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CN-121988859-A - Ultrasonic welding mechanism for chip wire bonding

CN121988859ACN 121988859 ACN121988859 ACN 121988859ACN-121988859-A

Abstract

The invention relates to the technical field of ultrasonic welding and discloses an ultrasonic welding mechanism for chip wire bonding, which comprises a bonding machine, a moving table, a chopper and a wire body, wherein a first reel for winding the wire body is arranged on the inner side of the moving table, a second reel is coaxially arranged at the end part of the first reel, a traction wire is arranged on the outer side of the second reel, a sliding rod is inserted into the inner side of the moving table in a sliding manner, a poking piece is rotatably arranged at the side part of the sliding rod, a groove matched with the wire body is formed at the end part of the poking piece, and the lower end of the traction wire penetrates through the sliding rod and is connected with the poking piece. When the chopper moves upwards, the lead body and the traction wire are released, the sliding rod moves downwards, the poking piece overturns to bend and shape the lead body, the sliding rod pulls down the piston to enable negative pressure to be formed in the cylinder, the poking piece sweeps the end part of the chopper to suck adhered scraps into the cylinder, when the second bonding point is welded, the traction wire is wound to pull and reset the poking piece, the sliding rod and the piston, and the scraps are discharged into the collecting box to be cleaned, so that the moving distance of the chopper is shortened, and the welding efficiency is improved.

Inventors

  • LIU SUDONG
  • LU SHISHENG
  • Tang Chuqin
  • LIU GUOXIA

Assignees

  • 东大汇泽(苏州)半导体科技有限公司

Dates

Publication Date
20260508
Application Date
20260302

Claims (10)

  1. 1. The utility model provides an ultrasonic welding mechanism for chip wire bonding, includes bonding machine (100), sets up mobile station (110) of bonding machine (100) lateral part, connects mobile station (110) outside riving knife (120) and set up lead wire body (130) of riving knife (120) inboard, lead wire body (130) run through riving knife (120), wherein mobile station (110) inboard rotates and is provided with first spool (140) that are used for rolling lead wire body (130), first spool (140) tip coaxial is provided with second spool (150), second spool (150) outside is provided with traction wire (160), mobile station (110) inboard slip grafting has slide bar (170), is close to slide bar (170) lateral part rotation of riving knife (120) is provided with plectrum (180), plectrum (180) are used for stirring lead wire body (130), plectrum (180) tip offer with lead wire body (130) cooperation use recess (190), traction wire (160) lower extreme (170) are provided with traction wire (160), and are run through with slide bar (180).
  2. 2. The ultrasonic bonding mechanism for die-bonding according to claim 1, wherein a cutter (131) is movably disposed at the lower side of the movable stage (110), the cutter (131) is disposed at the side of the chopper (120), and the cutter (131) is used for cutting off the lead body (130).
  3. 3. The ultrasonic welding mechanism for die wire bonding according to claim 1, wherein a one-way bearing (151) is mounted at one end of the second reel (150), the one-way bearing (151) is mounted inside the first reel (140), the second reel (150) is attached to an inner ring of the one-way bearing (151), the first reel (140) is attached to an outer ring of the one-way bearing (151), a motor (152) is mounted outside the mobile station (110), and an output shaft of the motor (152) is connected to the second reel (150).
  4. 4. The ultrasonic welding mechanism for die-bonding according to claim 1, wherein a first spring (171) is mounted at the upper end of the sliding rod (170), the upper end of the first spring (171) is connected with the inner wall of the mobile station (110), the lower end of the first spring (171) is connected with the top of the sliding rod (170), limiting blocks (172) are mounted at the outer side of the sliding rod (170), the number of the limiting blocks (172) is set to be a plurality, the limiting blocks (172) are uniformly arranged at the outer side of the sliding rod (170) in a circumferential direction, the limiting blocks (172) are inserted at the inner side of the mobile station (110) in a sliding mode, and the limiting blocks (172) are used for limiting the sliding rod (170) to vertically slide in the mobile station (110).
  5. 5. The ultrasonic welding mechanism for chip wire bonding according to claim 1, wherein a connecting rod (181) is arranged on the outer side of the poking piece (180), the connecting rods (181) are arc-shaped rods, the number of the connecting rods (181) is a plurality, the end parts of the connecting rods (181) are slidably inserted into the side parts of the sliding rods (170), a second spring (182) is sleeved on the outer side of the connecting rods (181), one end of the second spring (182) is connected with the poking piece (180), and the other end of the second spring (182) is connected with the sliding rods (170).
  6. 6. The ultrasonic bonding mechanism for die wire bonding according to claim 5, wherein an air cylinder (200) is mounted on the inner side of the movable table (110), the air cylinder (200) is located between the second reel (150) and the sliding rod (170), a piston (201) is slidably arranged on the inner side of the air cylinder (200), and the piston (201) is matched with the air cylinder (200).
  7. 7. The ultrasonic welding mechanism for chip wire bonding, as set forth in claim 6, characterized in that a first straight rod (202) is installed on the upper side of the piston (201), the first straight rod (202) is slidingly inserted into the top of the cylinder (200), the upper end of the first straight rod (202) is connected with the traction wire (160), a second straight rod (203) is installed on the lower side of the piston (201), the second straight rod (203) is slidingly inserted into the bottom of the cylinder (200), and the lower end of the second straight rod (203) is connected with the traction wire (160).
  8. 8. The ultrasonic welding mechanism for die wire bonding of claim 7, wherein a first one-way valve (210) is mounted at the top of the air cylinder (200), air in the air cylinder (200) is discharged through the first one-way valve (210), a first pipeline (211) is connected to the outlet end of the first one-way valve (210), the first pipeline (211) is communicated with the collecting box, a second one-way valve (212) is further mounted at the top of the air cylinder (200), air enters the air cylinder (200) through the second one-way valve (212), a second pipeline (213) is connected to the inlet end of the second one-way valve (212), and the second pipeline (213) is inserted inside the sliding rod (170).
  9. 9. The ultrasonic welding mechanism for die wire bonding, as set forth in claim 8, characterized in that a cavity (220) is formed inside the pulling piece (180), air holes (221) are formed in the side portion of the pulling piece (180), the number of the air holes (221) is set to be a plurality, the air holes (221) are communicated with the cavity (220), the lower end of the second pipe (213) penetrates through the sliding rod (170) to be connected with the pulling piece (180), the lower end of the second pipe (213) is communicated with the cavity (220), the second pipe (213) is set to be a hose, when the pulling piece (180) is close to the sliding rod (170), the lower end of the second pipe (213) is bent and sealed, and when the pulling piece (180) is turned away relative to the sliding rod (170), the lower end of the second pipe (213) is unfolded and communicated.
  10. 10. The ultrasonic bonding mechanism for die wire bonding according to claim 5, wherein the first spring (171) has a stiffness greater than that of the second spring (182), both the first spring (171) and the second spring (182) are in a compressed state in an initial state, and a repulsive force of the first spring (171) is greater than a frictional resistance between the piston (201) and an inner wall of the cylinder (200).

