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CN-121987050-A - Semiconductor variable-temperature cup cover

CN121987050ACN 121987050 ACN121987050 ACN 121987050ACN-121987050-A

Abstract

The invention discloses a semiconductor variable-temperature cup cover, which comprises a cup cover body (1), wherein a heating component (2) and a refrigerating component (3) which are arranged in a protruding mode are respectively arranged on the top surface and the bottom surface of the cup cover body (1), a power supply line (4) is connected to the side portion of the cup cover body (1), the power supply line (4) is electrically connected with the heating component (2) and the refrigerating component (3), a mounting cavity (6) is arranged in the cup cover body (1), a change-over switch (7) is arranged in the mounting cavity (6), two change-over ends of the change-over switch (7) are respectively electrically connected with the heating component (2) and the refrigerating component (3), and contact triggering mechanisms (8) are respectively arranged on the upper side and the lower side of the cup cover body (1).

Inventors

  • FU YINGQI
  • Zheng Luwei
  • SUN WEIJIE
  • Meng Zijing
  • Tong can
  • HUANG YANG

Assignees

  • 浙江科技大学

Dates

Publication Date
20260508
Application Date
20260327

Claims (9)

  1. 1. The semiconductor variable-temperature cup cover is characterized by comprising a cup cover body (1), wherein a heating component (2) and a refrigerating component (3) which are arranged in a protruding mode are respectively arranged on the top surface and the bottom surface of the cup cover body (1), a power supply line (4) is connected to the side portion of the cup cover body (1), the power supply line (4) is electrically connected with the heating component (2) and the refrigerating component (3), a mounting cavity (6) is arranged in the cup cover body (1), a change-over switch (7) is arranged in the mounting cavity (6), two change-over ends of the change-over switch (7) are respectively electrically connected with the heating component (2) and the refrigerating component (3), contact trigger mechanisms (8) are respectively arranged on the upper side and the lower side of the cup cover body (1), and trigger ends of the contact trigger mechanisms (8) are correspondingly arranged with the change-over switch (7) and drive the contact trigger mechanisms to be conducted.
  2. 2. The semiconductor temperature-changing cup cover of claim 1, wherein the heating assembly (2) comprises a heating rod (9) arranged on the top surface of the cup cover body (1), and the energizing end of the heating rod (9) is connected with the power supply line (4) and the corresponding switching end of the switching switch (7).
  3. 3. The semiconductor variable-temperature cup cover according to claim 1, wherein the refrigerating assembly (3) comprises a heat insulation shell (10) arranged on the bottom surface of the cup cover body (1), a semiconductor refrigerating piece (11) is arranged at the bottom of the heat insulation shell (10), the heat absorption surface of the semiconductor refrigerating piece (11) is arranged downwards, the heat release surface of the semiconductor refrigerating piece (11) faces the inner cavity of the heat insulation shell (10), and the energizing end of the semiconductor refrigerating piece (11) is connected with the power supply line (4) and the corresponding switching end of the switching switch (7).
  4. 4. The semiconductor variable-temperature cup cover according to claim 3, wherein a guide fan (12) is arranged in the cup cover body (1), a radiating hole (13) opposite to the air outlet side of the guide fan (12) is formed in the top surface of the cup cover body (1), the air inlet side of the guide fan (12) faces the inner cavity of the heat insulation shell (10), and the power-on end of the guide fan (12) is connected with the power supply line (4) and the switching end of a switch (7) corresponding to the semiconductor refrigerating sheet (11).
  5. 5. The semiconductor temperature-changing cup cover according to claim 3, wherein the bottom surface of the heat insulation shell (10) is an inclined surface, and the semiconductor refrigerating sheet (11) is arranged on the inclined surface.
  6. 6. The semiconductor temperature-changing cup cover according to claim 1, wherein the change-over switch (7) comprises a rotating piece (14) which is elastically connected in the mounting cavity (6) in a rotating mode, two ends of the rotating piece (14) are respectively provided with a contact piece (15), the contact pieces (15) are provided with first connecting points (16), the inner wall of the mounting cavity (6) is provided with second connecting points (17) corresponding to the first connecting points (16) on the side, and the second connecting points (17) are connected with the corresponding heating assembly (2) or refrigerating assembly (3).
  7. 7. The semiconductor temperature-changing cup cover of claim 6, wherein the contact trigger mechanism (8) comprises a connecting hole (20) arranged at the upper part and the lower part of the cup cover body (1), a transmission rod group (21) which is elastically and movably connected is arranged in the connecting hole (20), the inner end of the transmission rod group (21) corresponds to the contact piece (15), and the outer end of the transmission rod group (21) protrudes out of the surface of the cup cover body (1).
  8. 8. The semiconductor temperature-changing cup cover of claim 7, wherein the connecting hole (20) comprises a pressing hole (18) arranged on the upper surface and the lower surface of the cup cover body (1), an inner hole (24) transversely arranged is connected to the inner end of the pressing hole (18), the transmission rod group (21) comprises a pressing block (19) arranged in the pressing hole (18) and a transmission rod (25) arranged in the inner hole (24), one end of the transmission rod (25) corresponds to the end part of the pressing block (19), the other end of the transmission rod (25) corresponds to the contact piece (15), and the outer end of the pressing block (19) protrudes out of the surface of the cup cover body (1).
  9. 9. The semiconductor temperature-changing cup cover according to claim 1, wherein the cup cover body (1) is provided with openings (22), and rubber flaps (23) which are uniformly distributed are arranged in the openings (22).

