CN-121986600-A - Bonding device, method, and program

Abstract

The semiconductor chip bonding apparatus includes a rail member for conveyably holding an end portion of a frame on which a semiconductor chip to be bonded is disposed, a pressing member for approaching the frame from one direction, a heating member for applying heat to the frame and approaching the frame from the other direction opposite to the one direction, and a control unit for dividing distances between the pressing member and the heating member in a plurality of steps to approach the same, fixing the frame by the pressing member and the heating member, and setting execution time of each step.

Inventors

• YOSHIHARA AKIHIRO
• Morisuke higai
• Ban Tiansheng
• TAMURA ISSEI

Assignees

• 雅马哈智能机器株式会社

Dates

Publication Date

20260505

Application Date

20241028

Priority Date

20231031

Claims (10)

1. 1. An engagement device, comprising: A rail member for conveyably holding an end portion of a frame on which a semiconductor chip to be bonded is disposed; A pressing member approaching the frame from one direction; A heating member for applying heat to the frame and approaching the frame from the other direction opposite to the one direction, and And a control unit that divides the distance between the pressing member and the heating member in a plurality of steps to approach each other, fixes the frame by the pressing member and the heating member, and can set the execution time of each step.
2. 2. The engagement device according to claim 1, wherein, The control section can set the plurality of steps associated with time, which represent a first distance between the pressing member and the frame and a second distance between the heating member and the frame, based on an operation input by a user.
3. 3. The engagement device according to claim 1, wherein, The control part is Setting the execution time for stopping the pressing member and the heating member of the plurality of steps at a prescribed height based on an operation input of a user, Based on the plurality of steps and the execution time, the frame is pushed and fixed to the heating member by the pressing member.
4. 4. The engagement device according to claim 1, wherein, The control unit sets execution of the suction operation of the frame by the heating member based on an operation input of a user in a predetermined step of the plurality of steps.
5. 5. The engagement device according to claim 1, wherein, The control unit sets the number of steps among the plurality of steps based on an operation input by a user.
6. 6. The engagement device according to claim 1, wherein, The control section sets the plurality of steps based on an operation input by a user such that a distance between the heating member and the frame in a first step of the plurality of steps corresponding to a first time is greater than a distance between the heating member and the frame in a second step of the plurality of steps corresponding to a second time that is later than the first time and is continuous with the first time.
7. 7. The engagement device according to claim 2, wherein, The control unit sets the first distance and the second distance in the plurality of steps, respectively, based on an operation input by a user.
8. 8. The engagement device according to claim 1, wherein, The heating member adsorbs the frame, And the joining apparatus further includes a judging portion that judges whether or not the frame is adsorbed by the heating member, The control unit moves the pressing member and the heating member toward the frame through the plurality of steps when it is determined in the determination unit that the frame is not adsorbed by the heating member, and presses and fixes the frame to the heating member through the pressing member.
9. 9. A method of controlling an engagement device, the engagement device comprising: a pressing member for fixing a frame to which a semiconductor chip to be bonded is arranged in a direction from which the frame is arranged, and A heating member which is relatively close to the frame from the other direction opposite to the one direction and which applies heat to the frame, The method comprises the following steps: The distance between the pressing member and the heating member is divided so as to be close in a plurality of steps, the frame is fixed by the pressing member and the heating member, and the execution time of each step is set.
10. 10. A program that causes a computer as a control section in a joining apparatus including: A pressing member for fixing a frame to which a semiconductor chip to be bonded is arranged in a vicinity of the frame from one direction; a heating member which is relatively close to the frame from the other direction opposite to the one direction and applies heat to the frame, and The control part controls the jointing relative to the semiconductor chip, The operation is as follows: The distance between the pressing member and the heating member is divided so as to be close in a plurality of steps, the frame is fixed by the pressing member and the heating member, and the execution time of each step is set.

Description

Bonding device, method, and program Technical Field The present invention relates to a joining apparatus, a joining method, and a joining program. Background The wire bonding apparatus is an apparatus for connecting a substrate such as a lead frame to a semiconductor chip by using a wire. In wire bonding, the wire bonding apparatus needs to be fixed to a heating support such as a substrate by a device holder. Prior art literature Patent literature Patent document 1 U.S. patent application publication No. 2021/0305199 specification Disclosure of Invention Problems to be solved by the invention In the technique described in patent document 1, a semiconductor substrate on which semiconductor chips are arranged is held and fixed by a device holder and a support structure (for example, a heating block). The device holder has an opening exposing the semiconductor chip. The semiconductor chip exposed through the opening of the device holder is bonded with the semiconductor substrate held. When the semiconductor substrate is held, the semiconductor chip sometimes floats from the support structure due to the holding force of the device holder to the semiconductor substrate. In the technique, the semiconductor chip is inspected for floating up from the support structure. In the above-described technique, the clamping force is adjusted in accordance with the detected floating, so that appropriate wire bonding can be performed. However, in the technique described in patent document 1, the semiconductor chip cannot be prevented from floating up from the support structure, and therefore the semiconductor substrate and the semiconductor chip cannot be appropriately fixed to the support structure, and therefore, there is a problem that appropriate bonding cannot be performed. The present invention has been made to solve the above-described problems, and an object of the present invention is to appropriately fix a semiconductor substrate and a semiconductor chip at the time of bonding. Technical means for solving the problems The bonding apparatus according to an embodiment of the present invention includes a rail member for conveyably holding an end portion of a frame on which a semiconductor chip to be bonded is disposed, a pressing member for approaching the frame from one direction, a heating member for applying heat to the frame and approaching the frame from the other direction opposite to the one direction, and a control unit for dividing a distance between the pressing member and the heating member among a plurality of steps to approach the same, and fixing the frame by the pressing member and the heating member, thereby enabling setting of execution time of each step. The method according to an embodiment of the present invention is a method for controlling a bonding apparatus including a pressing member that approaches a frame in which a semiconductor chip to be bonded is arranged from one direction and that fixes the frame, and a heating member that approaches the frame from the other direction opposite to the one direction and that applies heat to the frame, the method including dividing distances between the pressing member and the heating member among a plurality of steps to approach them, fixing the frame by the pressing member and the heating member, and setting execution times of the respective steps. A program in an embodiment of the present invention causes a computer as a control section in a bonding apparatus including a pressing member that approaches a frame in which a semiconductor chip to be bonded is arranged from one direction and that fixes the frame, a heating member that approaches the frame from the other direction opposite to the one direction and that applies heat to the frame, and a control section that controls bonding with respect to the semiconductor chip, the operation being such that distances between the pressing member and the heating member are divided in a plurality of steps so as to approach each other, the frame being fixed by the pressing member and the heating member, and execution time of each step being set. ADVANTAGEOUS EFFECTS OF INVENTION The present invention enables a semiconductor substrate and a semiconductor chip to be fixed appropriately at the time of bonding. Drawings FIG. 1 is a side view showing a schematic configuration of a bonding apparatus. Fig. 2 is a plan view showing a state in which the device holder holds a semiconductor substrate. Fig. 3 is a diagram showing an example of the clamping step database D141. Fig. 4 is a flowchart showing a flow of the mounting process including the clamping step sequence. Fig. 5 is a schematic diagram showing the positional relationship of each component in each of the plurality of steps. Fig. 6 is a graph showing the positional relationship and suction timing of each component in each of the steps of the bonding apparatus. Fig. 7 is a diagram showing an example of the cancellation step database D142. Detailed Description S