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CN-121988505-A - Glue spraying process cavity and substrate processing equipment

CN121988505ACN 121988505 ACN121988505 ACN 121988505ACN-121988505-A

Abstract

The application provides a glue spraying process cavity and substrate processing equipment. The glue spraying process cavity comprises a cavity, a substrate chuck and a collecting area which is annularly arranged on the periphery of the chuck. The substrate chuck includes a body region and an annular skirt extending outwardly from an edge thereof. The upper surface of the annular skirt is configured as an inclined surface sloping downwards towards its peripheral edge and the peripheral edge of the annular skirt extends above the collection zone in horizontal projection so that the waste liquid guided by the inclined surface can pass over the gap between the chuck and the collection zone and drip directly into the collection zone. According to the technical scheme, the structure of the substrate chuck is optimized, so that the waste liquid directly enters the collecting area after crossing the key gap under the guidance of gravity. The problem of chamber pollution caused by waste liquid entering a gap can be avoided from the source, the thoroughness of waste liquid collection is ensured, and the cleanliness of the process environment is improved.

Inventors

  • HU ENZHAO
  • LIU WENJIE

Assignees

  • 宁波润华全芯微电子设备有限公司

Dates

Publication Date
20260508
Application Date
20251231

Claims (13)

  1. 1. The utility model provides a spout gluey technology cavity which characterized in that includes: A cavity; a substrate chuck disposed in the cavity for carrying a substrate, and The collecting area is annularly arranged on the periphery of the substrate chuck and is used for collecting waste liquid; Wherein: the substrate chuck includes a body region and an annular skirt extending outwardly from an edge of the body region; the upper surface of the annular skirt is configured as an inclined surface inclined downward toward the outer peripheral edge thereof; the peripheral edge of the annular skirt extends above the collection zone in a horizontal projection so that the waste liquid guided by the inclined surface during the process can pass over the gap between the substrate chuck and the collection zone and drip directly into the collection zone.
  2. 2. The glue spray process chamber of claim 1, wherein the collection area comprises an annular flow guiding area and an annular collection trough, wherein the flow guiding area is disposed between the substrate chuck and the collection trough, and wherein the annular skirt of the substrate chuck is higher than the flow guiding area in a vertical height, and the flow guiding area is higher than a trough bottom of the collection trough.
  3. 3. The glue spray process chamber of claim 2, wherein the upper surface of the flow directing region is configured as a sloped surface sloped toward the collection trough or wherein the peripheral edge of the flow directing region extends above the collection trough in a horizontal projection.
  4. 4. The glue spray process chamber of claim 2, wherein the trough bottom of the collection trough is configured to have a height varying configuration to slope toward at least one local nadir and a drain is provided at the at least one local nadir of the trough bottom.
  5. 5. The glue spraying process chamber of claim 1, wherein the main body region of the substrate chuck has a flat bearing surface for contacting the entire bottom surface of the substrate, and a vacuum adsorption channel is disposed inside the main body region for adsorbing and fixing the substrate via the bearing surface.
  6. 6. The glue spraying process chamber of claim 1, wherein the inclined surface of the annular skirt is a continuous curved surface or a conical surface formed by a plurality of planar segments, or wherein the annular skirt is a detachable structure.
  7. 7. The glue spray process chamber of claim 2, wherein an exhaust channel is provided on a side wall of the collection tank.
  8. 8. The glue spray process chamber of claim 7, further comprising: An annular step surface formed on the inner wall of the collecting tank, and The annular guide plate is arranged on the annular step surface, and the front surface of the annular guide plate forms the guide area; wherein, exhaust passage forms in the bottom of annular guide plate with the junction of annular step face.
  9. 9. The glue spraying process chamber of claim 8, wherein an annular groove is formed in the back surface of the annular deflector, and the annular groove and the annular step surface jointly enclose a circumferentially through exhaust gap or circumferentially distributed exhaust holes.
  10. 10. The glue spray process chamber of claim 9, further comprising a main exhaust structure disposed at a bottom of the chamber, wherein an exhaust port of the main exhaust structure is covered by the annular deflector.
  11. 11. The glue spraying process chamber of claim 10, wherein the annular deflector is of a removable construction or wherein the front face of the annular deflector has a lyophobic surface.
  12. 12. The glue dispensing process chamber of claim 9, further comprising a control system configured to dynamically adjust the discharge rate of the discharge air channel based on the rotational speed of the substrate chuck.
  13. 13. A substrate processing apparatus comprising the glue spray process chamber of any one of claims 1 to 12.

