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CN-121988868-A - Processing system and processing method

CN121988868ACN 121988868 ACN121988868 ACN 121988868ACN-121988868-A

Abstract

Processing system and processing method for improving convenience and performance of object processing. The processing system includes a frame body accommodating an object, a processing device provided in the frame body to process the object, a measuring device provided in the frame body to measure the object processed by the processing device, and a control device to set processing conditions using a measurement result of the object.

Inventors

  • EGAMI SHIGEKI
  • Rizaki yokosuke

Assignees

  • 株式会社尼康

Dates

Publication Date
20260508
Application Date
20191031
Priority Date
20181031

Claims (12)

  1. 1. A processing system, comprising: Frame body for accommodating objects A processing device provided in the housing and having an irradiation optical system for irradiating the object with an energy beam, and processing the object, and A measuring device provided in the frame for measuring the processing amount of the object processed by the processing device, and A control device for setting a processing condition using the processing amount measured by the measuring device; The control device is provided with a control unit, Before the processing, the measuring device is used for measuring the processing position of the object to obtain a first measuring result, The object is subjected to the processing using the processing device, After the machining, a second measurement result is obtained by measuring a portion of the object to be subjected to the machining using the measuring device, Processing the object using the processing device under the processing conditions, A third measurement result is obtained by measuring the portion to be further processed using the measuring device, and when the processing amount based on the third measurement result is not an appropriate amount, a second processing condition different from the processing condition is set, and the object is processed using the processing device under the second processing condition.
  2. 2. The processing system of claim 1, wherein, The control device obtains the processing amount by using the first measurement result and the second measurement result.
  3. 3. The processing system according to claim 1, further comprising a position changing device that sets a positional relationship between the object and the processing device and the measuring device to a first positional relationship by which the object can be processed by the processing device or a second positional relationship by which the object can be measured by the measuring device.
  4. 4. The processing system of claim 3, wherein, The control device controls the position changing device and the processing device so that the processing device and the object are set in the first positional relationship by using the position changing device, and the object is processed under the set processing condition by using the processing device.
  5. 5. The processing system of claim 3, wherein, The position changing device changes a position of the object with respect to the processing device and the measuring device.
  6. 6. A processing system according to any one of claims 1 to 5, further comprising an object placement device for placing the object in use; the object is kept mounted on the object mounting device between the processing of the object by the processing device and the measurement of the object by the measuring device.
  7. 7. The processing system of claim 6, wherein, In use, measuring the object with the measuring device in a state in which the object has not been processed by the processing device; The object mounting device is maintained to be mounted on the object mounting device from the measurement of the object which has not yet been processed by the measuring device until the processing by the processing device.
  8. 8. The processing system of claim 7, wherein, The object placement device is provided with a movable stage on which the object is placed and which is movable on a stage.
  9. 9. The processing system of claim 7, wherein, The object placement device includes a holding portion that holds the object in use; the object mounting device is movable between a machining execution position at which machining by the machining device is performed and a measurement execution position at which measurement by the measuring device is performed, while the object is held.
  10. 10. The processing system of claim 9, wherein, The holding portion holds the object in the same holding configuration as the holding portion holds the object in at least a part of a machining period during which the machining device machines the object.
  11. 11. The processing system of any of claims 1 to 5, wherein, The processing device is used for removing and processing the object; The processing amount of the object is a removal amount of the object.
  12. 12. A method of processing comprising: Processing an object using a processing device provided in a housing that houses the object and provided with an irradiation optical system that irradiates the object with an energy beam; measuring a processing amount of the object processed by the processing device using a measuring device provided in the housing, and Setting a processing condition including a characteristic of the energy beam using the processing amount measured by the measuring device; The measuring comprises: measuring a machining position of the object using the measuring device before the machining to obtain a first measurement result; performing the processing on the object using the processing device; after the processing, measuring a portion of the object subjected to the processing using the measuring device to obtain a second measurement result, and The processing conditions including characteristics of the energy beam are set based on the second measurement result.

Description

Processing system and processing method Related divisional application The application is a divisional application of an application patent application with the application number 201980070423.1 and the application name of processing system and processing method, which is proposed by 10 and 31 days of 2019. Technical Field The present invention relates to a processing system and a processing method for processing an object, for example. Background Patent document 1 describes a processing apparatus that irradiates an object with laser (laser) light to process the object. In such a technical field related to object processing, improvement in convenience and performance related to object processing is desired. Prior art literature Patent literature Patent document 1 U.S. patent application publication No. 2002/0017509 specification Disclosure of Invention According to a first embodiment, there is provided a processing system including a frame body accommodating an object, a processing device provided in the frame body to process the object, a measuring device provided in the frame body to measure the object, and a control device to set a processing condition using a measurement result obtained by the measuring device. According to a second embodiment, there is provided a processing system including a housing that houses an object, a processing device that is provided in the housing and processes the object, a measuring device that is provided in the housing and measures a processing amount of the object processed by the processing device, and a control device that sets a processing condition using the processing amount measured by the measuring device. According to a third embodiment, there is provided a processing system including an object mounting device for mounting an object, a processing device for processing the object mounted on the object mounting device, a measuring device for measuring the object mounted on the object mounting device, and a control device for setting processing conditions using a measurement result obtained by the measuring device, wherein the object is held in a state mounted on the object mounting device between processing of the object by the processing device and measurement of the object by the measuring device. According to a fourth embodiment, there is provided a processing system including a processing device configured to process an object, a measuring device configured to measure the object, a position changing device configured to set a positional relationship between the object, the processing device, and the measuring device to a first positional relationship in which the object is located at a processing position of the processing device or a second positional relationship in which the object is located at a position that can be measured by the measuring device, and a control device configured to set a processing condition using a measurement result obtained by the measuring device. According to a fifth embodiment, there is provided a processing system including a processing device including an irradiation optical system that irradiates an object with an energy beam, and configured to process the object, and a measuring device configured to measure the object, wherein an irradiation position of the energy beam irradiated from the irradiation optical system onto the object is changeable in at least a first direction, and the processing device and the measuring device are arranged in a second direction intersecting the first direction. According to a sixth embodiment, there is provided a processing method including processing an object using a processing device provided in a housing that houses the object, measuring the object processed by the processing device using a measuring device provided in the housing, and setting a processing condition using a measurement result of the object. According to a seventh embodiment, there is provided a processing method including processing an object using a processing device provided in a housing that houses the object, measuring a processing amount at a processing position of the object processed by the processing device using a measuring device provided in the housing, and setting a processing condition using the processing amount measured by the measuring device. According to an eighth embodiment, there is provided a processing method including placing an object on an object placement device, processing the object placed on the object placement device, measuring the object that has been processed and placed on the object placement device, and setting processing conditions using a measurement result of the object, the object being held in a state of being placed on the object placement device between the processing and the measurement of the object. According to a ninth embodiment, there is provided a processing method including processing an object using a processing device, measuring the object processed by the processing device