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CN-121988675-A - Process and equipment for processing thick-edge pot body

CN121988675ACN 121988675 ACN121988675 ACN 121988675ACN-121988675-A

Abstract

The invention relates to the field of pot processing equipment, in particular to a process and equipment for processing a thick-sided pot body, comprising the following steps of spinning preparation, namely pressing a wafer substrate on a die, synchronously rotating the wafer substrate along with the die, pressing the edge to be thick, continuously moving the inner surface of an annular concave position inwards after contacting the edge of the wafer substrate, reducing the diameter of the wafer substrate and increasing the thickness of the edge part of the wafer substrate, thin-wall spinning, separating the annular concave position from the edge part of the wafer substrate, spinning a first convex position step along the contour direction of the die, forming a semi-finished product by the wafer substrate, forming a thin wall on the part of the semi-finished product which is subjected to spinning treatment, and stopping a spinning wheel along the contour direction of the die until the part which is not subjected to the treatment is close to the opening edge of the semi-finished product, wherein the part of the semi-finished product which is not subjected to the treatment forms a thick side.

Inventors

  • YANG XIAOZHEN

Assignees

  • 永康市创科机械有限公司

Dates

Publication Date
20260508
Application Date
20231208

Claims (8)

  1. 1. The process for processing the thick-edge pot body is characterized in that a spinning wheel (7) is used for processing a wafer substrate, the spinning wheel (7) comprises a connecting disc (71), an annular concave position (73), a first convex position step (721) and a second convex position step (722), the annular concave position (73) is positioned between the connecting disc (71) and the first convex position step (721), the second convex position step (722) is connected to the first convex position step (721), the outermost diameter of the first convex position step (721) is larger than the outermost diameter of the second convex position step (722), and the process comprises the following steps: spinning preparation, namely compacting the wafer substrate on a die, and synchronously rotating the wafer substrate along with the die; The edge is pressed thick, the direction of the spinning wheel (7) is adjusted until the annular concave position (73) faces the edge of the wafer substrate, the spinning wheel (7) is close to the wafer substrate, the inner surface of the annular concave position (73) contacts the edge of the wafer substrate and then continuously moves inwards, the diameter of the wafer substrate is reduced, and the thickness of the edge part of the wafer substrate is increased; Spinning the thin wall (202), wherein the annular concave position (73) moves outwards and enables the annular concave position (73) and the edge part of the wafer substrate to be separated from each other, and the first convex step (721) presses the wafer substrate and carries out spinning along the outline direction of the die so as to form a semi-finished product; Forming a thick edge (203), and stopping the spinning roller (7) along the contour direction of the die until the position is close to the opening edge of the semi-finished product, wherein the thick edge (203) is formed on the part of the semi-finished product which is not spun by the first boss step (721).
  2. 2. The process for manufacturing a thick-sided pot according to claim 1, further comprising the step of shaping the thick-sided pot (203), and spinning the surface of the thick-sided pot (203) by the first protruding step (721) after the thick-sided pot (203) is initially formed.
  3. 3. A process for manufacturing a thick-sided pot according to claim 1 or 2, characterized in that the two inner sides of the annular recess (73) are parallel to each other, and the distance between the two inner sides of the annular recess (73) is 1.1 to 2.5 times the thickness of the wafer substrate when not pressed.
  4. 4. A spinning apparatus, which is suitable for the process of processing a thick-edged pot body according to any one of claims 1 to 3, characterized in that, The spinning equipment comprises a workbench (1), the workbench (1) is rotationally connected with a main shaft (2), the workbench (1) is provided with a power device for driving the main shaft (2) to rotate, an installation table (3) is fixedly arranged on the main shaft (2), a pot tire (4) is connected on the installation table (3), a base material pressing mechanism is arranged on the workbench (1), the spinning equipment further comprises a fixing plate (8), a movable plate (10) and a positioning plate (5), the fixing plate (8) is fixedly connected with the workbench (1), a first linear module (9) is jointly connected on the fixing plate (8) and the movable plate (10), a second linear module (11) is jointly connected between the movable plate (10) and the positioning plate (5), the positioning plate (5) is rotationally connected with a mounting seat (6), a rotating axis of the mounting seat (6) is transversely arranged, a motor (12) is jointly connected with the positioning seat (12) and is used for driving the motor (12), the rotary press device is characterized in that a first avoidance window (22) and a second avoidance window (23) through which a connecting seat (12) or an adjusting motor (13) passes are respectively arranged on the fixed plate (8) and the movable plate (10), and the rotary press wheel (7) is rotationally connected to the mounting seat (6).
  5. 5. A spinning apparatus according to claim 4, wherein said annular recess (73) has an inner surface which is a cylindrical surface formed around the rotational axis of said spinning roller (7).
  6. 6. The spinning apparatus according to claim 5, wherein a side surface of said first boss step (721) adjacent to said second boss step (722) is a tapered surface, and a portion of said tapered surface adjacent to said second boss step (722) is tapered in diameter.
  7. 7. A spinning apparatus according to claim 5 or 6, wherein an outermost diameter of said first boss step (721) is larger than an outermost diameter of said land (71).
  8. 8. The spinning device according to claim 7, wherein the substrate pressing mechanism comprises a fixing frame (14), fixing columns (15), a movable seat (16), a rotating shaft (17), a pressing plate (18) and an air cylinder (19), the fixing frame (14) and the fixing columns (15) are fixedly connected with the workbench (1), the movable seat (16) is vertically and slidingly connected to the fixing columns (15), the rotating shaft (17) is vertically and rotatably connected to the movable seat (16), the bottom end of the rotating shaft (17) is fixedly connected with the pressing plate (18), the air cylinder (19) is mounted on the fixing frame (14) and the output end of the air cylinder is connected with the movable seat (16), and the power device is a driving motor (20), and the output end of the driving motor (20) is in transmission connection with the spindle (2).

