CN-121988492-A - Dispensing method comprising a tail-breaking process

Abstract

A dispensing method comprising a dispensing tail breaking process relates to the technical field of semiconductor manufacturing and comprises the steps of providing a substrate, controlling a dispensing nozzle to move along a preset dispensing path, controlling the dispensing nozzle to stop dispensing and controlling the dispensing nozzle to rise towards a direction away from the substrate, controlling the dispensing nozzle to move along the dispensing path, enabling the dispensing path to comprise a first dispensing section and a second dispensing section, controlling the dispensing nozzle to gradually fall towards a direction close to the substrate in the process of moving in the first dispensing section, controlling the dispensing nozzle to move along the second dispensing section, and controlling the dispensing nozzle to gradually rise towards the direction away from the substrate in the process of moving in the second dispensing section. After the dispensing path is finished, the dispensing path is additionally arranged, and the dispensing nozzle at the first dispensing section gradually faces to the direction close to the substrate, so that glue remained on the dispensing nozzle can be in a tiled trend to be adhered to the first dispensing section, the residual glue on the dispensing nozzle is reduced, and the influence on next dispensing is reduced.

Inventors

• Lin weiye
• WU ZIFENG

Assignees

• 奥芯明半导体设备技术(上海)有限公司

Dates

Publication Date

20260508

Application Date

20241107

Claims (20)

1. 1. A dispensing method including a tail break process of dispensing, comprising: Providing a substrate; Controlling the dispensing nozzle to move along a preset dispensing path so as to coat glue on the surface of the substrate; after the dispensing nozzle completes the dispensing path, controlling the dispensing nozzle to stop dispensing and controlling the dispensing nozzle to rise towards a direction away from the substrate; after the dispensing nozzle rises to a preset height, controlling the dispensing nozzle to move along at least 1 section of dispensing path; The glue spreading path comprises a first glue spreading section and a second glue spreading section, wherein, In the process of controlling the dispensing nozzle to move along the first dispensing section, controlling the dispensing nozzle to gradually descend towards the direction close to the substrate; after the dispensing nozzle completes the first glue spreading section, controlling the dispensing nozzle to move along the second glue spreading section; And in the process of controlling the dispensing nozzle to move along the second dispensing section, controlling the dispensing nozzle to gradually rise towards the direction far away from the substrate.
2. 2. A dispensing method comprising a tail break process according to claim 1, wherein the dispensing path and the dispensing path are connected end to end.
3. 3. A dispensing method comprising a tail break process according to claim 1, wherein the dispensing path and the dispensing path have repeating portions.
4. 4. The dispensing method including a tail break process of claim 1, wherein the dispensing path and the dispensing path have no repeating portions.
5. 5. The dispensing method including a tail break process according to claim 1, wherein after the dispensing nozzle completes the dispensing path, controlling the dispensing nozzle to stop ascending in a direction away from the substrate, and wherein a first distance between the dispensing nozzle and the surface of the substrate is 150um to 200um.
6. 6. The dispensing method including a tail break process of claim 5, wherein said first spacing is determined based on an inner diameter of said dispensing nozzle, an extrusion vacuum force applied during dispensing, and a consistency of said glue.
7. 7. The dispensing method including a tail break process according to claim 1, wherein a second distance between the dispensing nozzle and the surface of the substrate is 50um to 100um after the dispensing nozzle is controlled to gradually descend toward a direction approaching the substrate and stop in a process of controlling the dispensing nozzle to move along the first dispensing section.
8. 8. The dispensing method including a tail break process according to claim 1, wherein the dispensing nozzle is accelerated and then decelerated in a movement mode of the first dispensing section, and a speed of the dispensing nozzle is reduced to 0 after a dispensing action of the first dispensing section is completed.
9. 9. The dispensing method including a tail break process according to claim 1, wherein the movement pattern of the dispensing nozzle is accelerated and then decelerated during the second dispensing section, and the speed of the dispensing nozzle is reduced to 0 after the dispensing action of the second dispensing section is completed.
10. 10. The dispensing method including a tail break process according to claim 1, wherein a movement path of the dispensing nozzle in the first dispensing section is a straight line having an inclination angle with a plane of the substrate.
11. 11. The dispensing method including a tail break process according to claim 1, wherein a movement path of the dispensing nozzle in the second dispensing section is a straight line having an inclination angle with a plane of the substrate.
12. 12. The dispensing method including a tail break process of claim 1 wherein a movement pattern of the dispensing nozzle in performing the first and second dispensing sections is determined by at least one of a position, a speed, an acceleration, a shake, an impact, and a transient of the dispensing nozzle.
13. 13. The method of dispensing of claim 1, wherein the dispensing path includes a plurality of dispensing segments, at least one of the plurality of dispensing segments includes a curved segment, and at least a portion of the dispensing path includes a portion that does not repeat dispensing.
14. 14. The dispensing method including a tail break process of claim 1, wherein a dispensing start point and a dispensing end point of the dispensing path are located at different positions on the substrate surface.
15. 15. The dispensing method including a tail-end process of claim 13, wherein the plurality of sections of dispensing sections are connected end-to-end in sequence.
16. 16. The dispensing method comprising a tail break process of claim 15, wherein the dispensing path comprises a first portion, a second portion, and a third portion connected in sequence, wherein the first portion and the third portion comprise the curvilinear section.
17. 17. The method of dispensing a tail including a dispensing process of claim 16, wherein the first portion and the third portion include a first dispensing section, a second dispensing section, and a third dispensing section, respectively, connected in sequence, wherein the first dispensing section and the third dispensing section are straight sections, the second dispensing section is the curved section, the third dispensing section of the first portion is connected to one end of the second portion, and the first dispensing section of the third portion is connected to the other end of the second portion.
18. 18. The method of dispensing of claim 17, wherein the first dispensing section is an acceleration section, the second dispensing section is a constant speed section, and the third dispensing section is a deceleration section.
19. 19. The dispensing method comprising a tail-out process of claim 16, wherein each end point of the first portion and the third portion corresponds to a respective corner location of a chip bonded to the substrate.
20. 20. The dispensing method comprising a tail break process of claim 16 wherein a pattern of movement of a dispensing nozzle in said first portion and said third portion is determined by at least one of a position, a velocity, an acceleration, a shake, an impact, and a transient of said dispensing nozzle.

