CN-121986599-A - Heat dissipation plate, electronic component, and method of manufacturing electronic component with improved thermal properties

Abstract

Heat spreader, electronic component having heat spreader, and method of manufacturing heat spreader and electronic component having improved thermal properties. One example is a heat spreader plate configured to be mounted to a die. The heat spreader plate includes a body including a top side and a bottom side, the top side being disposed away from the die and the bottom side being disposed facing the die. The body is shaped and adapted to be mounted to the die such that a first portion of the bottom side is thermally coupled to a first target contact location of the die, a second portion of the bottom side is thermally coupled to a second target contact location of the die, and a third portion of the bottom side is spaced apart from the die, thereby allowing the heat spreader plate to dissipate heat generated by the die.

Inventors

• Bernd Spoler
• KLAUS WEINMANN

Assignees

• 智能平台有限责任公司

Dates

Publication Date

20260505

Application Date

20230927

Claims (20)

1. 1. A heat spreader plate configured to be mounted to a die, the heat spreader plate comprising: A body including a top side and a bottom side, the top side being arranged to face away from the die and the bottom side being arranged to face the die, Wherein the body is shaped and adapted to be mounted to the die such that a first portion of the bottom side is thermally coupled to a first target contact location of the die, a second portion of the bottom side is thermally coupled to a second target contact location of the die, and a third portion of the bottom side is spaced apart from the die, thereby allowing the heat spreader plate to dissipate heat generated by the die.
2. 2. The heat dissipating plate of claim 1, wherein the first portion and the second portion of the bottom side are offset from a center portion of the body.
3. 3. The heat spreader plate of claim 1, wherein the bottom side has a fourth portion adapted to be thermally coupled to a third target contact location of the die.
4. 4. The heat dissipating plate of claim 1, wherein the bottom side is defined by a plurality of edges and a central portion recessed relative to the plurality of edges.
5. 5. The heat dissipating plate of claim 1, wherein the bottom side is defined by a first angled surface and a second angled surface, and wherein the first portion of the bottom side is located on the first angled surface and the second portion of the bottom side is located on the second angled surface.
6. 6. The heat spreader plate of claim 1, wherein the bottom side is partially flat.
7. 7. The heat spreader plate of claim 1, further comprising one or more flow channels formed in the bottom side of the heat spreader plate.
8. 8. The electronic assembly of claim 1, wherein the bottom side of the heat spreader plate includes a first surface made of a first material, and the first portion and the second portion of the heat spreader plate are made of a second material different from the first material.
9. 9. An electronic assembly, the electronic assembly comprising: A die having a first target contact location and a second target contact location, the first target contact location being associated with a first predetermined internal hot spot of the die and the second target contact location being associated with a second predetermined internal hot spot of the die; A heat spreader plate shaped and mounted to the die such that a first portion of the heat spreader plate is thermally coupled to the first target contact location of the die and a second portion of the heat spreader plate is thermally coupled to the second target contact location of the die, thereby allowing the heat spreader plate to dissipate heat generated by the die, and A thermally conductive grease material thermally coupling the first portion of the heat spreader plate to the first target contact location of the die and the second portion of the heat spreader plate to the second target contact location, wherein the thermally conductive grease material is movable between the first portion and the second portion of the heat spreader plate.
10. 10. The electronic assembly of claim 9, wherein the heat spreader plate has a third portion disposed between the first portion and the second portion and spaced apart from the die.
11. 11. The electronic component of claim 9, further comprising a Flip Chip Ball Grid Array (FCBGA) including the die.
12. 12. The electronic assembly of claim 9, wherein the first target location is located between the first and third predetermined internal hot spots.
13. 13. The electronic assembly of claim 9, wherein the first portion and the second portion of the heat spreader plate are offset from a center of the die.
14. 14. The electronic assembly of claim 9, wherein the die has a third target contact location associated with a third predetermined internal hot spot of the die, and wherein the heat spreader plate is shaped and mounted to the die such that a third portion of the heat spreader plate is in thermal contact with the third target contact location.
15. 15. The electronic assembly of claim 9, wherein the die has a first shape and the heat spreader plate has a second shape that is different from the first shape.
16. 16. The electronic assembly of claim 9, wherein the heat spreader plate has a top side and a bottom side, wherein the top side faces away from the die and the bottom side faces toward the die, and wherein the bottom side is defined by a plurality of edges and a central portion recessed relative to the plurality of edges.
17. 17. The electronic assembly of claim 9, wherein the heat spreader plate has a top side and a bottom side, wherein the top side faces away from the die and the bottom side faces toward the die, wherein the bottom side is defined by a first angled surface and a second angled surface, and wherein the first portion of the bottom side is located on the first angled surface and the second portion of the bottom side is located on the second angled surface.
18. 18. A method of manufacturing an electronic assembly, the method comprising: Obtaining a tube core; Identifying a first internal hot spot and a second internal hot spot of the die; defining first and second target contact locations of the die associated with the first and second internal hot spots, respectively; Obtaining a heat spreader plate based on the defined first and second target contact locations, the heat spreader plate having a shape such that a first portion of the heat spreader plate is thermally coupled to the first target contact location of the die and a second portion of the heat spreader plate is thermally coupled to the second target contact location of the die, and The heat spreader plate is mounted to the die.
19. 19. The method of manufacturing as set forth in claim 18 wherein the act of obtaining the heat dissipating plate comprises designing the heat dissipating plate based on the defined first target contact location and second target contact location and manufacturing the designed heat dissipating plate.
20. 20. The method of manufacturing of claim 18, further comprising generating a thermal map of the die using a thermal imager, wherein the first and second internal hot spots are identified from the generated thermal map.

