CN-121988491-A - Dispensing method

Abstract

A dispensing method relates to the technical field of semiconductor manufacturing and comprises the steps of providing a substrate, coating glue on the surface of the substrate along a preset dispensing path, wherein the dispensing path comprises a plurality of sections of dispensing sections, at least one section of curve section is arranged in the plurality of sections of dispensing sections, at least part of dispensing path comprises a part without repeated dispensing, and a dispensing starting point and a dispensing end point of the dispensing path are positioned at different positions on the surface of the substrate. Because the dispensing process of the curve section only needs to accelerate and decelerate the dispensing nozzle for 1 time, the multi-section dispensing section at least comprises one curve section, so that the dispensing speed can be improved, and the dispensing time is shortened. Meanwhile, the part for reducing repeated dispensing in the dispensing path can discard redundant repeated dispensing so as to shorten the dispensing time. In addition, the glue dispensing starting point and the glue dispensing end point of the glue dispensing path are arranged at different positions on the surface of the substrate, so that more glue can be prevented from being concentrated at the glue dispensing end point, and further when the glue tail is broken at the glue dispensing end point, the tail breaking time is shortened.

Inventors

• Lin Jugan
• Lin weiye
• WU ZIFENG

Assignees

• 奥芯明半导体设备技术(上海)有限公司

Dates

Publication Date

20260508

Application Date

20241107

Claims (20)

1. 1. A method of dispensing, comprising: Providing a substrate; Coating glue on the surface of the substrate along a preset dispensing path, wherein, The dispensing path comprises a plurality of sections of dispensing sections, wherein at least one section of curve section is included in the plurality of sections of dispensing sections, and at least part of the dispensing path comprises a part which does not repeat dispensing; and the dispensing start point and the dispensing end point of the dispensing path are positioned at different positions on the surface of the substrate.
2. 2. The dispensing method of claim 1, wherein the curvilinear path section does not include a portion that repeats dispensing.
3. 3. The dispensing method of claim 1, wherein the plurality of sections of dispensing sections are connected end-to-end in sequence.
4. 4. The dispensing method of claim 1, wherein the dispensing path comprises a first portion, a second portion, and a third portion connected in sequence, wherein the first portion and the third portion comprise the curvilinear section.
5. 5. The dispensing method of claim 4, wherein the first portion and the third portion are axisymmetrically distributed, and wherein the first portion and the third portion are axisymmetrically paths, respectively.
6. 6. The dispensing method of claim 4, wherein the first portion and the third portion comprise a first dispensing section, a second dispensing section, and a third dispensing section that are sequentially connected, wherein the first dispensing section and the third dispensing section are linear sections, the second dispensing section is the curved section, the third dispensing section of the first portion is connected to one end of the second portion, and the first dispensing section of the third portion is connected to the other end of the second portion.
7. 7. The method of dispensing of claim 6, wherein the first and third dispensing sections are axisymmetrically distributed and the second dispensing section is an axisymmetric path.
8. 8. The method of dispensing of claim 6, wherein the first dispensing section is an acceleration section, the second dispensing section is a constant speed section, and the third dispensing section is a deceleration section.
9. 9. The method of dispensing of claim 8, wherein the dispensing nozzle initiates the dispensing of the first dispensing section at an initial speed of 0, wherein the dispensing nozzle accelerates to a first speed after the dispensing of the first dispensing section is completed, wherein the dispensing nozzle completes the dispensing of the second dispensing section at the first speed, wherein the dispensing nozzle initiates the dispensing of the third dispensing section at the first speed, and wherein the dispensing nozzle decelerates to 0 after the dispensing of the third dispensing section is completed.
10. 10. The method of dispensing of claim 9, wherein the first speed is determined based on acceleration of the dispensing nozzle in a first direction and a second direction, the first direction being perpendicular to the second direction, and a length and a direction of the first dispensing section.
11. 11. The method of dispensing as set forth in claim 9, wherein said dispensing nozzle completes dispensing of said first dispensing section at a constant acceleration and said dispensing nozzle completes dispensing of said third dispensing section at a constant deceleration.
12. 12. The dispensing method of claim 10, wherein the second dispensing section is a circular arc section and a radius of the second dispensing section is determined based on acceleration of the dispensing nozzle in the first direction and the second direction.
13. 13. The method of dispensing of claim 12, wherein the second dispensing section is tangent to the first dispensing section and the third dispensing section, respectively.
14. 14. The method of dispensing of claim 6, wherein the second portion includes a fourth dispensing section, the fourth dispensing section being a straight section.
15. 15. The method of claim 14, wherein the fourth dispensing section comprises a first sub-dispensing section and a second sub-dispensing section connected in sequence, wherein the first sub-dispensing section is an acceleration section and the second sub-dispensing section is a deceleration section.
16. 16. The method of dispensing of claim 15, wherein the first sub-dispensing section is coupled to the third dispensing section of the first portion and includes a portion for repeating dispensing, and wherein the second sub-dispensing section is coupled to the first dispensing section of the third portion and includes a portion for repeating dispensing.
17. 17. The method of dispensing of claim 15, wherein the dispensing nozzle initiates the dispensing of the first sub-dispensing section at an initial speed of 0, wherein the dispensing nozzle accelerates to a second speed after the dispensing of the first sub-dispensing section is completed, wherein the dispensing nozzle initiates the dispensing of the second sub-dispensing section at the second speed, and wherein the dispensing nozzle decelerates to 0 after the dispensing of the second sub-dispensing section is completed.
18. 18. The dispensing method of claim 4, wherein each end point of the first portion and the third portion corresponds to each corner position of a chip bonded to the substrate, respectively.
19. 19. The dispensing method of claim 4 wherein the pattern of movement of the dispensing nozzle in said first portion and said third portion is determined by at least one of the position, velocity, acceleration, jitter, shock and transients of said dispensing nozzle.
20. 20. The dispensing method of claim 4, wherein when a ratio of length to width of a chip to be bonded to the substrate is not 1:1, dispensing time required for a first selectable dispensing path and a second selectable dispensing path is estimated, and dispensing operation is performed by selecting the first selectable dispensing path or the second selectable dispensing path according to the estimated dispensing time, wherein the first portion and the third portion of the first selectable dispensing path run in a width direction of the chip, and the first portion and the third portion of the second selectable dispensing path run in a length direction of the chip.