Description

Glue spraying process cavity and substrate processing equipment Technical Field The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a glue spraying process cavity and substrate processing equipment. Background In the semiconductor process, the photolithography process is a key element, and the photoresist coating, i.e., the photoresist spraying process, is an initial step of photolithography. The process is generally carried out in a special glue spraying process cavity, a substrate is placed on a substrate chuck capable of rotating at a high speed, and the dropped photoresist is thrown off on the surface of the substrate by centrifugal force to form a uniform film. During the high-speed spin coating process, a large amount of redundant photoresist can be spun off from the edge of the substrate, and simultaneously the process can use a solvent for washing, so that waste liquid formed by the photoresist and the solvent is required to be effectively collected and discharged to prevent the cavity and the substrate from being polluted. Current glue spray process chambers typically provide an annular collection cup around the substrate chuck to receive the waste liquid. However, to ensure that the chuck can rotate without interference, there must be a physical gap between it and the collection cup. In prior designs, the edge of the substrate chuck did not accurately direct the flow of the waste stream. When the substrate rotates at a high speed, part of the waste liquid can pass through the gap and enter the collecting cup, but when the chuck decelerates at a low speed or the process is finished, the waste liquid dropping from the edge of the substrate is easy to drop into the gap between the chuck and the collecting cup due to lack of enough horizontal speed. The waste liquid dropped into the gap can spread along the outer wall or the lower surface of the chuck or flow onto other parts below the cavity, and the granular pollutant is formed after drying and solidification. In the subsequent process, the particles may fall off due to air flow disturbance, and re-fly and adhere to the surface of the new substrate to form defects, which seriously affect the product yield. Therefore, how to solve the problem of dropping waste liquid into the gap structurally is a technical problem in the art. Disclosure of Invention The application provides a glue spraying process cavity and substrate processing equipment, which aim to solve the technical problems that waste liquid is not thoroughly collected and a cavity is easy to pollute in the prior art. The technical scheme of the invention provides a glue spraying process cavity, which comprises a cavity, a substrate chuck and a collecting area, wherein the substrate chuck is arranged in the cavity and is used for bearing a substrate, the collecting area is annularly arranged on the periphery of the substrate chuck and is used for collecting waste liquid, the substrate chuck comprises a main body area and an annular skirt part which extends outwards from the edge of the main body area, the upper surface of the annular skirt part is configured into an inclined surface which is inclined downwards towards the outer peripheral edge of the annular skirt part, and the outer peripheral edge of the annular skirt part extends to the upper side of the collecting area in a horizontal projection, so that the waste liquid guided by the inclined surface can pass through a gap between the substrate chuck and the collecting area in the process and directly drop into the collecting area. Preferably, the collecting area comprises an annular flow guiding area and an annular collecting groove, the flow guiding area is arranged between the substrate chuck and the collecting groove, and the annular skirt portion of the substrate chuck is higher than the flow guiding area in the vertical height, and the flow guiding area is higher than the groove bottom of the collecting groove. Preferably, the upper surface of the flow guiding region is configured as an inclined surface inclined towards the direction of the collecting tank, or the peripheral edge of the flow guiding region extends above the collecting tank in a horizontal projection. Preferably, the bottom of the collecting tank is configured to have a height-varying shape so as to be inclined toward at least one partial lowest point, and a drain port is provided at the at least one partial lowest point of the tank bottom. Preferably, the main body area of the substrate chuck is provided with a flat bearing surface for contacting with the whole bottom surface of the substrate, and a vacuum adsorption channel is arranged in the main body area so as to adsorb and fix the substrate through the bearing surface. Preferably, the inclined surface of the annular skirt is a continuous curved surface or a conical surface formed by a plurality of plane sections, or the annular skirt is a detachable structure