Description

Heat dissipation plate, electronic component, and method of manufacturing electronic component with improved thermal properties Technical Field The present disclosure relates generally to cooling electronic devices, and more particularly to electronic components and methods of manufacturing electronic components having improved thermal properties. Background The electronic package is used to provide protection, support and connection for one or more electronic components therein. However, electronic packages feature one or more components (e.g., dies) that generate heat. This heat, in turn, can negatively impact the performance of one or more electronic components, and more generally, the performance of the electronic package itself. Accordingly, various techniques have been developed that aim to improve thermal performance by dissipating heat from one or more heat generating components of these electronic packages. Fig. 1 shows one of these techniques, in which an electronic package in the form of a socket CPU 100 is equipped with an integrated heat spreader plate 104. Although difficult to see in fig. 1, the integrated heat spreader plate 104 is in thermal contact with the exposed die of the socket CPU 100 such that heat generated by the die is transferred to the integrated heat spreader plate 104. This heat is then dissipated via one or more heat sinks, although not shown in fig. 1, which are spring loaded onto the integrated heat spreader plate 104 to achieve a low thermal resistance between the integrated heat spreader plate 104 and the one or more heat sinks. Fig. 2 and 3 illustrate another of these techniques, wherein a spring-loaded heatsink 200 is mounted on an electronic package in the form of a flip-chip ball grid array (FCBGA) 204 that is soldered to a Printed Circuit Board (PCB) 208 via solder balls (not shown). In turn, spring-loaded heatsink 200 dissipates heat generated by exposed die 212 of FCBGA 204. Disclosure of Invention According to a first exemplary aspect of the present disclosure, a heat dissipation plate is provided. The heat spreader plate is configured to be mounted to a die. The heat spreader plate includes a body including a top side and a bottom side, the top side being disposed away from the die and the bottom side being disposed facing the die. The body is shaped and adapted to be mounted to the die such that a first portion of the bottom side is thermally coupled to a first target contact location of the die, a second portion of the bottom side is thermally coupled to a second target contact location of the die, and a third portion of the bottom side is spaced apart from the die, thereby allowing the heat spreader plate to dissipate heat generated by the die. According to a second exemplary aspect, an electronic assembly is provided. The electronic assembly includes a die having a first target contact location and a second target contact location, the first target contact location being associated with a first predetermined internal hot spot of the die and the second target contact location being associated with a second predetermined internal hot spot of the die. The electronic assembly further includes a heat spreader plate shaped and mounted to the die such that a first portion of the heat spreader plate is thermally coupled to a first target contact location of the die and a second portion of the heat spreader plate is thermally coupled to a second target contact location of the die, thereby allowing the heat spreader plate to dissipate heat generated by the die. The electronic assembly further includes a thermally conductive grease material thermally coupling the first portion of the heat spreader plate to the first target contact location of the die and the second portion of the heat spreader plate to the second target contact location, the thermally conductive grease material being movable between the first portion and the second portion of the heat spreader plate. According to a third exemplary aspect, a method of manufacturing an electronic component is provided. The method of manufacturing includes obtaining a die, identifying first and second internal hot spots of the die, and defining first and second target contact locations of the die associated with the first and second internal hot spots, respectively. Then, the manufacturing method includes obtaining a heat dissipation plate based on the defined first target contact position and second target contact position. The heat spreader plate has a shape such that a first portion of the heat spreader plate is thermally coupled to a first target contact location of the die and a second portion of the heat spreader plate is thermally coupled to a second target contact location of the die. The method of manufacturing also includes mounting a heat spreader plate to the die. Further in accordance with any one or more of the first, second, or third exemplary aspects described above, the electronic component and/or the met