Search

CN-121988872-A - Laser cutting dust cleaning device for glass wafer processing

CN121988872ACN 121988872 ACN121988872 ACN 121988872ACN-121988872-A

Abstract

The invention relates to the technical field of glass wafer processing, and discloses a laser cutting dust cleaning device for glass wafer processing, which comprises a dust spraying component arranged in laser cutting equipment, wherein the dust spraying component is arranged around a laser cutting head, a dust sucking component is arranged in the laser cutting equipment, the dust sucking component is arranged around the laser cutting head, the dust sucking component is positioned below the dust spraying component, and the dust spraying component arranged around the cutting head and the dust sucking component positioned below the dust spraying component work cooperatively, so that the dust in the cutting groove can be quickly blown away by utilizing the airflow sprayed in a specific direction at the first time of generating the dust in the laser cutting, and the blown dust can be accurately sucked into the dust collecting cover at the opposite side by means of the vacuum suction of synchronous work, thereby realizing 'instant production and instant cleaning'.

Inventors

  • DU TAO
  • YAN LINGLING
  • JIANG WEIHUA
  • XU SHUXIANG

Assignees

  • 南通欧雷德智能科技有限公司

Dates

Publication Date
20260508
Application Date
20260401

Claims (10)

  1. 1. The laser cutting dust cleaning device for processing the glass wafer comprises a dust spraying component (1) arranged in laser cutting equipment, and is characterized in that the dust spraying component (1) is arranged around a laser cutting head, a dust sucking component (2) is arranged in the laser cutting equipment, the dust sucking component (2) surrounds the laser cutting head, and the dust sucking component (2) is positioned below the dust spraying component (1); the inside of laser cutting equipment is provided with secondary clearance subassembly (3), secondary clearance subassembly (3) are located one side of laser cutting head.
  2. 2. The laser cutting dust cleaning device for glass wafer processing is characterized in that the dust spraying component (1) comprises a fixing plate (101) fixedly connected to one side of a laser cutting head through bolts, a ring-shaped pipe (102) is arranged below the fixing plate (101), the ring-shaped pipe (102) is fixedly connected with the fixing plate (101) through bolts through clamps, four air spray heads (103) are uniformly connected to the inner side of the ring-shaped pipe (102) through air pipes, a nozzle (105) is fixedly connected to one side, close to the laser cutting head, of each air spray head (103), the nozzle (105) surrounds the periphery of the laser cutting head, and a first electromagnetic valve (104) is arranged on the surface of each air pipe.
  3. 3. The laser cutting dust cleaning apparatus for glass wafer processing of claim 2, wherein the nozzle (105) is disposed obliquely, a lowest end of the nozzle (105) is a spraying end, and a spraying direction of the nozzle (105) intersects with a laser of the laser cutting head and a contact end of the glass wafer.
  4. 4. The laser cutting dust cleaning apparatus for glass wafer processing as set forth in claim 2, wherein the nozzle (105) has a standard circular cross section for uniform gas flow velocity distribution toward the cutting position.
  5. 5. The laser cutting dust cleaning apparatus for glass wafer processing as set forth in claim 2, wherein the nozzle (105) has a hollow V-shaped cross section for collecting gas at the cutting slit during spraying.
  6. 6. The laser cutting dust cleaning device for glass wafer processing of claim 2, wherein two guide rails (109) are symmetrically and fixedly connected to the inner wall of one side of the laser cutting device through bolts, a linkage plate (110) is slidably connected to the surface of the guide rails (109), a first connecting pipe (107) is fixedly connected to one side of the annular pipe (102), the first connecting pipe (107) is located above the linkage plate (110), the fixing plate (101) is fixedly connected with the first connecting pipe (107) through a connecting plate (108), and an air pump (106) is installed at one end, far away from the annular pipe (102), of the first connecting pipe (107).
  7. 7. The laser cutting dust cleaning device for glass wafer processing of claim 6, wherein the dust sucking and separating assembly (2) comprises four dust guide pipes (201) arranged in the laser cutting device, each dust guide pipe (201) is connected with the annular pipe (102) through a clamp, a second electromagnetic valve (206) is arranged on the surface of each dust guide pipe (201), a dust collecting cover (202) is fixedly connected to one end of each dust guide pipe (201), the dust collecting cover (202) is positioned below the air nozzle (103), the dust collecting cover (202) is obliquely arranged, the top surface of the linkage plate (110) is fixedly connected with a dust collecting shell (203) through a bolt, one end of each dust collecting pipe (201) is fixedly connected with a second connecting pipe (207) through a clamp, one end of each dust collecting shell (203) far away from the dust guide pipe (201) is fixedly connected with a second connecting pipe (205), the cutting device (205) is provided with a dust collecting box (204), the dust collecting box (204) is arranged on the same side, and the dust collecting box (204) is vertically arranged on the side of the four connecting pipes (105), and the spraying direction of the nozzle (105) is consistent with the receiving direction of the opposite dust-collecting cover (202).
  8. 8. The laser cutting dust cleaning device for glass wafer processing of claim 1, wherein the surface of the laser cutting head is fixedly connected with a dust shield (4) through a bolt, and the rapidly splashed dust is shielded and limited.
  9. 9. The laser cutting dust cleaning device for glass wafer processing of claim 1, wherein the secondary cleaning assembly (3) comprises a supporting plate (301) fixedly connected to the inside of the laser cutting device through bolts, a second vacuum pump (303) is installed on the top surface of the supporting plate (301), a hose (302) is fixedly connected to the output end of the second vacuum pump (303) through a flange, a dust passing pipe (304) is installed at one end of the hose (302) through a flange, a dust collecting cover (305) is fixedly connected to one end of the dust passing pipe (304), a gasket (306) is fixedly connected to the bottom end of the dust collecting cover (305), an electric push rod (307) is fixedly connected to the bottom surface of the supporting plate (301) through bolts, a filter screen (310) is fixedly connected to the inside of the dust passing pipe (304), and the filter screen (310) is located between the hose (302) and the dust passing pipe (304).
  10. 10. The laser cutting dust cleaning apparatus for glass wafer processing of claim 9, wherein one side of the dust passing pipe (304) is fixedly connected with a dust entering pipe (308), a dust collecting box (309) is fixedly connected to the surface of the dust entering pipe (308), one end, far away from the dust passing pipe (304), of the dust entering pipe (308) is rotatably connected with a one-way plate (311) through a hinge, the one-way plate (311) is mutually attached to a port of the dust entering pipe (308), a baffle (312) is fixedly connected to a port of the dust entering pipe (308), and the baffle (312) is used for limiting a rotating angle of the one-way plate (311).