Description

Ultrasonic welding mechanism for chip wire bonding Technical Field The invention relates to the technical field of ultrasonic welding, in particular to an ultrasonic welding mechanism for chip wire bonding. Background Wire bonding is one of key technologies for connecting a chip bonding pad and a substrate bonding pad through a thin metal wire in chip packaging, so that electrical interconnection is realized, an ultrasonic welding mechanism used in the wire bonding of the chip is core equipment in the field of semiconductor packaging, and the wire bonding with high precision and high reliability is realized through the synergistic effect of ultrasonic vibration and a hot pressing process by being compatible with complex structures such as flip chips, system level packaging and the like. The ultrasonic welding of chip leads is realized by adopting a lead bonding machine in the market, the technical principle is that electric energy is converted into high-frequency vibration of 60-200kHz through a transducer, so that the friction heat is generated between the leads and the surface molecules of a bonding pad, a metal interface is softened, meanwhile, the accurate temperature and pressure of 150-300 ℃ are applied, metal atoms are promoted to be diffused, high-strength metallurgical bonding is formed, the local heating mode avoids the thermal shock of the chip by the traditional hot pressing technology, the bonding pad peeling risk is obviously reduced, and various lead materials such as gold wires, copper wires, silver alloy wires and the like are adapted, and various base materials such as silicon, ceramic, organic base materials and the like can be processed; the ultrasonic bonding process utilizes a chopper to transfer horizontal vibration and downward pressure, so that the lead is rubbed and heated on the surface of the bonding pad to form plastic deformation and remove an oxide layer, the firmness of bonding points is enhanced, no solder balls are needed, the bonding process is suitable for fine-pitch bonding, the cost is low, and the bonding process can be operated at room temperature. At present, the prior art generally adopts a wire bonding machine to realize ultrasonic welding of chip leads, the leads are required to be arranged in a moving table, the leads pass through a riving knife arranged at the bottom of the moving table, the riving knife of the moving table is driven by a moving table to move, the leads are welded at a first bonding point of a chip, then the riving knife is used for releasing the leads and moving the leads to the opposite direction of a second bonding point, the release length of the leads is increased, the leads are bent and shaped, then the leads are moved to the second bonding point for welding, finally the leads are cut off by a cutter arranged at the outer side of the riving knife, and thus, a row of leads with the same shape radian are welded on the chip in order, but the riving knife is required to move to the opposite direction of the second bonding point, the moving distance of the riving knife is increased, and the welding time is prolonged, so that the welding efficiency is easy to be reduced. Disclosure of Invention The invention provides an ultrasonic welding mechanism for chip wire bonding, which can shorten the welding time by shortening the moving distance of a riving knife, so as to improve the welding efficiency as much as possible, and solve the problems that the riving knife needs to move in the opposite direction of a second bonding point and then moves to the second bonding point in the prior art, the moving distance of the riving knife is increased, the welding time is prolonged, and the welding efficiency is easy to be reduced. In order to achieve the above-mentioned purpose, the present disclosure provides an ultrasonic welding mechanism for chip wire bonding, including the bonder, set up the mobile station of bonder lateral part, connect the riving knife in the mobile station outside and set up the inboard lead wire body of riving knife, the lead wire body runs through the riving knife, the mobile station inboard rotates and is provided with and is used for the rolling the first spool of lead wire body, first spool tip coaxial is provided with the second spool, the second spool outside is provided with and pulls the silk, the mobile station inboard slip is pegged graft has the slide bar, is close to the riving knife the slide bar lateral part rotates and is provided with the plectrum, the plectrum is used for stirring the lead wire body, the plectrum tip seted up with the recess that the cooperation of lead wire body was used, pull the silk lower extreme run through the slide bar, just pull the silk lower extreme with the plectrum is connected. Optionally, a cutter is movably arranged at the lower side of the mobile station, the cutter is positioned at the side part of the chopper, and the cutter is used for cutting off the lead body. Optionally, one-wa