CN-121986603-A - Joining device

Abstract

The bonding device includes a notch generating section for moving a first blade and a second blade in a separated state from each other in a direction intersecting with a drawing direction with respect to a wire drawn out from a capillary, and bringing the first blade and the second blade into contact with each other to form a notch in the wire, and a lead wire forming section for cutting the wire at the notch by gripping and pulling the wire with a gripper in a state where a tip portion of the wire is bonded to a bonding object, and forming the lead wire at the bonding object, wherein at least one of the first blade and the second blade has tapered portions formed such that a distance between the tapered portions becomes narrower toward an insertion direction of the wire.

Inventors

• Morisuke higai
• YOSHINO HIROAKI
• Taka kuniyuki
• Niao Tianren

Assignees

• 雅马哈智能机器株式会社

Dates

Publication Date

20260505

Application Date

20241107

Priority Date

20231115

Claims (8)

1. 1. An engagement device, comprising: A notch generating section for moving a first blade and a second blade separated from each other in a direction intersecting a drawing direction with respect to a wire drawn from a capillary, and bringing the first blade and the second blade into close contact with each other to form a notch in the wire, and A lead wire forming part for cutting the lead wire at the notch by holding and pulling the lead wire by a gripper in a state that the front end part of the lead wire is bonded to the bonding object, At least either one of the first blade and the second blade has tapered portions formed such that a distance between the tapered portions becomes narrower toward an insertion direction of the wire.
2. 2. The bonding device of claim 1, wherein one of the first and second blades does not have a blade portion forming the cutout, but has a contact surface that contacts the wire.
3. 3. The engagement device of claim 2, wherein the one of them has the taper.
4. 4. The bonding device according to claim 3, wherein the notch generating section brings the wire into contact with the tapered portion of the one and guides the wire to a position where the notch is formed, when the first blade and the second blade in the separated state are moved in the direction of the wire.
5. 5. The bonding device according to claim 1, wherein front end portions of the first blade and the second blade, which face the wire in the separated state, are separated from each other by a factor of 2 or more and less than 10 times relative to a diameter of the wire.
6. 6. The bonding device according to claim 1, wherein at least a surface layer of each of the first blade and the second blade is formed of an insulator.
7. 7. The bonding device according to claim 1, wherein the notch generating section vibrates the wire when the first blade and the second blade in the separated state are moved in a direction of the wire.
8. 8. The bonding device according to claim 1, wherein the notch generating section changes a position at which the notch is formed in the wire with time in a range in which the taper portion is not formed in a range of the insertion direction in which the first blade and the second blade face each other.

Description

Joining device Technical Field The present invention relates to a joining device. Background A bonding apparatus is known in which a substrate, a wafer, a lead frame, or the like is used as a bonding target, and a lead wire is formed at a predetermined position of the bonding target. The lead wire is a wire which is flattened by bonding to a bonding object and which protrudes from a wire ball and remains in a length of, for example, about 100 μm to 500 μm. Various methods have been developed for forming lead wires, for example, a method of forming an airless solder ball at the tip end portion of a wire and then applying a notch such as a notch or a recess to the intermediate portion of the wire by a dicing tool or the like has been known (for example, refer to patent document 1). Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 2001-160566 Disclosure of Invention Problems to be solved by the invention Generally, the wire used in the bonding apparatus has a very small diameter, and it is practically difficult to form a notch on the surface thereof. According to patent document 1, a technique aimed at simply inserting and closing a cutting tool is disclosed, but a specific implementation method thereof is not mentioned. The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a bonding apparatus for appropriately forming lead wires. Technical means for solving the problems The bonding device according to the first aspect of the present invention includes a notch generating section that moves a first blade and a second blade in a separated state from each other in a direction intersecting a wire extraction direction with respect to the wire extracted from the capillary, and brings the first blade and the second blade into close contact with each other to form a notch in the wire, and a lead wire forming section that holds and pulls the wire with a gripper in a state where a tip portion of the wire is bonded to a bonding target, thereby cutting the wire at the notch to form the lead wire at the bonding target, at least any one of the first blade and the second blade having tapered portions formed such that a distance between the tapered portions becomes narrower toward an insertion direction of the wire. ADVANTAGEOUS EFFECTS OF INVENTION According to the present invention, a bonding apparatus for appropriately forming a lead wire can be provided. Drawings Fig. 1 is a schematic view of the joining device according to the present embodiment when viewed from the side. Fig. 2 is a schematic view of the joining device according to the present embodiment as viewed from the upper surface. Fig. 3 is a system configuration diagram of the joining apparatus. Fig. 4 is a process diagram showing a process of forming a lead wire. Fig. 5 is a view for explaining the adjustment of the extraction amount of the joining device according to the first modification. Fig. 6 is a process diagram showing a process of forming a lead wire of the bonding apparatus according to the second modification. FIG. 7 is an enlarged view of the incision scissors in which the outer blade and the inner blade are separated. Fig. 8 is a view showing a state in which the outer blade and the inner blade in the separated state are moved in the direction of the wire. Detailed Description The present invention will be described below with reference to the following embodiments, but the invention according to the claims is not limited to the following embodiments. The structures described in the embodiments are not limited to all the structures necessary for solving the problems. Fig. 1 is a schematic view of a bonding apparatus 100 according to the present embodiment from the side. Fig. 2 is a schematic view of the same bonding apparatus 100 as viewed from the top surface. The illustrated coupling device 100 is shown in a simplified structure or mechanism for ease of understanding, or the size or shape of the components is made different from the actual device, or components that are not directly related to the characteristic components of the present embodiment are omitted, but are not intended to represent differences from the actual coupling device. The bonding apparatus 100 is an apparatus that uses a substrate, a wafer, a lead frame, or the like as a bonding target, and forms lead wires at predetermined positions of the bonding target. Fig. 1 shows a case where a lead wire 310 is formed on an electrode pad 321 on a substrate 320 to be bonded. The substrate 320 is fixed to the upper surface of the stage 170. In the present embodiment, as shown in the coordinate axes in the figure, the vertical axis is the Z axis, and the horizontal plane is the XY plane. The stage upper surface is parallel to the XY plane. By driving a part of the actuator 150, the XY table 160 is displaced in the XY plane direction with respect to the upper surface of the stage