Description

Dispensing method Technical Field The invention relates to the technical field of semiconductor manufacturing, in particular to a dispensing method. Background The die bonder is a device for semiconductor packaging processes and has the main function of precisely fixing a chip on a substrate (including a lead frame) to perform physical bonding between the chip and the substrate. The die bonder is one of the key devices in the field of semiconductor manufacturing, and is widely applied to the production process of various electronic elements. In the electronic packaging process, the die bonder applies an adhesive on a designated position of the substrate through dispensing operation, and then applies certain pressure when placing the chip through the pressure control system, so that good contact between the chip and the substrate is ensured, and the chip is firmly bonded on the substrate. When the current die bonder performs the dispensing operation, a large number of redundant repeated dispensing processes exist, so that the time required by the whole dispensing operation can be increased. Meanwhile, in the existing glue dispensing operation, the starting point and the finishing point of the glue dispensing path are usually arranged at the same position, so that a large amount of glue is concentrated at the position of the glue dispensing finishing point, the difficulty of breaking the glue tail is increased, and the time required for breaking the glue tail is increased. Disclosure of Invention The invention solves the technical problem of providing a dispensing method to reduce the time for dispensing and reduce the difficulty and the time for breaking the tail after dispensing. In order to solve the technical problems, the technical scheme of the invention provides a dispensing method, which comprises the steps of providing a substrate, coating glue on the surface of the substrate along a preset dispensing path, wherein the dispensing path comprises a plurality of sections of dispensing sections, at least one section of curve section is included in the plurality of sections of dispensing sections, at least part of the dispensing path comprises a part without repeated dispensing, and a dispensing starting point and a dispensing end point of the dispensing path are positioned at different positions on the surface of the substrate. Optionally, the curve section does not include a portion for repeating dispensing. Optionally, the multiple sections of glue dispensing sections are connected end to end in sequence. Optionally, the dispensing path comprises a first part, a second part and a third part which are sequentially connected, wherein the first part and the third part comprise the curve section. Optionally, the first portion and the third portion are axisymmetrically distributed, and the first portion and the third portion are axisymmetric paths respectively. The first part and the third part respectively comprise a first dispensing section, a second dispensing section and a third dispensing section which are sequentially connected, wherein the first dispensing section and the third dispensing section are linear sections, the second dispensing section is the curve section, the third dispensing section of the first part is connected with one end of the second part, and the first dispensing section of the third part is connected with the other end of the second part. Optionally, the first dispensing section and the third dispensing section are axisymmetric distribution, and the second dispensing section is an axisymmetric path. Optionally, the first dispensing section is an acceleration section, the second dispensing section is a constant speed section, and the third dispensing section is a deceleration section. Optionally, the dispensing nozzle starts the dispensing action of the first dispensing section at an initial speed of 0, the moving speed of the dispensing nozzle is accelerated to a first speed after the dispensing action of the first dispensing section is completed, the dispensing nozzle completes the dispensing action of the second dispensing section at the first speed, the dispensing nozzle starts the dispensing action of the third dispensing section at the first speed, and the moving speed of the dispensing nozzle is decelerated to 0 after the dispensing action of the third dispensing section is completed. Optionally, the first speed is determined based on acceleration of the dispensing nozzle in a first direction and a second direction, and a length and a direction of the first dispensing section, and the first direction and the second direction are perpendicular to each other. Optionally, the dispensing nozzle completes the dispensing action of the first dispensing section with constant acceleration, and the dispensing nozzle completes the dispensing action of the third dispensing section with constant deceleration. Optionally, the second dispensing section is a circular arc section, and a ra