CN-121987200-A - Pain relieving method and device for finger peripheral blood collection

CN121987200ACN 121987200 ACN121987200 ACN 121987200ACN-121987200-A

Abstract

The invention provides an analgesic method and device for finger peripheral blood collection, and relates to the technical field of medical appliances. The core working part of the device comprises a low-temperature part, a semiconductor refrigerator, a heat dissipation part and a control part. The semiconductor refrigerator is utilized to generate a low-temperature effect on the low-temperature part, when the finger of a person contacts the low-temperature part, the low-temperature part can generate a blocking effect on nerves at the finger, so that the pain relieving effect is realized in the subsequent finger peripheral blood collecting process. The invention avoids waiting time for pain relieving by using the gunpowder when collecting the peripheral blood of the finger, does not need consumable materials, and is more convenient and quicker to operate.

Inventors

CHENG XIANKUN

Assignees

重庆地博激光设备有限公司

Dates

Publication Date: 20260508
Application Date: 20241103

Claims (5)

1. An analgesic device for collecting finger peripheral blood is characterized by comprising a low-temperature part (1), a semiconductor refrigerator (2), a heat dissipation part (3) and a control part (4); The low-temperature part is macroscopically seen, under the action of the semiconductor refrigerator, the internal heat of the low-temperature part is conducted to the heat dissipation part, and when the finger of a person contacts the low-temperature part, the low-temperature part has a blocking effect on nerves at the finger, so that the pain relieving effect is realized in the subsequent finger peripheral blood collection process; The semiconductor refrigerator utilizes the Peltier effect of semiconductor materials, and under the action of the control part, the upper surface and the lower surface of the semiconductor refrigerator generate temperature difference, and macroscopically, heat is transferred from the low-temperature part to the heat dissipation part; the heat dissipation part is used for receiving and volatilizing the heat of the low-temperature part, so that the semiconductor refrigerator can effectively refrigerate; the control part is used for controlling the refrigerating capacity of the semiconductor refrigerator.
2. The device for analgesia according to claim 1, wherein said control unit controls the device in a closed-loop manner based on temperature feedback provided by a temperature sensor placed in the low-temperature unit, and controls the device in an open-loop manner by directly outputting constant cooling power from the control unit.
3. The device for analgesia during finger tip blood collection according to claim 1, wherein the control mode of the refrigerating output of the semiconductor refrigerator is a mode of controlling the current in the semiconductor refrigerator, a time interval of controlling the on/off of the current in the semiconductor refrigerator, or a time interval of simultaneously controlling the current in the semiconductor refrigerator and the on/off of the current.
4. The analgesic device as set forth in claim 1 wherein said heat dissipation means of said heat dissipation portion is configured to dissipate heat by air cooling or water cooling.
5. The device for analgesia during blood collection of a finger tip according to claim 1, wherein one set of low temperature parts and a plurality of sets of low temperature parts can be arranged in the device, when the plurality of sets of low temperature parts exist, the same temperature can be set for each low temperature part, different temperatures can be set for each low temperature part, one set of heat dissipation part and a plurality of sets of heat dissipation parts can be arranged, heat of the plurality of sets of low temperature parts can be conducted to one set of heat dissipation part, and therefore concentrated heat dissipation is achieved, and the plurality of sets of heat dissipation parts are respectively matched with the plurality of sets of low temperature parts, and therefore separate heat dissipation is achieved.

Description

Pain relieving method and device for finger peripheral blood collection Technical Field The invention belongs to the technical field of medical instruments, and particularly relates to an analgesic method and device for finger peripheral blood collection. Background The finger peripheral blood collection is the most commonly used blood test means because of convenient blood collection, small blood consumption and rapid measurement. However, the pain is felt in the collecting process, especially when the peripheral blood of the infant is collected, the infant is not matched with the infant to complete the collection due to the fear of the infant, so that the inconvenience on work is brought to operators, and the blood collecting speed is slowed down. The traditional pain relieving method is to apply the gunpowder to the tip of the finger, and then to perform blood sampling operation after three minutes, thus the time delay is longer and the pain relieving effect is general. Therefore, how to conveniently, rapidly and effectively ease pain during the collection of the peripheral blood of the finger becomes a problem to be solved. Disclosure of Invention Aiming at the defects of the prior art, the invention aims to provide a convenient, quick and good-effect pain relieving method and device for finger peripheral blood collection. The core working part of the device comprises a low-temperature part (1), a semiconductor refrigerator (2), a heat dissipation part (3) and a control part (4); The low-temperature part is macroscopically seen, under the action of the semiconductor refrigerator, the internal heat of the low-temperature part is conducted to the heat dissipation part, and when the finger of a person contacts the low-temperature part, the low-temperature part has a blocking effect on nerves at the finger, so that the pain relieving effect is realized in the subsequent finger peripheral blood collection process; The semiconductor refrigerator utilizes the Peltier effect of semiconductor materials, and under the action of the control part, the upper surface and the lower surface of the semiconductor refrigerator generate temperature difference, and macroscopically, heat is transferred from the low-temperature part to the heat dissipation part; the heat dissipation part is used for receiving and volatilizing the heat of the low-temperature part, so that the semiconductor refrigerator can effectively refrigerate; the control part is used for controlling the refrigerating capacity of the semiconductor refrigerator; Optionally, the control mode of the control part can realize closed-loop control according to temperature feedback provided by a temperature sensor arranged in the low-temperature part, and can also realize open-loop control by directly outputting constant refrigeration power by the control part. The open loop control structure is simple, but the closed loop control can lead the temperature control to be more accurate, so when no other special conditions exist, the closed loop control is preferentially used. Optionally, the control mode of the refrigerating output of the semiconductor refrigerator may be to control the current in the semiconductor refrigerator, or may be to control the time interval of the on-off of the current in the semiconductor refrigerator, or may be to control the current in the semiconductor refrigerator and the time interval of the on-off of the current at the same time. The control mode of combining the current magnitude and the current on-off time interval in the semiconductor refrigerator can enable the semiconductor refrigerator to quickly refrigerate, and meanwhile, the temperature control precision can be ensured. Optionally, the heat dissipation mode of the heat dissipation part may be air cooling heat dissipation or water cooling heat dissipation. In order to make the whole set of device structure more compact, generally adopt the mode of forced air cooling heat dissipation, but when the semiconductor refrigerator quantity of erection on the radiating part is great, also can adopt the mode of water-cooling heat dissipation, can increase the heat dissipation capacity like this. Optionally, there may be one set of low-temperature part or multiple sets of low-temperature parts in the device, when there are multiple sets of low-temperature parts, each low-temperature part may set the same temperature, or may set different temperatures, there may be one set of heat dissipation part, or there may be multiple sets of heat dissipation parts, and heat of the multiple sets of low-temperature parts may be conducted to one set of heat dissipation part, so as to implement concentrated heat dissipation, or the multiple sets of heat dissipation parts may be respectively matched with the multiple sets of low-temperature parts, so as to implement separate heat dissipation. Finger-shaped bayonets with different sizes are arranged on different low-temperature parts, so that one machine