannel cooling block comprising: A substrate; A microchannel array comprising a plurality of heat conducting plates connected to and extending from the substrate, wherein a plurality of microchannels are provided between the heat conducting plates with one of the microchannels between each two adjacent heat conducting plates, and A manifold connected to the thermally conductive plate, an interior of the manifold in fluid communication with the microchannels in the array of microchannels, and A heat exchanger in fluid communication with the manifold of the microchannel cooling block.
  9. 9. The cooling system of claim 8, wherein coolant flowing between the microchannel cooling block and the heat exchanger is water-based.
  10. 10. The cooling system of claim 8, further comprising a primary heat exchanger, Wherein the heat exchanger is a secondary heat exchanger, Wherein the secondary heat exchanger is configured to transfer heat to the primary heat exchanger.
  11. 11. A method of manufacturing a microchannel cooling block, the method comprising: Alternately stacking a plurality of thermally conductive sheets and sacrificial spacer sheets to form a thermally conductive sheet-sacrificial spacer sheet array; bonding the array of thermally conductive tab-sacrificial spacer together by forming a metallized outer structure around the array of thermally conductive tab-sacrificial spacer; removing the sacrificial spacer to form a plurality of micro-channels between the thermally conductive sheets, and A substrate is attached to one side of the thermally conductive sheet.
  12. 12. The method of claim 11, further comprising individually encasing one or more of the thermally conductive sheets.
  13. 13. The method of claim 11, wherein the thermally conductive sheet comprises graphite, boron nitride, boron arsenide, diamond, silver, copper, gold, silicon carbide, aluminum nitride, tungsten, copper tungsten (CuW), copper molybdenum (CuMo), molybdenum, graphene, carbon nanotubes, boron nitride nanotubes, or boron nitride platelet composites.
  14. 14. The method of claim 11, further comprising coating the thermally conductive sheet with a thermally conductive metal.
  15. 15. The method of claim 11, wherein the sacrificial spacer is a zinc sheet or a polylactic acid sheet.
  16. 16. The method of claim 11, wherein the attaching of the substrate comprises electroforming copper material on one side of the thermally conductive sheet.
  17. 17. The method of claim 11, wherein the metallized outer structure comprises copper.
  18. 18. The method of claim 11, further comprising attaching a manifold to the other side of the thermally conductive sheet.
  19. 19. The method of claim 18, wherein the manifold comprises a plurality of stages, each subsequent stage having a greater number of fluid flow channels than the previous stage.
  20. 20. The method according to claim 11, wherein the heat conductive sheet has a thickness in a range of 1 μm to 500 μm, and Wherein the sacrificial spacer has a thickness in the range of 1 μm to 500 μm.

Description

Microchannel cooling block, cooling system comprising same and method for manufacturing microchannel cooling block Cross Reference to Related Applications The present disclosure relates to U.S. patent application Ser. No. 16/930,203, filed on 7/15/2020, which is entitled to U.S. patent Ser. No. 11,680,756 at 20/2023, and claims priority from U.S. provisional patent application Ser. No. 62/924,031, filed on 21/2019, and to U.S. patent application Ser. No. 16/784,890, filed on 7/2020, which claims priority from U.S. provisional patent application Ser. No. 62/828, 606 and from U.S. provisional patent application Ser. No. 62/944,779, filed on 4/2019, 12/6, respectively. Technical Field One or more aspects of embodiments of the present disclosure relate to a microchannel cooling block and a cooling system including the microchannel cooling block. Background As computer-based systems become the heart of people's daily lives, large-scale servers comprising tens, hundreds, or even thousands of individual computer processors (i.e., CPUs) and related components are becoming widely used. Implementation of such large-scale servers requires satisfaction of size, power, and cooling requirements. Typically, such large-scale server implemented cooling requirements may be a substantial portion of the total power requirements implemented and a substantial portion of the overall size requirements implemented. For smaller scale electronics such as radar systems, microwave and cellular communication systems, size and power considerations also exist. Further, related art cooling systems often utilize dedicated refrigerants in the cooling circuit, such as R134a and R401a. While modern refrigerants are less environmentally damaging than earlier refrigerants, they have been found to result in ozone depletion, these refrigerants still present an environmental hazard when they leak, and require special disposal when used in cooling systems. Disclosure of Invention According to embodiments of the present disclosure, a microchannel cooling block and a cooling system including the microchannel cooling block are provided. As described more fully below, the microchannel cooling block enables both small computer cooling systems and large computer cooling systems to use water and water-based coolants. In addition, the microchannel cooling block provides excellent heat transfer while the required pumping power is greatly reduced. In some embodiments, the microchannel cooling block includes an array of microchannels in which thermally conductive sheets are attached to a substrate and spaced apart from one another by a very small dimension (such as about 1 μm to about 500 μm) to form microchannels for coolant flow therethrough. To form such small micro-channels, the thermally conductive sheets are stacked with sacrificial spacer sheets, the array of sheets is bonded together by an external metallization structure, and the sacrificial spacer sheets are then removed (e.g., dissolved) to form the micro-channels between the thermally conductive sheets. In this way, very small micro-channels can be formed, thereby improving heat transfer and reducing pumping requirements, and since the thermally conductive sheet is supported by an external metallized structure, materials such as graphite that have excellent thermal conductivity but are inherently brittle can be used, further improving heat transfer performance. According to an embodiment of the present disclosure, a microchannel cooling block includes a substrate, a microchannel array including a plurality of heat conducting plates connected to and extending from a surface of the substrate, the heat conducting plates being arranged such that a highest or second highest heat conducting axis thereof extends away from the surface of the substrate, adjacent heat conducting plates being spaced apart from one another to form a plurality of microchannels between the heat conducting plates, one of the microchannels between each two adjacent heat conducting plates, and a manifold connected to the heat conducting plates, an interior of the manifold being in fluid communication with the microchannels in the microchannel array. The thermally conductive plate may include graphite, boron nitride, boron arsenide, diamond, silver, copper, gold, silicon carbide, aluminum nitride, tungsten, copper tungsten (CuW), copper molybdenum (CuMo), molybdenum, graphene, carbon nanotubes, boron nitride nanotubes, or boron nitride platelet composites (boron NITRIDE PLATELET composites). One or more of the heat conductive plates may be individually coated with metal. The heat conductive plate may have a thickness in a range of 1 μm to 500 μm. The micro-channels may have a width in the range of 1 μm to 500 μm. The substrate may comprise copper. The manifold may include multiple levels, with each subsequent level having a greater number of fluid flow channels than the previous level. According to an embodiment of the present discl