Description

Semiconductor variable-temperature cup cover Technical Field The invention relates to the field of vehicle-mounted appliances, in particular to a semiconductor variable-temperature cup cover. Background Along with the gradual popularization of automobiles, the demands of people on vehicle-mounted functions are gradually increased, in order to solve the problems that in summer, drinks are easy to heat up and in winter, hot drinks are fast cooled down, a plurality of vehicle-mounted devices for fast heating or cooling are appeared on the market, for example, chinese patent publication No. CN202827248U discloses a vehicle-mounted refrigerating and heating cup stand and a vehicle, and particularly the vehicle-mounted refrigerating and heating cup stand and the vehicle comprise an inner shell, an outer shell, a PN junction couple group and other parts, and a bearing cup body is heated or cooled through the Peltier effect of the PN junction couple group. Disclosure of Invention The invention aims to provide a semiconductor variable-temperature cup cover. According to the invention, the cup cover body is used as a carrier to arrange the heating component and the refrigerating component which are protruded, so that after the cup cover body is buckled, liquid can be automatically heated or refrigerated, energy loss is reduced, and the cup cover body can move along with the cup body, so that the use flexibility is improved. The semiconductor variable-temperature cup cover comprises a cup cover body, wherein a heating component and a refrigerating component which are arranged in a protruding mode are respectively arranged on the top surface and the bottom surface of the cup cover body, a power supply line is connected to the side portion of the cup cover body and is electrically connected with the heating component and the refrigerating component, a mounting cavity is arranged in the cup cover body, a change-over switch is arranged in the mounting cavity, two change-over ends of the change-over switch are respectively electrically connected with the heating component and the refrigerating component, contact trigger mechanisms are arranged on the upper side and the lower side of the cup cover body, and the trigger ends of the contact trigger mechanisms are correspondingly arranged with the change-over switch and drive the change-over switch to be conducted. In the semiconductor variable-temperature cup cover, the heating assembly comprises a heating rod arranged on the top surface of the cup cover body, and the electrified end of the heating rod is connected with the power supply line and the corresponding switching end of the switching switch. In the semiconductor temperature-changing cup cover, the refrigerating assembly comprises a heat insulation shell arranged on the bottom surface of the cup cover body, a semiconductor refrigerating piece is arranged at the bottom of the heat insulation shell, a heat absorption surface of the semiconductor refrigerating piece is arranged downwards, a heat release surface of the semiconductor refrigerating piece faces to an inner cavity of the heat insulation shell, and a power-on end of the semiconductor refrigerating piece is connected with corresponding switching ends of the power supply line and the switching switch. In the semiconductor variable-temperature cup cover, the guide fan is arranged in the cup cover body, the top surface of the cup cover body is provided with the radiating hole opposite to the air outlet side of the guide fan, the air inlet side of the guide fan faces the inner cavity of the heat insulation shell, and the electrifying end of the guide fan is connected with the switchover end of the switchover switch corresponding to the power supply line and the semiconductor refrigeration piece. In the semiconductor temperature-changing cup cover, the bottom surface of the heat insulation shell is an inclined surface, and the semiconductor refrigerating sheet is arranged on the inclined surface. In the semiconductor temperature-changing cup cover, the change-over switch comprises a rotating piece which is elastically connected in the mounting cavity in a rotating mode, contact pieces are arranged at two ends of the rotating piece, first connecting points are arranged on the contact pieces, second connecting contacts corresponding to the first connecting points on the side are arranged on the inner wall of the mounting cavity, and the second connecting contacts are connected with corresponding heating assemblies or refrigerating assemblies. In the semiconductor temperature-changing cup cover, the contact trigger mechanism comprises a connecting hole arranged at the upper part and the lower part of the cup cover body, a transmission rod group which is elastically and movably connected is arranged in the connecting hole, the inner end of the transmission rod group corresponds to the contact piece, and the outer end of the transmission rod group protrudes out of the s