Description

Laser cutting dust cleaning device for glass wafer processing Technical Field The invention relates to the technical field of glass wafer processing, in particular to a laser cutting dust cleaning device for glass wafer processing. Background With the rapid development of advanced manufacturing fields such as semiconductors, microelectronics, optoelectronics, and MEMS (micro electro mechanical systems), glass wafers (e.g., quartz glass, borosilicate glass, sapphire wafer, etc.) are used as a key base material, and the precision processing demands thereof are increasing. The laser cutting technology has become one of the main processes of glass wafer dicing and cutting because of the remarkable advantages of non-contact, high precision, high flexibility, good quality of cutting edges and the like, however, in the laser cutting process, when high-energy laser beams act on glass materials, the high-energy laser beams can be instantaneously gasified, melted and resolidified to generate a large amount of micro-scale or nano-scale superfine dust and chips. However, the existing cleaning mode is to send the whole wafer into an independent wet cleaning station after cutting is completed, and the mode is effective as a post-treatment, but cannot solve the problem of real-time pollution in the processing process, and lacks a solution capable of synchronously, online, accurately and efficiently removing dust with the laser cutting process. Disclosure of Invention In order to overcome the defects in the prior art, the invention provides a laser cutting dust cleaning device for glass wafer processing, which aims to solve the problem of real-time pollution in the processing process in the prior art. The invention provides a technical scheme that the laser cutting dust cleaning device for glass wafer processing comprises a dust spraying component arranged in laser cutting equipment, wherein the dust spraying component is arranged around a laser cutting head, a dust sucking component is arranged in the laser cutting equipment, the dust sucking component is arranged around the laser cutting head, the dust sucking component is positioned below the dust spraying component, a secondary cleaning component is arranged in the laser cutting equipment, and the secondary cleaning component is positioned on one side of the laser cutting head. As a further scheme of the invention, the dust spraying component comprises a fixed plate fixedly connected to one side of the laser cutting head through bolts, a ring-shaped pipe is arranged below the fixed plate and fixedly connected with the fixed plate through bolts through a clamp, four air spray heads are uniformly connected to the inner side of the ring-shaped pipe through air pipes, a nozzle is fixedly connected to one side, close to the laser cutting head, of each air spray head, the nozzle surrounds the periphery of the laser cutting head, and a first electromagnetic valve is arranged on the surface of each air pipe. As a further scheme of the invention, the nozzles are obliquely arranged, the lowest end of each nozzle is a spraying end, and the spraying direction of each nozzle is intersected with the contact end of the laser cutting head, which is used for laser and the glass wafer. As a further scheme of the invention, the cross section of the nozzle is a standard circular ring shape, and the nozzle is used for uniformly distributing the gas flow velocity of the gas sprayed to the cutting position. As a further aspect of the present invention, the cross section of the nozzle is a hollow V-shaped structure, so that the gas is more concentrated at the cutting seam during spraying. As a further scheme of the invention, two guide rails are symmetrically and fixedly connected to the inner wall of one side of the laser cutting device through bolts, the surfaces of the guide rails are slidably connected with a linkage plate through a sliding block, a first connecting pipe is fixedly connected to one side of the annular pipe and positioned above the linkage plate, the fixing plate is fixedly connected with the first connecting pipe through a connecting plate, and an air pump is arranged at one end of the first connecting pipe far away from the annular pipe. As a further scheme of the invention, the dust sucking component comprises four dust guide pipes arranged in laser cutting equipment, each dust guide pipe is connected with the annular pipe through a clamp, a second electromagnetic valve is arranged on the surface of each dust guide pipe, one end of each dust guide pipe is fixedly connected with a dust collecting cover, the dust collecting cover is positioned below the air nozzle, the dust collecting covers are obliquely arranged, the top surface of the linkage plate is fixedly connected with a dust collecting shell through bolts, one ends of the four dust guide pipes are connected with the dust collecting shell, one end of the dust collecting shell, which is far away from the dust guide