CN-121988564-A - Cleaning device and cleaning method

Abstract

The application relates to the field of semiconductor device manufacturing, in particular to a cleaning device and a cleaning method. The cleaning device is used for cleaning the nozzle and the cover body arranged on the periphery of the nozzle and comprises a cleaning tank for storing cleaning liquid, a first liquid inlet pipeline arranged on the cleaning tank and used for introducing the cleaning liquid into the cleaning tank, and at least one communication pipeline used for communicating a space, located above the liquid level, in the cover body with the outside of the cleaning tank so as to discharge air, located above the liquid level, in the cover body to the outside of the cleaning tank. In the application, in the process from the start of contacting the cleaning liquid to the lowering of the cover body to the preset position, the air positioned above the liquid level of the cleaning liquid in the cover body is discharged to the outside of the cleaning tank through the communication pipeline, so that the cover body can be lowered to the preset position, and when the cover body is positioned at the preset position, the cover body is soaked in the cleaning liquid as much as possible, thereby realizing the cleaning of the cover body and the nozzle.

Inventors

• WANG HUI
• DENG XINPING
• ZHANG FENGRONG

Assignees

• 盛美半导体设备(上海)股份有限公司

Dates

Publication Date

20260508

Application Date

20241105

Claims (18)

1. 1. A cleaning device for cleaning a nozzle and a cover body provided on the outer periphery of the nozzle, comprising: A cleaning tank for storing cleaning liquid; The first liquid inlet pipeline is arranged on the cleaning tank and is used for introducing cleaning liquid into the cleaning tank; and the communication pipeline is used for communicating the space above the liquid level of the cleaning liquid in the cover body with the outside of the cleaning tank so as to discharge the air above the liquid level in the cover body to the outside of the cleaning tank.
2. 2. The cleaning apparatus of claim 1, wherein an overflow port is provided in a sidewall of the cleaning tank for discharging a portion of the cleaning liquid out of the cleaning tank.
3. 3. The cleaning apparatus of claim 1, further comprising an overflow tank for receiving cleaning liquid overflowed from within the cleaning tank.
4. 4. The cleaning apparatus of claim 1, further comprising an exhaust power source connected to the at least one communication line for drawing air located above a liquid level within the enclosure to an exterior of the cleaning tank.
5. 5. The cleaning apparatus of claim 1, comprising at least two of the first liquid feed lines spaced around the nozzle.
6. 6. The cleaning apparatus defined in claim 1, comprising at least two of the communication lines spaced around the nozzle.
7. 7. The cleaning apparatus of claim 1, further comprising a first blow line disposed outside the cleaning tank for blowing a dry gas to an outer surface of the housing.
8. 8. The cleaning apparatus of claim 1, further comprising a second blow line for blowing dry gas toward an inner surface of the enclosure after the enclosure is raised to a predetermined height.
9. 9. The cleaning apparatus of claim 8, wherein the second air-blow line is connected to the at least one communication line, the at least one communication line including a first on-off valve, the second air-blow line including a second on-off valve, the first on-off valve and the second on-off valve being communicatively connected to a controller; the controller is configured to control the communication pipeline to discharge air above a liquid level in the cover body to the outside of the cleaning tank when the first switch valve is opened and control the second blowing pipeline to spray dry gas to the inner surface of the cover body and the nozzle surface through the at least one communication pipeline when the first switch valve is closed and the second switch valve is opened.
10. 10. The cleaning apparatus of claim 9, further comprising a second liquid feed line; one end of the second liquid inlet pipeline is higher than the preset liquid level of the cleaning liquid, the other end of the second liquid inlet pipeline is connected with an external cleaning liquid source, and the controller is further configured to control the second liquid inlet pipeline to spray the cleaning liquid to the inner surface of the upper part of the cover body and the surface of the nozzle when the cover body is at the preset position.
11. 11. The cleaning device of claim 8, further comprising a second liquid inlet pipeline connected to the at least one communication pipeline and in communication with a controller, the second air blowing pipeline being disposed within the housing, one end of the second air blowing pipeline being above a predetermined level of cleaning liquid, the other end of the second air blowing pipeline being in communication with an external air source; the controller is configured to control the second liquid inlet pipeline to spray cleaning liquid to the inner surface of the upper part of the cover body and the surface of the nozzle through the at least one communication pipeline when the cover body is at a preset position, and control the second air blowing pipeline to spray drying gas to the inner surface of the cover body and the surface of the nozzle after the cover body is lifted to a preset height.
12. 12. The cleaning apparatus defined in claim 11, wherein the second blow line is connected to the at least one communication line; the controller is further configured to control the second air-blowing line to spray drying gas through the at least one communication line toward the surface of the housing, the nozzle surface.
13. 13. The cleaning apparatus of claim 1, further comprising a common line, a second liquid inlet line, and a second blow line; one end of the common pipeline is higher than the preset liquid level of the cleaning liquid, and the second liquid inlet pipeline and the second air blowing pipeline are connected with the other end of the common pipeline and a controller; The controller is configured to control the second liquid inlet pipeline to spray cleaning liquid to the inner surface of the upper part of the cover body and the surface of the nozzle when the cover body is at a preset position, and control the second air blowing pipeline to spray drying gas to the inner surface of the cover body and the surface of the nozzle when the cover body is lifted to a preset height.
14. 14. The cleaning device of claim 1, wherein the liquid outlet of the first liquid inlet pipeline is higher than a preset liquid level of the cleaning liquid, and the first liquid inlet pipeline is further used for spraying the outer surface of the upper part of the cover body by introducing the cleaning liquid.
15. 15. A cleaning method, comprising: step S01, introducing cleaning liquid into the cleaning tank; and S02, controlling the cover body to descend, and discharging air positioned above the liquid level in the cover body by the communication pipeline in the process of starting to contact the cleaning liquid to descend to the preset position of the cleaning tank, so that the lower part of the cover body is soaked in the cleaning liquid.
16. 16. The cleaning method according to claim 15, wherein the cleaning liquid is sprayed onto the inner surface of the upper portion of the cover and the nozzle surface after the cover is immersed in the cleaning liquid.
17. 17. The cleaning method of claim 15, further comprising: step S03, lifting the cover body to a preset height, and blowing dry gas to the inner surface of the cover body.
18. 18. The cleaning method of claim 17, further comprising: And blowing the drying gas to the inner surface of the cover body and blowing the drying gas to the outer surface of the cover body.