Description

Dispensing method comprising a tail-breaking process Technical Field The invention relates to the technical field of semiconductor manufacturing, in particular to a dispensing method comprising a dispensing tail breaking process. Background The die bonder is a device for semiconductor packaging processes and has the main function of precisely fixing a chip on a substrate (including a lead frame) to perform physical bonding between the chip and the substrate. The die bonder is one of the key devices in the field of semiconductor manufacturing, and is widely applied to the production process of various electronic elements. In the electronic packaging process, the die bonder applies an adhesive on a designated position of the substrate through dispensing operation, and then applies certain pressure when placing the chip through the pressure control system, so that good contact between the chip and the substrate is ensured, and the chip is firmly bonded on the substrate. At present, when the glue tail is broken during the glue dispensing operation of the die bonder, more glue remains on the glue dispensing nozzle, and the next glue dispensing effect is affected after the residual glue is solidified. Disclosure of Invention The invention solves the technical problem of providing a glue dispensing method comprising a glue smearing and tail breaking process so as to reduce residual glue on a glue dispensing nozzle. The technical scheme includes that a substrate is provided, a dispensing nozzle is controlled to move along a preset dispensing path so as to coat glue on the surface of the substrate, the dispensing nozzle is controlled to stop dispensing and to ascend in a direction away from the substrate after the dispensing nozzle completes the dispensing path, the dispensing nozzle is controlled to move along at least 1 section of dispensing path after the dispensing nozzle ascends to a preset height, the dispensing path comprises a first dispensing section and a second dispensing section, the dispensing nozzle is controlled to gradually descend in a direction close to the substrate in the process of controlling the dispensing nozzle to move along the first dispensing section, the dispensing nozzle is controlled to move along the second dispensing section after the dispensing nozzle completes the first dispensing section, and the dispensing nozzle is controlled to gradually ascend in the direction away from the substrate in the process of controlling the dispensing nozzle to move along the second dispensing section. Optionally, the dispensing path and the dispensing path are connected end to end. Optionally, the dispensing path and the dispensing path have repeating portions. Optionally, the dispensing path and the dispensing path have no repeating portions. Optionally, after the dispensing nozzle completes the dispensing path, controlling the dispensing nozzle to stop ascending towards a direction away from the substrate, and then, the first distance between the dispensing nozzle and the surface of the substrate is 150um to 200um. Optionally, the first interval is determined based on the inner diameter of the dispensing nozzle, the extrusion vacuum force applied in the dispensing process and the viscosity of the glue. Optionally, in the process of controlling the dispensing nozzle to move along the first dispensing section, controlling the dispensing nozzle to gradually descend towards the direction close to the substrate to stop, and then controlling the second distance between the dispensing nozzle and the surface of the substrate to be 50um to 100um. Optionally, the movement mode of the first glue dispensing section of the dispensing nozzle is acceleration and then deceleration, and after the glue dispensing action of the first glue dispensing section is completed, the speed of the dispensing nozzle is reduced to 0. Optionally, the movement mode of the second glue dispensing section is acceleration and then deceleration, and after the glue dispensing action of the second glue dispensing section is completed, the speed of the glue dispensing nozzle is reduced to 0. Optionally, the motion path of the dispensing nozzle at the first dispensing section is a straight line with a certain inclination angle with the plane of the substrate. Optionally, the motion path of the dispensing nozzle at the second dispensing section is a straight line with a certain inclination angle with the plane of the substrate. Optionally, the movement pattern of the dispensing nozzle in performing the first and second glue application sections is determined by at least one of the position, speed, acceleration, shake, shock and transient of the dispensing nozzle. Optionally, the dispensing path includes a plurality of dispensing sections, at least one of the plurality of dispensing sections includes a curved section, and at least a portion of the dispensing path includes a portion that does not repeat dispensing. Optionally, the dispensing