Description

Process and equipment for processing thick-edge pot body Technical Field The invention relates to the field of pot processing equipment, in particular to a process and equipment for processing a thick-edge pot body. Background At present, the spinning processing is mostly used for the forming process from a wafer to a pot body in the pot industry, compared with the stretching process of a press, the spinning processing has the advantages of saving raw materials and being capable of realizing the forming of the pot body which cannot be formed by a common press. The spinning equipment generally extrudes a wafer substrate with a certain thickness onto a rotating pot tire through a spinning wheel and performs thinning and forming, if a thick edge can be processed at the edge of an opening of a pot body, the integral firmness of the pot body after forming can be effectively enhanced, so that the service life and the use experience are effectively prolonged, but when the wafer substrate is processed by the existing spinning processing method, the wafer substrate can only be thinned but cannot be subjected to thickness pressing treatment, and the thick edge can not be processed at the edge of the opening of the pot body after forming, so that the processing mode has certain limitation. Disclosure of Invention In order to solve the problems, the invention provides a process and equipment for processing a thick-edge pot body, and solves the problem that the existing spinning processing method cannot directly process the pot body with the thick-edge shape. The technical scheme adopted by the invention is that the process for processing the thick-edge pot body utilizes a spinning wheel to process a wafer substrate, the spinning wheel comprises a connecting disc, an annular concave position, a first convex position step and a second convex position step, the annular concave position is positioned between the connecting disc and the first convex position step, the second convex position step is connected to the first convex position step, the diameter of the outermost edge of the first convex position step is larger than the diameter of the outermost edge of the second convex position step, and the process comprises the following steps: spinning preparation, namely compacting the wafer substrate on a die, and synchronously rotating the wafer substrate along with the die; The edge is pressed thick, the direction of the spinning wheel is adjusted until the annular concave position faces the edge of the wafer substrate, the spinning wheel is close to the wafer substrate, the inner surface of the annular concave position contacts the edge of the wafer substrate and then continuously moves inwards, the diameter of the wafer substrate is reduced, and the thickness of the edge part of the wafer substrate is increased; Thin-wall spinning, namely, the annular concave position moves outwards and enables the annular concave position and the edge part of the wafer substrate to be separated from each other, and the first convex step presses the wafer substrate and is spun along the contour direction of the die to form a semi-finished product; And forming a thick edge, wherein the spinning wheel is stopped along the contour direction of the die until the spinning wheel is close to the edge of the opening of the semi-finished product, and the thick edge is formed at the part of the semi-finished product which is not spun by the first convex step. Through the technical scheme, the pot body with the thick edge modeling can be stably produced after the production flow of the invention, the steps of the treatment process are few, the production efficiency of the pot body with the thick edge modeling is high, and the thickness of the edge of the wafer substrate is effectively increased when the edge thickness pressing treatment is carried out, so that the thick edge modeling meeting the standard can be conveniently spun subsequently. Further, shaping the thick edge, and spinning the surface of the thick edge by the first convex step after the thick edge is initially formed. Through the technical scheme, the shape of the thick edge is more regular, the surface of the thick edge is smoother, and the whole appearance of the produced pot body is more attractive. Further, the two inner side surfaces of the annular concave position are parallel to each other, and the distance between the two inner side surfaces of the annular concave position is 1.1 times to 2.5 times of the thickness of the wafer substrate when the wafer substrate is not extruded. According to the technical scheme, the distance between the two side surfaces of the annular concave position limits the maximum degree of thickening of the edge part of the wafer substrate, so that the thickness part of the edge part of the thickening treatment of the wafer substrate in the radial direction is more uniform, the follow-up spinning treatment of the spinning wheel is facilitated, the di