Description

Cleaning device and cleaning method Technical Field The application relates to the field of semiconductor device manufacturing, in particular to a cleaning device and a cleaning method. Background In the process of processing a substrate, a wet etching or cleaning process is performed on the substrate by using a substrate processing apparatus that processes the substrate by mainly spraying a chemical liquid to the substrate. The substrate processing apparatus includes a nozzle that sprays a chemical liquid onto a substrate. In order to prevent the chemical liquid sprayed onto the substrate from being sputtered, the substrate processing apparatus further includes a cover body provided at an outer periphery of the nozzle, the cover body being for preventing the chemical liquid from being sputtered. After the process is finished, chemical liquid is remained on the cover body and the nozzle, and in the moving process of the nozzle and the cover body, the residual chemical liquid on the cover body and the nozzle drops to corrode parts in the substrate processing device. In order to avoid corrosion of components within the substrate processing apparatus by the residual chemical droplets on the mask and on the nozzles, it is necessary to provide a cleaning apparatus to clean the mask and the nozzles. Disclosure of Invention In view of the above problems, an object of the present application is to provide a cleaning device and a cleaning method for cleaning a nozzle and a cover provided on the outer periphery of the nozzle. In order to achieve the above purpose, the present application provides the following technical solutions: a cleaning device for cleaning a nozzle and a cover body provided on an outer periphery of the nozzle, comprising: A cleaning tank for storing cleaning liquid; The first liquid inlet pipeline is arranged on the cleaning tank and is used for introducing cleaning liquid into the cleaning tank; and the communication pipeline is used for communicating the space above the liquid level of the cleaning liquid in the cover body with the outside of the cleaning tank so as to discharge the air above the liquid level in the cover body to the outside of the cleaning tank. The application also provides a cleaning method, which comprises the following steps: step S01, introducing cleaning liquid into the cleaning tank; and S02, controlling the cover body to descend, and discharging air positioned above the liquid level in the cover body by the communication pipeline in the process of the cover body from the beginning of contacting the cleaning liquid to the descending to a preset position, so that the lower part of the cover body is soaked in the cleaning liquid. Compared with the prior art, the application has the following beneficial effects: The cleaning device provided by the application comprises a cleaning tank, a first liquid inlet pipeline and at least one communication pipeline. The first liquid inlet pipeline is used for introducing cleaning liquid into the cleaning tank, and in the process from the start of contact with the cleaning liquid to the lowering of the cleaning tank to the preset position, the communication pipeline is used for discharging air above the liquid level of the cleaning liquid in the cover body to the outside of the cleaning tank, so that the cover body can be lowered to the preset position, and when the cover body is positioned at the preset position, the cover body is soaked in the cleaning liquid as much as possible, so that the cover body and the nozzle are cleaned. Drawings In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Fig. 1a is a schematic view of a cover of a cleaning device according to a first embodiment of the present application when the cover is at a preset position. Fig. 1b is a partial plan view of a cleaning device according to a first embodiment of the present application when a plurality of communication pipes are provided. Fig. 1c is a schematic view of a cleaning device with an exhaust power source according to a first embodiment of the present application. Fig. 1d is a schematic diagram of a cleaning tank with overflow ports on the side wall of the cleaning tank. Fig. 1e is a schematic diagram of a cleaning device according to a first embodiment of the present application when a second air blowing pipeline is provided. Fig. 2 is a schematic diagram of a cleaning device according to a second embodiment of the application. Fig. 3 is a schematic view of a cleaning device according to a third embodiment of the present application. Fig. 4 is a s